Intégration 3D pour les - datacenters haute performance - IRT Nanoelec
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From Technologies to Market
Intégration 3D
pour les
datacenters haute
performance
IRT Nanoelec– 05/04/17
Emilie Jolivet
jolivet@yole.fr
Eric Mounier
mounier@yole.fr
Chanel fashion runway at Paris’ Grand Palais – October 2016 © 2016
© 2015
DATA TRAFFIC & HYPERSCALE DATACENTER
Data traffic
expected to
triple
between 2015
and 2020!
Hyperscale datacenter Microsoft, San Antonio TX
5th biggest hyperscale datacenter
477 000 sq ft ~ 44 314 m² ~ 4 hectares
©2015 | www.yole.fr | Name of the event 2
WHERE ARE THE TECHNICAL CHALLENGES?
• For the next generation of data centers,
Data center
three main technical aspects are
targeted:
• Storage capacity
• Power consumption
• Data flow
Storage Power
• On the storage side, higher density
capacity consumption Data flow
Equipment capacity and higher speed are sought
manufacturers
• Related to power consumption, more
are constantly efficient systems and less loss sources are
pursuing needed Technical
technical
breakthroughs • For data flow, faster data transmission breakthroughs
and less-consuming solutions are required
Power Cooling
IT equipment
equipment systems
©2016 | www.yole.fr | Silicon Photonics for Data Centers and Other Applications 2016 report 3
INTRA-DATA CENTER CONNECTIVITY WILL HAVE THE HIGHEST CAGR (SOURCE: INTEL)
The graph below shows that the largest market value growth for 40G+ data rate in data centers will be
IN the data center (either across the data center, across the rows, or in the racks)
Data center 40G+ TAM
$5.1B
In 2016, 40%
of data traffic
was within
Between DC
datacenters. In $2.1B
2020, it will be Across DC
80% $1.2B
Across row
Accross
In rack
2016 2018 2020
©2016 | www.yole.fr | Silicon Photonics for Data Centers and Other Applications 2016 report 4
3DIC MARKET DRIVERS
Electrical performance
Interconnect speed, bandwidth and
reduced power consumption
Performance-
drivenWide IO
DRAM “More than Moore”
memory
CPU Heterogeneous integration
GPU
RF-SiP Co-integration of
Flash Power. RF+logic+memory +
3DIC drivers sensors in a reduced space
unchanged!! 3D IC
Analog.
Optimum Market Access
Conditions
Cost-driven Form factor-
Sensors
Partitioning driven
3D vs. “More Moore” CIS
Can 3D be cheaper Density
than going to the next FPGA Achieving the highest
lithography node? capacity / volume ratio
©2016 | www.yole.fr | 3DASIP 2016 5
3D IN A DATA CENTRE
• Copper is still used for top-of-rack server switches because distance is short. When distance increases, optical links are used since they do not suffer from
bandwidth limitation. Most bandwidth is INSIDE DC.
• For 1 “web search” up to 1,000+ servers can be addressed
• One data center: 50k - 200k servers
Core switches Long-reach optics: 25Gb
Top-of-rack
Server connections are typically copper
Interconnection (spine) switch Switch-to-switch connections are
Access (leaf) optical fibers
25Gb switches
In-rack (3m): Across row (10 -
100Gb 100m): 40 - 100Gb
Server cabinets
Across DCs (100m-2km): 25-40Gb
Between DCs (10 - 500km): 100Gb
©2016 | www.yole.fr | Silicon Photonics for Data Centers and Other Applications 2016 report 6
ADVANCED PACKAGING PLATFORMS
AREA OF
INTEREST FOR
TODAY
PRESENTATION
©2016 | www.yole.fr | 3D TSV & 2.5D Interconnect - Business Update Report 2016 7
3D TECHNOLOGIES DEFINITION
3D technology: stacking layers on layers 2.5D technology: assembly of chips on interposer
• It can be Memory on Memory or Logic on Memory • Several types of chips can be assembled on an interposer (GPU,
CPU, memory, NPU,….)
• Large die partitioned
• Interposer can be made out silicon, glass or laminate. In the
case of laminate, we can sometimes find the term 2.1D
technology.
8
COMPONENTS AVAILABLE ON A 2.5D INTERPOSER
Field Programmable
Gate Arrays
Memory Cube
Logic and System On Chip
Memory are
the main
components
integrated on
an interposer
Graphic
Process Unit
Central Process Network SERializer-DESerializer
Unit Process Unit
9
3D STACKED MEMORY CUBE
Memory type available
3DS HBM
HMC DiRAM
Source: SK Hynix
103DS MEMORY
Three-dimensional stacked memory
• 3DS is a TSV-based DDR4 DRAM, validated by JEDEC standard
• The product is available in 64 and 128 GB, manufactured by Courtesy of SK Hynix
Samsung and SK Hynix only
Top slave
3DS memory
is sold as
stand-alone Slave 2
product
aimed at
server
market Slave 1
Master die
PCB
Courtesy of System Plus Consulting, 3DS 64 Gbits from Samsung
©2016 | www.yole.fr | Status of the CMOS image sensor industry 11ON-BOARD OPTICAL MODULES
• Mid-board and panel optics will integrate with the rack to minimize the distance between FPGA and optical modules, for best-possible
signal
• Broadcom and Samtec are proposing optical modules:
• To minimize the distance between the FPGA and the optical module, and to reduce the power and build-of-materials of the entire chip-to-module link,
Altera Corporation and Avago Technologies Inc. (Broadcom) have jointly developed a solution that combines the FPGA and optical transmitter and
receiver modules into a single integrated package that can replace multiple external card-edge optical transceivers
• Samtec has developed Firefly mid-board optics systems up to 28Gbps
MicroPOD optical modules mount to the FPGA
package
SiPh mid-board optics (> 2020)
FireFly from Samtec.
