EVENT GUIDE 2021 Conference: November Minneapolis Convention Center - SMTA
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2021
EVENT
GUIDE
Conference: November 2 - 4
Exposition: November 3 - 4
Minneapolis Convention Center
Minneapolis, MN, USA
*Co-located with MD&M Minneapolis
On-Demand: November 15
*Through the end of the year*
Premiere Sponsors:
www.smta.org/smtai
SMTAI Conference & Exhibition
1 November 2 - 4, 2021 | Minneapolis Convention Center
INTRODUCTION
SMTA International provides your best chance to reconnect with the global
electronics manufacturing community and to stay competitive, identify challenges,
innovate and exceed expectations.
We invite you to attend the in-person SMTA International Conference and Exhibition from November 2 - 4, at the
Minneapolis Convention Center. Virtual presentations will be available starting November 15th. We are proud of
our legacy of providing outstanding conference and exhibition experiences and this year will be no different. The
conference and exhibition are a unique opportunity for us to collaborate, share, and learn from each other and
industry experts.
The teamwork and collaboration that goes into developing the conference and exhibition is exceptional – it really
highlights that SMTA is more than just an industry association, we are a family. Our technical program contains
papers and presentations from true subject matter experts covering a wide range of electronic manufacturing
topics.
The Technical Advisory Committee and the SMTA staff, Chapter Officers and Global Board of Directors sincerely
hope that SMTA International is a valuable and enjoyable experience for you.
The Industry’s Strongest The Largest Audience of Engineers and
Technical Program Manufacturing Professionals
SMTA International remains an exceptional We are excited to co-locate with Advanced
event as we attract an outstanding group of Manufacturing Minneapolis (MD&M) at the
authors, speakers and exhibitors. Our technical Minneapolis Convention Center this November.
program contains papers and presentations Together, the events bring one of the largest audiences
from true subject matter experts covering a wide of engineering and manufacturing professionals to the
range of electronic manufacturing topics. SMTA Midwest.
International consistently welcomes over 100
speakers into the technical program each year. Explore all five manufacturing and engineering
trade shows that share the expo floor. It’s a one-
Not able to attend in-person? You can stream stop experience delivering design to manufacturing
recorded presentations starting November 15th. solutions at every stage of the manufacturing process—
design, materials, manufacturing, automation, and
packaging—in top manufacturing sectors.
CONTENTS
Introduction . . . . . . . . . . . . . . . . . 2 Special Events . . . . . . . . . . . . . . . . . . . . . 10
Technical Committee . . . . . . . . . . . . . . . . . 3 Sponsors . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Welcome . . . . . . . . . . . . . . . . . . . . . . 5 Award Winners . . . . . . . . . . . . . . . . . . . . 13
General Information . . . . . . . . . . . . . . . . . 6 Technical Presentations . . . . . . . . . . . . . . 15
Conference At-A-Glance . . . . . . . . . . . . . . 7 Exhibitor Guide . . . . . . . . . . . . . . . . . . 31
Keynotes . . . . . . . . . . . . . . . . . . . . . 9 Product Finder . . . . . . . . . . . . . . . . . . . . . 46
SMTAI Conference & Exhibition
2 November 2 - 4, 2021 | Minneapolis Convention Center
TECHNICAL ADVISORY
COMMITTEE
The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging
experts representing all facets of the industry. The Committee designed the conference program to ensure that today's
latest trends and developments are fully addressed. They are an important component of the SMTA Knowledge Base.
Raiyo Aspandiar, Ph.D. Richard Coyle, Ph.D.
Conference Director VP Technical Programs
Intel Corporation Nokia Bell Labs
Mohammed Abueed Srinivas Chada, Ph.D. Robert Kinyanjui, Ph.D.
Intel Corporation Raytheon Company Harsh Environments Track Director
John Deere Electronic Solutions, Inc.
Dudi Amir Lenora Clark
Intel Corporation Substrates Track Director Pradeep Lall, Ph.D.
ESI Automotive Auburn University
Martin Anselm, Ph.D.
Technical Innovations Track Director Jean-Paul Clech, Ph.D. Dale Lee
Rochester Institute of Technology EPSI, Inc. Plexus Corp.
Babak Arfaei, Ph.D. Marie Cole Tanya Martin, CMP
Ford Motor Company IBM Corporation (Retired) SMTA
Nilesh Badwe, Ph.D. Priyanka Dobriyal, Ph.D. Andrew Mawer
IIT Kanpur Women's Leadership Program NXP Semiconductor
Track Director
Andy Behr Intel Corporation Iulia Muntele, Ph.D.
