The Perspective of China SOI Ecosystem - Jeffrey Wang CEO Simgui Technology World Semiconductor Conference Nanjing May 18, 2019
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The Perspective of China SOI Ecosystem Jeffrey Wang CEO Simgui Technology World Semiconductor Conference ∙ Nanjing ∙ May 18, 2019
China Smart Phone Market China Smart Phone Sales 2017 China Smart Phone Market 600 160% Million Unit 124% 128% 478 140% - 20 40 60 80 100 120 500 459 111% 431 120% 422 Huawei 102 400 364 100% OPPO 78 Million Unit 88% vivo 72 80% 300 Apple 51 48% 60% MI 51 194 Meizu 17 200 40% Gionee 15 16% 20% 85 2% 11% Samsung 11 100 38 0% Lephone 5 18 -4% Lenovo 2 - -20% Other 46 2009 2010 2011 2012 2013 2014 2015 2016 2017 Smart phone sales (million) Growth Rate % Smart phone sales (million) • China smart phone market reaches to 459 million • In 2017, Domestic smart phone suppliers counts units in 2017. However, growth rate becomes for 86% of China market. negative for the first time in 9 years. • Among them, Huawei, Oppo and Vivo are top three • China counts for 30% of worldwide market. suppliers and count for 56% of the China market. 3 Simgui Technology
5G Network Architecture-A High Level View Self-Service Agile Operation China is Motivated to C.Setup 5G Unified Database Network Management User Carrier Rapid fault recovery is required for • Users want more speed. • OPEX reduction should be a network data status information (such as strategic priority for 5G. • 4G networks are hard- user data and policy data shared across pressed to meet current • centers), data CAPEXtoas a percentage meet of network reliability user demand. carrier after requirements revenue has declined the virtualization of fromThe17% functions. to 12% traditional in last disaster recovery • In other words, users want 5G Network Architecture-A High Level View decade. mechanism based on N+1 backup relies on to consume more, but experience and speeds are private • signalingasinteraction OPEX to implement a percentage of falling short of expectations. status information synchronization, which producescarrier systemrevenue inefficiencyhas andrisen complex A. Multi-Connectivity Is Key to High Speed and Reliability interaction of cross-vendor products. One of the targets and driving forces of network architecture evolution from 62% to 75%. is to provide diversified services using mobile networks. E2E network slicing is a fundamental technology to achieve this target. In the 5G era, a network will With separated data and control logic, network status information can be centralized contain multiple logically separated network slices. Each slice has a specific in a unified database. All network functions can Government access metadata models through standard network topology, network function, and resource allocation model. If manual 5G Network (sub 6GHz) configuration is still used for network planning and deployment, operators' O&M interfaces and locally store dynamic user data. Thanks to the distributed database • synchronization, network status information can •implement Strong support backuptobetween develop system will potentially face a huge number of significant challenges. 5G networks will possess self-serving agile operation capabilities. Network 5G builds on 4G and real-time data slicing services can be automatically generated, maintained, or terminated expands its potential. 