SiPh pluggable transceivers (> 2016)
source: Samtec
©2016 | www.yole.fr | Silicon Photonics for Data Centers and Other Applications 2016 report 12FORECAST FOR HIGH PERFORMANCE 3D-BASED PRODUCTS
By revenue ($M)
2015-2020 Revenue forecast for 3D TSV high performance
products
• The high performance (in $M )
TSV application 1200
market by revenue is
Total revenue expected to reach 1000
of high ~$1.1B by 2021 Yole Développement October 2016
performance 800
TSV based
Revenues (M$)
products to • This chart represents 600
reach ~$1.1B revenues made out of
by 2021 at a 3D stacked memory 400
CAGR of and interposer
46%
200
0
2015 2016 2017 2018 2019 2020 2021
Year
* stacked memory + silicon interposer revenues
13CONCLUSIONS
New commercial products based on 3D were recently launched and will be launched to consolidate the technology portfolio
for datacenters and HPC
3DS and HBM memories now available in volume, a supply chain of stacked memory and interposer is built. Samsung recently
announced its interposer platform.
High-performance products based on TSV technology will generate revenues of 1 billion $ by 2021
Bluechip companies orientate their strategy towards datacenters (Intel, Nvidia,…)
Silicon photonics is also moving progressively towards interposer solution
14CONTACT & SOURCES
Biography & contact
Emilie JOLIVET – jolivet@yole.fr
Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole
Développement the "More than Moore" market research and strategy consulting company. She holds a master’s degree Applied
Physics specialized in Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the
position of R&D engineer for 7 years in photovoltaic business and co-authored several scientific articles. Strong for this
experience, she graduated from a master in Business Administration at IAE Lyon and then joined EV Group as a business
development manager in 3D & Advanced Packaging before joining Yole Développement in 2016.
Eric MOUNIER – mounier@yole.fr
Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. He previously worked at CEA LETI R&D lab in
Grenoble, France in marketing dept. Since 1998 he is a cofounder of Yole Développement, a market research company based in
France. At Yole Développement, Dr. Eric Mounier is in charge of market analysis for MEMS & Sensors, visible and IR imagers (CIS,
microbolometers), semiconductors, printed electronics and photonics (e.g. Silicon photonics). He has contributed to more than
200 marketing & technological analysis and 100 reports. Eric is also an expert at the OMNT ("Observatoire des Micro &
Nanotechnologies") for Optics.
©2016 | www.yole.fr | Name of the event 15DATA SOURCES
Related reports
• Information in this presentation is extracted from the following reports:
16Yole Développement
From Technologies to Market
© 2016FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
Imaging Photonics
MEMS &
Sensors
MedTech
Compound
Semi.
Manufacturing
LED
Power Advanced Packaging
Electronics Batteries / Energy
Management 184 BUSINESS MODELS
o Consulting and Analysis o Financial services
• Market data & research, marketing analysis • M&A (buying and selling)
• Technology analysis • Due diligence
• Strategy consulting • Fundraising
• Reverse engineering & costing • Maturation of companies
• Patent analysis • IP portfolio management & optimization
www.yole.fr www.yolefinance.com
www.bmorpho.com
o Reports o Media
• Market & Technology reports • i-Micronews.com website
• Patent Investigation and patent infringement risk • @Micronews e-newsletter
analysis • Communication & webcast services
• Teardowns & Reverse Costing Analysis • Events
• Cost Simulation Tool www.i-Micronews.com
www.i-Micronews.com/reports
19A GROUP OF COMPANIES
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Market,
technology and
strategy Manufacturing costs analysis
Teardown and reverse engineering
consulting
Cost simulation tools
www.systemplus.fr
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
20OUR GLOBAL ACTIVITY
21SERVING THE ENTIRE SUPPLY CHAIN
Integrators and
end-users
Device
Our analysts
makers
provide market
analysis,
technology
evaluation, and
business plan Suppliers: material,
along the equipment, OSAT,
entire supply foundries…
chain
Financial investors,
R&D centers
22CONTACT INFORMATION
• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Japan & Asia: Takashi Onozawa, Representative Director, Yole KK
Email: onozawa@yole.fr
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email eloy@yole.fr
• Report business
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
• Japan & Asia: Takashi Onozawa, Representative Director, Yole KK.
Email: onozawa@yole.fr Follow us on
• Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
• Taiwan: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
• General
• Email: info@yole.fr
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