Panasonic Sanmina Corporation
James Elliott Fowler
Elizabeth Benedetto Sandia National Laboratories Tim Pearson
HP Inc. Flux, Solder, Adhesives Track Director
Trevor Galbraith Collins Aerospace
Mike Bixenman, DBA, MBA Global SMT & Packaging
KYZEN Corporation Anto Raj
Jay Gorajia Medtronic
Lars Boettcher Siemens Digital Industries Software
Fraunhofer IZM Berlin Brian Roggeman
Faramarz Hadian Qualcomm Technologies Inc.
Rob Boguski Binghamton University
Datest Corporation Julie Silk
Sa'd Hamasha, Ph.D. Keysight Technologies
Keith Bryant Auburn University
KB Consultancy Greg Vance
Md Hasnine, Ph.D. Rockwell Automation
Bill Cardoso, Ph.D. Qorvo, Inc.
Inspection Track Director Rebecca Wheeling, Ph.D.
Creative Electron, Inc. Dave Hillman Sandia National Laboratories
Collins Aerospace
Burt Carpenter Ray Whittier Jr., CSMTPE
Advanced Packaging Technology Jeff Kennedy BAE Systems
Track Director Manufacturing Excellence Track Director
NXP Semiconductors ZESTRON Americas Charles Woychik, Ph.D.
SkyWater Technology
SMTAI Conference & Exhibition
3 November 2 - 4, 2021 | Minneapolis Convention Center
Conference: October 31 - November 3
Exposition: November 2 - 3
Minneapolis, Minnesota, USA
*Co-located with:
2022
Call for Abstracts
Become a part of the industry’s strongest technical program addressing all
aspects of electronics manufacturing. Plan to present in-person or virtually at
the annual SMTA International Conference. Full technical paper is required for
inclusion in the published proceedings.
Proposals are also being solicited from individuals interested in teaching professional development
courses related to surface mount technology, advanced packaging, and electronics manufacturing.
Due Date: May 2, 2022
www.smta.org/smtai
SMTAI Conference & Exhibition
4 November 2 - 4, 2021 | Minneapolis Convention Center
WELCOME TO SMTA
INTERNATIONAL
The SMTA welcomes you to SMTA International and our Minneapolis venue. We have
crafted another exceptional conference and exhibition experience for our attendees.
We are happy to partner with MD&M Minneapolis to bring the Midwest’s largest
electronics manufacturing event to you.
The program contains useful and relevant information from subject matter experts covering a wide range of topics,
including technical sessions on Advanced Packaging (APT); Flux, Solder, Adhesives (FSA); Harsh Environments
(HE), Manufacturing Excellence (MFX), Lead-Free Soldering Technology with a strong emphasis on Low
Temperature Solders (LTS), Second-Level Interconnect Reliability (SLIR), Substrates (SUB), Technical Innovations
(TI), and the Women’s Leadership Program.
We also want to extend our personal thanks to the companies and individuals that continue to sponsor and
support SMTA International in these uncertain times. This includes the exhibitors, speakers, authors, co-authors,
volunteers and the SMTA staff, Chapter officers and Board of Directors. Your support and commitment are what
makes SMTA International such an exceptional event.
The Technical Advisory Committee, Expo Committee, staff, and Board of Directors sincerely hope that SMTA
International remains a valuable and enjoyable experience for you. Thank you for your participation and support.
Raiyo Aspandiar, Ph.D. Richard Coyle, Ph.D.
Conference Director VP Technical Programs
Intel Corporation Nokia Bell Labs
SMTAI Conference & Exhibition
5 November 2 - 4, 2021 | Minneapolis Convention Center
GENERAL
INFORMATION
Registration Hours (Hall B)
Monday, November 1 Tuesday, November 2 - Thursday, November 4
11:00am-5:00pm 7:30am-5:00pm
Conference Hours
Tuesday, November 2 Wednesday, November 3 Thursday, November 4
8:30am-6:00pm 8:30am-4:00pm 8:30am-3:00pm
Exhibit Hours
Wednesday, November 3 Thursday, November 4
10:00am-5:00pm 10:00am-4:00pm
Suitcasing Policy
SMTA does not allow solicitation from non-exhibiting companies. This includes attempts to solicit or sell
products to event attendees or exhibitors. Any non-exhibiting attendee observed soliciting business in
the aisle of the expo will be asked to leave.
In the Event of an Emergency
Please contact the Command Center and tell the operator the nature of the emergency. The Command
Center can be contacted via:
• cell phone at 612-335-6040.
• beige house phones, located in public corridors, lobbies, and fire-hose cabinets on various pillars in
exhibit halls. The number [EXT. 2013] is posted by each phone.
• uniformed security officers, who are posted at security podiums 24/7 and who will also respond to
any safety concerns.
