TOFHIR2B Introduction: status and plans of - TOFHIR2B review, 31 March 2021 J. Varela, LIP Lisbon - CERN Indico
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Introduction: status and plans of TOFHIR2B J. Varela, LIP Lisbon TOFHIR2B review, 31 March 2021
TOFHIR frontend chip • Frontend chip of the CMS MIP Timing Detector (barrel) • Barrel timing: LYSO crystal bars readout by SiPMs in both ends Design of the CMS Mip Timing Detector (MTD) BARREL Surface ~ 40 m² Number of channels ~ 332k Radiation level ~ 2x1014 neq/cm² Sensors: LYSO crystals + SiPMs ENDCAPS Surface ~ 15 m² Number of channels ~ 4000k Radiation level ~ 2x1015 neq/cm² Sensors: Low gain avalanche diodes ● Thin layer between tracker and calorimeters ● MIP sensitivity with time resolution of 30-50 ps 6 ● Hermetic coverage for |η|
TOFHIR2 prototyping • TOFHIR2A Digital Power Power Digital Power Power pad pad pad pad pad pad – tests started in 15 July 2020 Input Digital Channel 31 • TOFHIR2X pad … pad – improved DCR cancelation and current Input pad Channel 16 Digital pad discriminator Global Global service blocks controller – submission December 2020 Input Digital Channel 15 pad … pad • TOFHIR2B Input Digital Channel 0 – revised baseline holder pad pad – improved SEE protection Power Power Power Power Digital Digital pad pad pad pad pad pad • TMR protection of clock tree – MPW submission Aug 2021 TOFHIR 2A • Chip dimensions: o 8.5 x 5.2 mm2 • BGA packaging under development (IMEC) TOFHIR2B review, 31/03/2021, J. Varela Introduction 3
TOFHIR2 reviews – TOFHIR2A (12” fab 14) • full chip, complete functionality • review of schematics June 2019; submission Feb 2020; tests started July 2020 • test results presented today – TOFHIR2X (12” fab 14) • improved DCR cancellation: revised amplifier; current mode discriminator • additions in digital logic • schematics design reviewed June 2020 • opportunistic submission December 2020; chips expected April 2021 – TOFHIR2B (8” fab 6) • today’s review • revised baseline holder and TMR protection of SEE transients • submission foreseen August 2021 • final submission before production (2022) TOFHIR2B review, 31/03/2021, J. Varela Introduction 4
Objectives of this review • Evaluation of results of tests with TOFHIR2A – intrinsic performance – tests with SiPMs and laser pulses – radiation tests • Evaluation of modifications introduced after review of June 2020 • Evaluation of TOFHIR2 layout • Evaluation of digital design and SEE protection TOFHIR2B review, 31/03/2021, J. Varela Introduction 5
Introductory material TOFHIR2B review, 31/03/2021, J. Varela Introduction 6
Front-end requirements • MIP signal – Average light signal: 10-6 k p.e. – MIP rate: 2.5 M hit/s/channel • Timing measurement – Timing given by the arrival of the first ~50 p.e. – Electronics jitter ~ 20 ps • Amplitude measurement – Charge integration and ToT – Accuracy
Detector module Features: • FE board processes signals from 64 ALDO2 channels • Short SiPM flex connections TOFHIR2 TOFHIR2 • Two TOFHIR2 and two ALDO2 ASICs ALDO2 101.5 x 52.0 mm FE board Module housing (DC ground) (earth ground) 1.5mm Spacers Soft spacers M2 threaded inserts TOFHIR2B review, 31/03/2021, J. Varela Introduction 8
TOFHIR2 channel Features: Challenges: – Branches: T, E and Q – Minimize the impact of DCR noise and pileup on time – Three leading edge discriminators resolution – Two TACs, one QAC sharing 40 MHz – Cope with high rate SAR ADC – Handle the variation of dynamic range along detector – Trigger logic lifetime TOFHIR2 characteristics Number of channels 32 noise filter T discri T1 Technology CMOS 130nm SiPM Voltage supply 1.2 V Trigger logic Reference voltage Internal postamp T discri T2 Radiation tolerance Yes DCR noise filter Yes noise filter E Number of analog buffers 8 discri E TDC bin (ps) 10 preamp 10-bit SAR ADC (MHz) 40 postamp E I/O links CLPS L1, L0 Trigger Yes, Yes noise filter Q Maximum MIP rate/ch (MHz) 2.5 QAC TAC T1 TAC T2 Max low E rate/ch (MHz) 5 ADC Clock frequency (MHz) 160 TOFHIR2B review, 31/03/2021, J. Varela Introduction 9