5G network with the aim centers. With the help of the service management framework, the unified database simplifies to according to services requirements, which significantly reduces subsequent operating expenses. Third-party vertical industries can input mobile network • The R15 standard focuses stimulate the procedure for network information retrieval functions introducedGDP growth by the in component- slicing requirements on an operation platform. The operator analyzes customer requirements based on current network status. on commercial needs for China. based control plane to reduce the required signaling overhead for data synchronization. After a service level agreement procedure is complete, the operator maps enhanced mobile broadband • Total expected investment is (eMBB). It also meets basic RMB 1.14 trillion (US$ 170 Big Data needs for uRLLC and User Data billion). Analytics Subscriber/policy Data Context/network Data Multi-connectivity is gaining a required to produce high bandwidth. mMTC. 17 DB reputation as an underlying fundamental An LTE network access is required to Policy data construct for the deployment of the maintain continuity after a user has future network architecture. CloudRAN accessed a 5G high-frequency small cell. can be seamlessly deployed in a unified In scenarios that source multiple 4 Simgui Technology network architecture. This is a huge leap technologies, CloudRAN serves IP network
5G – High Speed, Low Latency and High Density (Enhanced Mobile Broadband ) (massive Machine Type (Ultra-Reliable and Low- Communication) Latency Communication) 5 Simgui Technology
• China Mobile Plan – Large Scale Trial in 12 Cities and Perform the large-scale trial in 5 cities (Shanghai, Hangzhou, Suzhou, Guangzhou, Wuhan) and the 5G typical application Commercial showcase in another 12 cities 5G Network by 2020 to facilitate the 5G commercialization Beijing Shenyang Tianjin Shanghai Zhengzhou Xiong’an Smart Smart Smart Robot 4K Live Hangzhou Healthcare Campus Manufacturer Lanzhou Suzhou Chongqing Wuhan Livelihood service Cloud Smart Grid UAV Chengdu Nanchang Social Gaming transportation management Nanning Guangzhou Fuzhou Shenzhen Source: China Mobile 20 6 Simgui Technology
China RF-SOI Supply Chain for 4G/5G Application System SOI Material SOI Foundry Design Service RF Component Handset Maker Designer EDA Enablement on RF- and FD-SOI Feng Ling, Ph.D. Founder and CEO …… 8 Simgui Technology
Smart Phone System Designer • HiSilicon is a global fabless semiconductor and IC design company which is dedicated to comprehensive connectivity and multimedia chipset solutions. • Kirin chip solution is the industry‘s leading intelligent mobile phone chip solutions. • HiSilicon will launch a 5G-ready Kirin chip in 2019 (Former Spreadtrum and RDA) • As a core subsidiary of Tsinghua Unigroup, UNISOC is a leading fabless semiconductor company committed to the independent R&D of core chipsets in mobile communications and IoT. Its products cover mobile chipset platforms supporting 2G / 3G / 4G/5G communication standards. • UNISOC is dedicated to becoming the top 3 mobile baseband chipsets supplier in terms of global market share, and the largest pan-chip supplier in China with leading 5G technology. 8 Simgui Technology
2017 Top 10 IC Design/System Company: HiSilicon and Spreadtrum Among the List USD million 2017E 2017/2016 Company Headquarter 2016 2017E Rank % Change 1 Qualcomm US 15,414 17,078 11% 2 Broadcom Singapore 13,846 16,065 16% 3 Nvidia US 6,389 9,228 44% 4 MediaTek Taiwan 8,809 7,875 -11% 5 Apple US 6,493 6,660 3% 6 AMD US 4,272 5,249 23% 7 HiSilicon China 3,910 4,715 21% 8 Xilinx US 2,311 2,475 7% 9 Marvell US 2,407 2,390 -1% Unisoc 10 China 1,880 2,050 9% (Spreadtrum and RDA) - Top 10 Total - 65,731 73,785 12% - Other - 24,694 26,825 9% - Total Fabless/System - 90,425 100,610 11% • Two Chinese companies, HiSilicon and Unisoc (Spreadtrum and RDA), are among the top 10 fabless IC sales leaders. Source: IC Insight 9 Simgui Technology
Component Design Company for RF FEM • RDA Microelectronics is a fabless semiconductor company • Smartermicro is a fabless semiconductor company that that designs, develops and markets wireless systems-on- designs, develops and provides MMIC, RF and Analog IC. chip and radio-frequency semiconductors for cellular, connectivity, and broadcast applications. • The Company's product portfolio currently includes Gain block, GPA, Switch, Power Amplifier, Mixer, and etc. • RF FEM products include radio-frequency front end modules, power amplifiers, etc. • HunterSun is focused on the development of RF integrated • Vanchip is focused on design and development of RF circuit chips, analog integrated circuit chips, and System-on- power amplifier for smart phone application. Chip. • Its product includes 2G/3G/4G power amplifier for handset • The product portfolio currently includes wireless and other smart mobile devices. communications chips, power management chips, RF front- end modules, etc. 11 Simgui Technology