Notice of Photography
Photos and videos may be taken at this event for promotional use. As a registrant or attendee you
hereby give SMTA permission to publish photographs or video taken of you during the event.
Press
Companies wishing to leave information for media may leave their literature in Room 205AB.
SMTA Office
Conference speakers and session chairs should check in at Room 205AB. Conference speakers are
invited to use Room 201A to prepare for their presentation.
SMTA Booth
Be sure to visit us in Hall B on the main level to learn about membership benefits and opportunities.
SMTAI Conference & Exhibition
6 November 2 - 4, 2021 | Minneapolis Convention Center
CONFERENCE
AT-A-GLANCE
Track Key
Advanced Packaging Technology (APT) Manufacturing Excellence (MFX)
Flux, Solder, Adhesives (FSA) Second-Level Interconnect Reliability (SLIR)
Harsh Environment Applications (HE) Substrates/PCB Technology (SUB)
Inspection / Counterfeit Electronics (INS) Technical Innovations (TI)
Low Temperature Solder (LTS)
Sessions - Tuesday, November 2
7:00am 7:00am
8:00am Registration Opens 8:00am
9:00am 9:00am
SLIR1: Adoption of Pb-free Solder Assembly
MFX1: Process Development & Reliability FSA1: Reliability Enhancements
for the Aerospace & Defense Industry
10:00am 10:00am
Refreshment Break
11:00am MFX2: Cleaning FSA2: Flux Performances SLIR2: Predictive Modeling 11:00am
12:00pm 12:00pm
Lunch
1:00pm 1:00pm
Women's Leadership Program: Career
2:00pm MFX3: Cleaning Development Presentations & Guided SLIR3: Pb-Free Process Innovations 2:00pm
Meditation Session
3:00pm 3:00pm
Refreshment Break
4:00pm SLIR4: Reliability Testing 4:00pm
MFX4: Design & Process WLP: Round Table Discussions
5:00pm 5:00pm
Women's Leadership Connection Reception
Wine & Ice Cream Social
6:00pm 6:00pm
SMTAI Conference & Exhibition
7 November 2 - 4, 2021 | Minneapolis Convention Center
CONFERENCE
AT-A-GLANCE
Sessions - Wednesday, November 3
8:00am 8:00am
Annual Meeting
9:00am 9:00am
Keynote Presentation
10:00am 10:00am
11:00am APT 1: Assembly Process & 11:00am
MFX5: Advanced Materials LTS 1: Microstructure &
Materials 1 & Devices Properties of LTS
EV Roundtable
12:00pm 12:00pm
1:00pm 1:00pm
Lunch Break
2:00pm 2:00pm
TI1: Thermal
APT 2: Panel Discussion -
3:00pm MFX6: Material Performances LTS 2: Reliability Testing (1) 3:00pm
Packaging for Automotive
4:00pm 4:00pm
Expo Floor Open Until 5:00pm - Hall B
5:00pm 5:00pm
Sessions - Thursday, November 4
8:00am 8:00am
LTS 3: Assembly &
9:00am APT 3: Assembly Process & 9:00am
TI2: Digital Transformation Manufacturing Considerations
Materials 2
with LTS (1)
10:00am 10:00am
Refreshment Break
11:00am LTS4: Assembly & 11:00am
Manufacturing Considerations
APT 4: Package Performance with LTS (2)
TI3: Process Transformations
& Reliability
12:00pm 12:00pm
1:00pm Lunch Break 1:00pm
2:00pm HE1: Challenges & Durability INS1: Inspection & Test LTS5: Reliability Testing 2 2:00pm
3:00pm 3:00pm
SMTAI Conference & Exhibition
8 November 2 - 4, 2021 | Minneapolis Convention Center
KEYNOTES
Are You Ready for the EV Revolution? Sponsored by
Loren McDonald, CEO
EVAdoption, LLC
Wednesday, November 3 | 9:00am-10:00am | Room 200A/B
The transition to electric vehicles (EVs) and away from gas-powered vehicles
is clearly underway both around the world and in the US. Many key questions
remain however, including how quickly the transition will occur (especially in
America) and how disruptive the transition to EVs will be to various segments of
the auto industry — from suppliers, to dealers and OEMs. In particular, the shift
to EVs is turning the automotive supply chain on its head as lower barriers of
entry are bringing many new players — both big and small — to the table.
In his keynote presentation, electric vehicle analyst and consultant Loren
McDonald of EVAdoption will enlighten SMTA members on how and when
the EV transition is likely to play out and outline both key challenges and
opportunities for surface mount technology suppliers.