Operation conditions • Radiation has a big impact on the SiPM performance id K • Strong increase of dark count rate (DCR) Cq Rq Cq Rq id • Decrease of PDE Vbr Cg • SiPM gain is adjusted to limit power dissipation Rd Cd Cd N-1 in SiPMs A Parameters along BTL life: HPK HDR2 Integrated Number of p.e. SiPM gain DCR luminosity (GHz) (fb-1) Cd 14.6 fF Cq 1 fF 0 9500 3.8 × 105 1 (MHz) Cgrid 36 pF 500 9000 2.9 × 105 20 Rq 500 kΩ 1000 8000 2.5 × 105 30 Rd 1kΩ 2000 7000 1.9 × 105 45 Ncells 40,000 3000 6000 1.5 × 105 55 TOFHIR2B review, 31/03/2021, J. Varela Introduction 10
DCR noise cancellation Method: Simulation of time resolution: • Inverted and delayed current pulse is added to – TOFHIR2X the original pulse – End of Life conditions – Short output pulse • Dark Count Rare: 55 GHz – Noise and baseline fluctuations are mitigated • Double readout of LYSO bar Input current • MIP pulses with 6000 p.e. • SiPM gain: 1.5105 SiPM output DCR module current output current Cancellation currents Slew rate (A/ms) 135.9 9.93 Noise r.m.s (A) 2.45e-5 5.12e-7 Output current noise/ SR (ps) 180 52 Time resolution is improved by a factor 3.5 TOFHIR2A - 1st version of DCR cancellation: 90 ps at EoL (TDR conditions) TOFHIR2X/B - Improved DCR cancellation and new current discriminator: 65 ps at EoL TOFHIR2B review, 31/03/2021, J. Varela Introduction 11
TOFHIR2 characterization setup • TOFHIR2 Test Board – Two TOFHIR2 and ALDO2 (LV/BV regulator) – SiPM input connectors – Access to probing pads in TOFHIR2 TOFHIR2 – Access to data with DAQ system TOFHIR2 ALDO2 • Picosecond laser • Blue LED emulating DCR noise Blue LED TOFHiR 2A (dark count emulation) Test Board Global service block Current reference Beam Pad BG calibration DAC DAC DAC DAC DAC Pad ALDO A Vref Current mirror array Pad ALDO B Test pulse 32 Common Baseline Baseline Baseline mode ( Colimated pulsed laser Auxilliary signals multiplexer Probing Pre- Post- Discrimin TACs QACs SAR (~56 ps width) (not present in CC v1) Pad amp amp ators ADC Channel 15 TOFHIR2B review, 31/03/2021, J. Varela Introduction 12
Radiation tests • TID tests done at the x-ray irradiation facility at CERN • Tests of Single Event Effects (SEE) were performed at Heavy Ion Facility (HIF) Louvain- la-Neuve TOFHIR2B review, 31/03/2021, J. Varela Introduction 13
Tests in proton beam • Test beam at PSI in March 2021 • Two detector modules in the beam • Data looks good • Detailed analysis in on-going TOFHIR2B review, 31/03/2021, J. Varela Introduction 14
System tests with TOFHIR1 • Tests with two Readout Units – FE boards, Concentrator Card, Power Converter Cards • Time resolution between channels in different ASICs on different FE boards comparable to the performance in the ASIC test system • Powering, biasing and grounding schemes are validated CC Setup with CC+DAQ PC readout C TOFHIR2B review, 31/03/2021, J. Varela Introduction 15
BTL electronics schedule ASICs RU v2 ASICs and validated validated board production 2018 2019 2020 2021 2022 2023 BTL ELECTRONICS TIMELINE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Prototyping TOFHIR1 design fab test ALDO1 fab RUproto1 design fab test TOFHIR2A design fab test beam test TOFHIR2X design fab test TOFHIR2B design fab test ALDO2 design fab test rad test RAFAEL design fab test RUproto2 design fab ASIC Production TOFHIR2 wafer packg test ALDO2 wafer packg test RAFAEL wafer test Board Production FE board pcb assembling test assembling test CC and PCC pcb assembling test TOFHIR2B review, 31/03/2021, J. Varela Introduction 16
Agenda TOFHIR2B review, 31/03/2021, J. Varela Introduction 17
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