RF-SOI Foundries • SMIC is one of the leading foundries in the world, and the largest foundry in China. • It provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer that include logic, mixed-signal/RF CMOS, high voltage, SoC, flash, EEPROM, CIS and LCoS micro-display technology. • HHGrace provides professional and highly value-added foundry services covering technology solutions from 1.0μm to 90nm process nodes. • It focuses on advanced and differentiated technologies including eNVM (embedded Non-Volatile Memory), power management IC, power discrete, RF (Radio Frequency), as well as standard logic and mixed-signal. • Ningbo Semiconductor International (NSI) focuses analog and specialty semiconductor technology platforms in the areas of high-voltage analog, radio frequency, and optoelectronics. • It includes RFSOI and extended silicon-based solution for 5G RF front-end components and system integration. 12 Simgui Technology
What is the Status of FD-SOI Ecosystem in China? 12
Fully Depleted FD-SOI FD-SOI is an alternative solution at 28nm and below. Source: Leti 13 Simgui Technology
28nm FD-SOI FD-SOITechnology by ST, Samsung and GF Platform from STMicroelectronics ology roelectronics Power and energy efficiency Ultra low leakage, wide Body-Bias & operating voltage range Analog performance 22FDX ® for mixed signal & RF design 22nm FD-SOI Technology Robustness energy efficiency for mission critical applications Highlights 22nm FD-SOI technology GLOBALFOUNDRIES 22FDX® 22nm FD-SOI (Fully-Depleted Silicon-On- Insulator) process technology platform delivers cost effective performance wide Body-Bias & operating voltage range for connected and low power embedded applications. Cost effective platform + Manufactured in state-of-the-art fab in Dresden, Germany; Upcoming 22nm FD-SOI transistor technology delivers FinFET-like performance and ormance second source qualification + Includes ultra-low-power with energy-efficiency, including up to 70% lower power vs. 28nm. The simulta- neous high Ft /high Fmax, high self gain and high current efficiency of 22FDX 28nm FD-SOI Technology 0.4V operation RF design + Transistor back-gate biasing enables efficient, ultra low power analog/RF/mmWave designs. for enhanced performance, and Platform from STMicroelectronics lower power and reduced area + World-class Fmax; Unique FET FD-SOI – Fully-Depleted applications stacking for high-Pout/high-PAE Silicon-On-Insulator Standard Cells mmWave PA and switches; – Planar process Lowest power mmWave LNA Fully Depleted ve platform similar to bulk + Bulk-like self-heating effect Ultra-thin Channel Power and energy efficiency for Low Leakage Ultra low leakage, wide Body-Bias & operating voltage range + Superior radiation immunity with >30x/1000x lower SCU/MCU SER Thin Buried Analog performance Oxide Insulator for mixed signal & RF design + Integrated RF and mmWave SoC for 5G architectural innovation and Robustness reduced system cost ST, Samsung and GFplatform have Multiple setup FD-SOI platforms for MCU, IoT, Targetconsumer andSolutions automotive. for mission critical applications Low power embedded applications Cost effective Architectures Applications and Platform + Automotive (ADAS, IVI) + IoT, Wearables Automotive Multiple Channel length + Networking and WiFi 5G, LTE and IoT / Wearables Mid/low-tier mmWave Radar, IPs 802.11ac/ax/ad Apps Processor MCU, ADAS (Poly-Biasing) options + 5G:
China IC Design: CAGR 29% (2004-2017) China IC Design Growth 40.0 35.0 32.9 30.0 26.1 25.0 USD Billion 21.0 20.0 15.6 15.0 12.8 9.9 10.8 10.0 8.7 5.4 6.0 3.7 4.4 5.0 2.4 1.3 0.0 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 Source: CSIA In 2017 worldwide fabless sales is around $100 billions and Chinese fabless company counts for 33%. 15 Simgui Technology
IC Design Enterprises in China 2015-2020 IC Design Enterprises in China Stimulative Policy 1600 1400 13621380 1200 2000-2014 Open Door Policy 1000 800 736 681 1990-1999 583 600 502 518 Close Door Policy 463 471 479 488 491 483 472 485 389 400 200 200 98 56 62 76 15 17 20 23 27 32 41 0 Source: PWC 16 Simgui Technology
New 300mm Fab Activities in China China 's Semiconductor Fabs Province New 12” Fab No Company City Activity 1 Beijing SMIC B3 28-14nm n, B3 under 2-inch lines; 2 SMIC 28-14nm gbo one 8- Shanghai 3 Huali 28-14nm YMTC) 4 Wuxi Huali 65-45nm ND & NOR 5 Wuhan YMTC NAND and NOR houpu; o NAND 6 Hefei Nexchip 150-55nm oduction in 7 Fujian Jinhua 12” memory er 8 Nanjing TSMC 14nm and blew 17; 9 Xiamen UMC 12” line oundation, 12” line convert 10 Dalian Intel fab NAND Global 11 Chengdu 22nm FDX Foundries 12” power 12 Chongqing AOS management Source: SEMI 27 17 Simgui Technology
SMIC Technology Portfolio – Focus on FinFET Advanced & Mature Logic Specialty Technology Source: SMIC SMIC focuses on advanced logic and expands to 14nm FinFET. FDSOI is not in their roadmap. 18 Simgui Technology
China FD-SOI Ecosystem MCU IoT Product & Consumer Application Automotive Foundry China SOI (planned) Chengdu (planned) FD-SOI Wafer 22FDX® 22nm FD-SOI Technology Highlights • 22nm FD-SOI technology China FD-SOI ecosystem is under + Manufactured in state-of-the-art fab GLOBALFOUNDRIES 22FDX® 22nm FD-SOI (Fully-Depleted Silicon-On- Insulator) process technology platform delivers cost effective performance for connected and low power embedded applications. EDA Enablement on RF- and FD-SOI in Dresden, Germany; Upcoming second source qualification + Includes ultra-low-power with development. The key areas are 22nm FD-SOI transistor technology delivers FinFET-like performance and energy-efficiency, including up to 70% lower power vs. 28nm. The simulta- neous high Ft /high Fmax, high self gain and high current efficiency of 22FDX foundry and IP. It requires support 0.4V operation IP enables efficient, ultra low power analog/RF/mmWave designs. + Transistor back-gate biasing for enhanced performance, and lower power and reduced area FD-SOI Feng Ling, Ph.D. + World-class Fmax; Unique FET mmWave PA and switches; from whole supply chain. stacking for high-Pout/high-PAE – Fully-Depleted Silicon-On-Insulator – Planar process Founder and CEO Lowest power mmWave LNA similar to bulk Fully Depleted + Bulk-like self-heating effect Ultra-thin Channel for Low Leakage + Superior radiation immunity with >30x/1000x lower SCU/MCU SER Thin Buried Oxide Insulator + Integrated RF and mmWave SoC for 5G architectural innovation and reduced system cost Low power embedded applications + + Automotive (ADAS, IVI) IoT, Wearables Target Applications and Platform Solutions 5G, LTE and Mid/low-tier Automotive 19 Simgui Technology + Networking and WiFi IoT / Wearables mmWave Radar, 802.11ac/ax/ad Apps Processor + 5G:
Simgui Plans to Expand Manufacturing Facility for 300mm FD-SOI and RF-SOI Wafer 8” SOI Fab (Production) Phase 1 Phase 2 12” SOI Fab (Planned) • 300mm Fab building is completed. Total planned capacity is 800K per year. 20 Simgui Technology
Summary • China is aggressively working on 5G. China Mobile will be ready for commercial 5G network in 2020. • RF-SOI supply chain has been setup for 4G/5G in China. But it is not balanced. It is strong on handset and system design but weak on component design and wafer foundry. • FD-SOI ecosystem is under development in China. The key areas are foundry and IP. It requires support from whole supply chain. • Simgui plans to expand manufacturing facility for 300mm FD-SOI and RF-SOI wafer. 21 Simgui Technology
For more information Contact: Jeffreywang@simgui.com.cn 22 Simgui Technology
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