Additional Keynotes
Future of Medtech: From AI to Xenobots & Innovation in Minnesota: Where We Came
Everything in Between From and Where We’re Going
Jose Morey, Consultant Steve Grove, Commissioner,
for NASA, IBM, Hyperloop Minnesota Department of
Transportation, and Liberty Employment and Economic
BioSecurity Health Development (DEED)
Wednesday, November 3 Thursday, November 4
12:30pm-1:15pm 12:30pm-1:15pm
Engineering Theater Engineering Theater
Since its creation in 1816 by the French Physician Minnesota is home to one of the highest per capita
René Laënnec, the stethoscope has become of Fortune 500 companies and home to many more
the quintessential icon for a physician. We will key engineering and manufacturing businesses.
be exploring the transition from the age of the This is largely in part to a few key things: our
stethoscope to the age of robotics and artificial focus on innovation and economic expansion, our
intelligence — and envision a world in which the diverse workforce, and a growing ecosystem to
next iconic tool for a physician is not a physical support innovation. In this keynote presentation,
augmentation to hear breath sounds and cardiac Commissioner Steve Grove will discuss
sounds but an augmentation to understand a opportunities and advancements in the North Star
patient's digital twin to be able to predict disease State and take questions from the audience.
and intervene even when separated by vast
distances.
SMTAI Conference & Exhibition
9 November 2 - 4, 2021 | Minneapolis Convention Center
SPECIAL EVENTS
Tuesday, November 2
Growing the Future: NextGen Electronics Manufacturing Workforce
2:00pm-4:00pm | Room 201B
We’re confident you’re well aware of the current difficulty and projected future inability to replace experienced
technical staff to sustain a robust and technically competitive electronics manufacturing base in North America.
Many conditions over decades led to this current state of affairs (years of consolidation, offshoring, focus on more
glamorous “dot.com” career options, aging-out of “boomer” -era technical staff, COVID, etc.) and no one single
solution will correct it, and it will take time (years) but there are efforts underway to begin the road back.
Wednesday, November 3
Jump Start - 101 Level Technical Topics include:
• 10:30am: Stencil Printing - Chrys Shea, Shea
Sessions Engineering Services
10:30am-4:15pm | Show Floor Theater
• 11:30am: Inspection - Isaiah Smith, Koh Young
• 12:30pm: Placement - Tom Foley, ASM
• 1:30pm: Reflow - Anna Lifton, MacDermid Alpha
• 2:30pm: DFM - Dale Lee, Plexus Corp.
• 3:30pm: Cleaning - Jigar Patel, Zestron Americas
Electric Vehicles: Fad, Fantasy, or Fortune in SMT?
11:30am-12:30pm | Room 205CD
This EV roundtable will discuss the emerging EV market: why it hit an inflection point and how we should be
responding. We’ll discuss opportunities for business growth and, more importantly, our responsibility as industry
leaders to be good stewards in PCBA for automotive applications.
Come join SMTAI keynote speaker, Loren McDonald, and industry experts, Debbie Carboni and Brian O'Leary, for
an educational and lively exchange on the emerging market of electric vehicles.
Lakes & Legends Brewing Company
6:00pm | 1368 LaSalle Ave, Minneapolis, MN 55403
Informal gathering for Bingo & Brews - Everyone is welcome!
Sponsored by: SMTA Heartland Chapter
Thursday, November 4
Casual Career Conversations Complimentary Headshots
12:00pm-1:00pm | SMTA Membership Booth 12:00pm-4:00pm | Career Zone
Grab your lunch and come hang out! Advance your LinkedIn profile and other
• Resume Tips and Tricks professional efforts with a complimentary
Moderator: Eric Miller, KYZEN Corporation headshot from a Lunch Break Headshots
• Strategic Self Promotion professional photographer.
Moderator: Justin Worden, Austin American Technology
SMTAI Conference & Exhibition
10 November 2 - 4, 2021 | Minneapolis Convention CenterIt's Good We're Not All the Same:
Career Diversity and Development
Tuesday, November 2 | 1:00pm-6:00pm | Room 204AB
Free for everyone and all are welcome!
Career Development Presentations and Guided Meditation Session
Gayle R. T. Schueller, Ph.D. Amanda Mikhail Tiffany Kari
Senior Vice President and Research Operations Administrator Health Promotions Coordinator
Chief Sustainability Officer Mayo Clinic St. Louis County
3M Innovation and Stewardship
Speed Mentoring Sessions
Co-Chairs: Cheryl Tulkoff, NI and Eileen Hibbler, EAP
Breaking Through Unwritten Stereotypes: Relentlessly Reinvent and Accelerate
Good Old Boys Club your Career Path
Chrys Shea, Shea Engineering Services Amanda Mikhail, Mayo Clinic
Sherry Stepp, KYZEN Corporation Julie Silk, Keysight Technologies
Identifying Mentors and Cultivating Sponsors Positive Outcomes from Tough Situations
Marie Cole, IBM Corp. (Retired) Mike Konrad, Aqueous Technologies
Jessica Molloy, ZESTRON Corporation Michelle Ogihara, Seika Machinery, Inc.
Importance of Strategic Thinking Find your Strengths: Personality Analysis
Martin Anselm, Rochester Institute of Technology Debbie Carboni, KYZEN Corporation
Tanya Martin, SMTA Headquarters Priyanka Dobriyal, Intel Corporation
Connection Reception and Ice Cream Social
Ice cream comes in many flavors and everyone typically has a favorite or two. Think of how boring life would be if all of the
ice cream in the world was vanilla with no sprinkles or toppings. There is nothing wrong with good ole vanilla, chocolate or
strawberry but imagine a world without rocky road, pistachio or butter pecan! I shudder the thought. Come join us as we
mingle and celebrate the different flavors of people in our industry. (Don’t be surprised to find a couple of nuts in the bunch.)
SMTAI Conference & Exhibition
11 November 2 - 4, 2021 | Minneapolis Convention CenterPREMIERE SPONSORS
EVENT SPONSORS
MEDIA AND ASSOCIATION
SPONSORS
SMTAI Conference & Exhibition
12 November 2 - 4, 2021 | Minneapolis Convention CenterAWARD WINNERS
2021 Members of Distinction Awards
Founders Excellence in Leadership
SMTA+ Corporate
David Raby Keysight Technologies Debbie Carboni
STI Electronics, Inc. KYZEN Corporation
Excellence in International Leadership Member of Technical Distinction
Mei Ming Khaw Ronald Lasky, Ph.D., P.E.
Keysight Technologies Indium Corporation
2021 Education Awards
Hutchins Grant Stromberg Scholarship
Yi Zhou Mohamed El Amine Belhadi
Georgia Institute of Technology Auburn University
SMTAI Conference & Exhibition
13 November 2 - 4, 2021 | Minneapolis Convention CenterAWARD WINNERS
2020 Conference Winners
Best of Proceedings Paper Awards
WINNER: Richard Coyle, Ph.D., Nokia Bell Labs
"Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony"
(Co-Authors: Charmaine Johnson, David Hillman, and Tim Pearson, Collins Aerospace; Michael Osterman, CALCE; Joe Smetana,
Nokia; Keith Howell, Nihon Superior Co., Ltd.; Hongwen Zhang and Ji Geng, Indium Corp.; Julie Silk, Keysight Technologies;
Derek Daily, Senju Comtek Corp.; Babak Arfaei, SUNY-Binghamton; Ranjit Pandher, Alpha Technologies; Andre Delhaise,
Celestica; Stuart Longgood, Delphi Technologies; Andre Kleyner, Aptiv)
Honorable Mention: Andrew Mawer, NXP Semiconductors
"Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications"
(Co-Authors: Mollie Benson, Dwight Daniels, A R Nazmus Sakib, and Vishrudh Sriramprasad, NXP Semiconductors N.V.)
Honorable Mention: Jennifer Bennet, P.E., IBM Corporation
"CBGA and CCGA Field Reliability Predictions Confirmed"
(Co-Authors: Jim Bielick, Marie Cole, IBM Corporation)
Honorable Mention: Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions
"Advanced SIR Testing for Trapped Solder Paste Flux Residue"
(Co-Authors: Aurkie Ray, Anna Lifton and Paul Salerno, MacDermid Alpha Electronics Solutions)
Honorable Mention: Keith Sweatman, Ph.D., Nihon Superior Company, Ltd.
"Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy"
(Co-Authors: Tetsuro Nishimura, Nihon Superior Co., Ltd.; Sergey A. Belyakov and Christopher M. Gourlay, Imperial College London)
SMTAI Conference & Exhibition
14 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
Track Key
Advanced Packaging Technology (APT) Manufacturing Excellence (MFX)
Flux, Solder, Adhesives (FSA) Second-Level Interconnect Reliability (SLIR)
Harsh Environment Applications (HE) Substrates/PCB Technology (SUB)
Inspection / Counterfeit Electronics (INS) Technical Innovations (TI)
Low Temperature Solder (LTS)
Tuesday, November 2
FSA1: Reliability Enhancements 8:30am - 10:00am
Room 203AB
Chair: Andy Behr, Panasonic
>>Edge Bonding as Viable Reinforcement for Solder Joints in High Reliability Applications
Westin Bent, MacDermid Alpha Electronics Solutions
>>Deliquescent Relative Humidity Measurement of No-Clean Flux Residues
Eric Campbell, IBM Corporation
>>A Correlation Study of Solder Cup Voiding Versus Solder Joint Integrity
*Timothy Pearson, Collins Aerospace
MFX1: Process Development & Reliability 8:30am - 10:00am
Room 200D
Chair: Greg Kloiber, Ducommun
>>The Evolution of Material Handling Practices and Processes
Michael Adamson, Inovaxe Corporation
>>Statistical Analysis of Transfer Efficiency in the Age of Very Large Sample Sizes
*Ron Lasky, P.E., Ph.D., Indium Corporation
>>The Effect of Grain Size Distribution on the Defect Generation Mechanism of 0201 Passives
Swagatika Patra, Binghamton University-SUNY
SMTAI Conference & Exhibition * Designates Speaker of Distinction
15 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
SLIR1: Adoption of Pb-free Solder Assembly for the Aerospace 8:30am - 10:00am
and Defense Industry Room 200E
Chair: Richard Coyle, Ph.D., Nokia Bell Labs
>>Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace,
Defense, and High Performance Products and Systems Part 1
*David Hillman, Collins Aerospace
>>Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace,
Defense, and High Performance Products and Systems Part 2
*Anthony Rafanelli, Ph.D., Raytheon Technologies
>>Criteria for Solder Alloy Adoption
Michael Osterman, Ph.D., University of Maryland - CALCE
FSA2: Flux Performances 10:30am - 12:00pm
Room 203AB
Chair: Andy Behr, Panasonic
>>An Investigation into the Effects of Greases on Low-Load Gold-Plated Electrical Contacts
Undergoing Fretting
Julie Silk, Keysight Technologies
Rishabh Chaudhary, M.S., Center for Advanced Life Cycle Engineering (CALCE)
>>Lower Temperature Soldering Using Supercooled Liquid Metal
Ian Tevis, SAFI-Tech
>>Materials Characterization and Correlation Study of Solder Paste using Electrochemical
Impedance Spectroscopy (EIS) and Surface Insulation Resistance (SIR)
*Mark McMeen, STI Electronics
SMTAI Conference & Exhibition * Designates Speaker of Distinction
16 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
MFX2: Cleaning 10:30am - 12:00pm
Room 200D
Chair: Jason Keeping, P. Eng., Celestica Inc.
>>Modern Electronics Defluxing – Meeting the Low VOC Challenge
Naveen Ravindran, M.S.Ch.E., ZESTRON Corporation
>>The Relationship Between Reflow Profiles and Contamination
*Michael Konrad, Aqueous Technologies
>>Engineered Aqueous Cleaning It All Comes Down To Performance
*Debbie Carboni, KYZEN Corporation
SLIR2: Predictive Modeling 10:30am - 12:00pm
Room 200E
Chair: Tim Pearson, Collins Aerospace
>>A Modified Coffin-Manson Methodology for Predicting Solder Joint Life in Eutectic Tin-Lead and
Lead-Free Assemblies
*Jean-Paul Clech, Ph.D., EPSI Inc.
>>Low-Temperature Solders SMT Process Optimization for Enhanced Reliability
Paul Salerno, MacDermid Alpha Electronics Solutions
>>An Investigation on the Influence of Nickel Contamination of Plated Through Hole (PTH)
Solder Joint Integrity
*David Hillman, Collins Aerospace
SMTAI Conference & Exhibition * Designates Speaker of Distinction
17 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
MFX3: Cleaning 1:00pm - 3:00pm
Room 200D
Chair: Keith Howell, Nihon Superior
>>Cleanliness Detection and Resistance of Solvent Extract, a Critical Evaluation
*Tom Forsythe, KYZEN Corporation
>>Identifying Cleaning Compatibility Issues with Electronic Components
Claire Brennan, Ph.D., Collins Aerospace
>>Detailed Study of Condensate Residues in the Soldering Process -
Analysis of the Responsible Reaction Partners as well as Reasons for
Condensate Polymerization and Growth of Crystalline Structures
*Viktoria Rawinski, Rawinski GmbH
>>Site-Specific Ionic Contamination Process Control Monitoring Plan Method
*Mike Bixenman, DBA, MBA, Magnalytix
SLIR3: Pb-Free Process Innovations 1:00pm - 3:00pm
Room 200E
Chair: David Hillman, Collins Aerospace
>>A Novel Bismuth-, Indium-, and Antimony-Containing Lead-Free Solder with
Enhanced Thermal Reliability for Automotive and LED
Jie Geng, Indium Corporation
>>High-Reliability Lead-free Solders for Automotive Electronics - Thermal Cycling and
Shear Strength Performance
Paul Salerno, Alpha Assembly Solutions
>>Reliability of Solder Joints on Flexible Aluminum PC Boards
Divyakant Kadiwala, Averatek Corporation
Nazarali Merchant, Averatek Corporation
>>Reducing Solder Scrap by Replacing Solder Paste with Solder Preforms When Appropriate
Mitch Holtzer, Alpha Assembly Solutions
SMTAI Conference & Exhibition * Designates Speaker of Distinction
18 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
MFX4: Design and Process 3:30pm - 5:00pm
Room 200D
Chair: Tom Borkes, The Jefferson Project
>>Process and Design Guidelines for Large and Complex RF and EMI Shields for
Board Level Assembly
Mohammed Alam, Intel Corporation
>>Lessons Learned with Large and Heavy Copper Boards, a Review of Quality and
Productivity Improvements
Paul Wilson, Rockwell Automation
>>Root Cause of Dye Stain Observed on Server Motherboard Sockets BGA Solder Joints and its
Impact on their Solder Joint Quality and Reliability
*Raiyo Aspandiar, Ph.D., Intel Corporation
SLIR4: Reliability Testing 3:30pm - 5:00pm
Room 200E
Chair: Jean-Paul Clech, Ph.D., EPSI Inc.
>>Effects of Matching Lead-free Solder Joints Compared to SnPb on
BGA Reliability in Thermal Cycling
Mohammed Belhadi, Auburn University
>>Role of Conformal Coating and its Strategies for Tin Whisker Mitigation
Preeth Sivakumar, Binghamton University
SMTAI Conference & Exhibition * Designates Speaker of Distinction
19 November 2 - 4, 2021 | Minneapolis Convention CenterYou Need to Know This Stuff!
Enroll Today in the SMTA
Assembly Essentials Package
Courses Cover 7 Key Processes:
• Stencil Printing • Selective Soldering
• Component Placement • Cleaning
• Reflow Soldering • Rework
• Wave Soldering
20
www.smta.org/training
SMTAI Conference & Exhibition
November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
Wednesday, November 3
LTS1: Microstructure and Properties of LTS 11:00am - 12:00pm
Room 200E
Chair: Jim Wilcox, Universal Instruments
>>Effect of Initial Volume Ratio, Reflow Temperature and Current Stressing on the
Microstructure of SnBiAg-SAC Mixed Solder Joints
*Eric Cotts, Ph.D., Binghamton University
>>The Variation of the Electrical Resistance and Microstructure of SnBi based Solder
Joints with Current Stressing
Faramarz Hadian, Ph.D., Binghamton University
APT1: Assembly Process & Materials 1 11:00am - 12:30pm
Room 202AB
Chair: Pradeep Lall, Ph.D., Auburn University
>>Innovative Indium and Silver-Tin Plating Processes for Connector Press-Fit Applications
Frank Xu, Ph.D., MacDermid Alpha Electronics Solutions
>>Micro Device | Hot Solder Dip
Phil Meyers, Retronix Ltd
>>No Bleed Die Attach to Roughened Leadframe
Dan Hart, MacDermid Alpha Electronics Solutions
MFX5: Advanced Materials and Devices 11:00am - 12:30pm
Room 200D
Chair: Eric Campbell, IBM Corporation
>>Varying Requirements, Same Inkjet Solder Mask Coating Tool - The Case of Inkjet
Adaptability by Printing Strategies
Don Veri, SUSS MicroTec NL
>>New Device Validates Printer Accuracy and Squeegee Force Capability During Singular Test
Michael Sivigny, CeTaQ Americas
>>Thin Foil Printing in Today’s Miniaturized World: Do Printing Rules Change?
*Chrys Shea, Shea Engineering Services
SMTAI Conference & Exhibition * Designates Speaker of Distinction
21 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
APT2: Panel Discussion - Packaging Challenges for Automotive Applications 2:00pm - 4:00pm
Room 202 AB
Moderator: Andrew Mawer, NXP Semiconductors
Panelist: Pradeep Lall, Ph.D., Auburn University Panelist: Rajesh Sur, Qorvo
Panelist: Burt Carpenter, NXP Semiconductors Panelist: Chuck Woychik, Ph.D., SkyWater Technology
LTS2: Reliability Testing (1) 2:00pm - 4:00pm
Room 200D
Chair: Eric Cotts, Ph.D., Binghamton University
>>The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of
Hybrid Low Temperature Solder Joints
*Richard Coyle, Ph.D., Nokia Bell Labs
>>Interim Thermal Cycling Report on Hybrid and Homogeneous LTS Solder Joints
*Richard Coyle, Ph.D., Nokia Bell Labs
>>Mechanical Shock Testing And Failure Analysis On Mixed SnAgCu-BiSn And Full Stack BiSn
Solder Joints Of CABGA192 Components
*Raiyo Aspandiar, Ph.D., Intel Corporation
Jagadeesh Radhakrishnan, Intel Corporation
>>Thermal Reliability of Mixing Bismuth Containing Solder Paste with SAC BGA's at
Low Reflow Temperature- Part II
Sahana Marur Kempaiah, Rochester Institute of Technology
MFX6: Material Performances 2:00pm - 4:00pm
Room 200D
Chair: Keith Bryant, KB Consultancy
Co-Chair: Chris White, PPSI Manufacturing
>>What Do You Want on Your Tombstone?
*Tony Lentz, FCT Assembly
>>Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to
Solder Paste Inspection (SPI) Performance
Morgan Miller, Insituware
>>Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration
Evan Griffith, Indium Corporation
>>Impact of the Surface Finish on IMC and Solder Joint Reliability with Low-Temperature Solder Paste
Joe McGurran, Atotech USA, LLC
Britta Schafsteller, Atotech Deutschland GmbH
SMTAI Conference & Exhibition * Designates Speaker of Distinction
22 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
TI1: Thermal 2:00pm - 3:30pm
Room 203AB
Chair: Julie Silk, Keysight Technologies
>>High Performance Liquid Metal Thermal Interface Materials
*Ron Lasky, P.E., Ph.D., Indium Corporation
>>GaIn Based Liquid Metals as TIMs: Challenges and Considerations
Peter McClure, Universal Instruments Advanced Process Laboratory
>>Photonic Soldering Temperature Sensitive Components with High Temperature Solder Alloys
Vahid Akhavan, NovaCentrix
Thursday, November 4
APT3: Assembly Process & Materials 2 8:30am - 10:00am
Room 202AB
Chair: Andrew Mawer, NXP Semiconductors
>>Investigation of Interdiffusion and Formation of Intermetallic Compounds in
Power Electronic Substrate Joints Produced by Transient Liquid Phase Bonding
Chidinma Imediegwu, Georgia Institute of Technology
>>CPU Socket Interposer Component Level and Manufacturability Study, Part 1:
Socket Contact vs. Direct-Solder-Attach Interconnection
*Paul Wang, Mitac International Corporation
>>Underfill Material and Interface Property Evolution in Underhood Automotive
Temperatures over Period of 1-Year
*Pradeep Lall, Ph.D., Auburn University
SMTAI Conference & Exhibition * Designates Speaker of Distinction
23 November 2 - 4, 2021 | Minneapolis Convention CenterReworkable Edgebond Adhesives
For High Reliability Applications
© 2020 Zymet
QR Code For Video
For More Information:
info@zymet.com or www.zymet.com
SMTAI Conference & Exhibition
24
© 2020 Zymet
November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
LTS3: Assembly and Manufacturing Considerations with LTS (1) 8:30am - 10:00am
Room 200E
Chair: Phil Isaacs, IBM Corporation
>>Enabling Pin in Paste Through Hole Soldering Through SnBi Low Temperature Solder
Sugadh Bakare, Intel Corporation
>>Unveiling a Total Solution for Soldering Through-hole Components using
a Low Temperature Alloy
*Anna Lifton, MacDermid Alpha Electronics Solutions
>>Using a Low Melting Point Solder in a Selective Soldering Process
Eddia Groves, Pillarhouse USA, Inc.
Jonathan Wol, Pillarhouse USA, Inc.
TI2: Digital Transformation 8:30am - 10:00am
Room 203AB
Chair: Marie Cole, IBM Corporation (Retired)
>>Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory
Ivan Aduna, Koh Young America, Inc.
>>Systems Analysis and Axiomatic Design Using Discrete Event Simulation
Zohair Mehkri, Flex
>>SMT Performance Analytics - Golden Cycle Time and Automated Loss Reason Inference
Andrew Scheuerman, Ph.D., Arch Systems
SMTAI Conference & Exhibition * Designates Speaker of Distinction
25 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
LTS4: Assembly and Manufacturing Considerations with LTS (2) 10:30am - 12:00pm
Room 200E
Chair: Randy Schueller, Ph.D., Dell
>>Manufacturing Cost Reductions Available When Using Low MP Solder Paste
Mitch Holtzer, Alpha Assembly Solutions
>>The Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/Growth
*David Hillman, Collins Aerospace
>>Hybrid Assembly and Reliability of Conventional Pb-Free BGA’s Using Low Temperature Solder
Paste for Temperature Sensitive IC Applications
*Andrew Mawer, NXP Semiconductors
APT4: Package Performance and Reliability 10:30am - 12:30pm
Room 202AB
Chair: Chuck Woychik, Ph.D., SkyWater Technology
>>Automotive Gate Driver Package with Galvanically Isolated Communication Linkage
*Burton Carpenter, NXP Semiconductors
>>Modeling of the Effect of Thermal Pad Voiding on Quad Flatpack No-Lead Components
Ross Wilcoxon, Ph.D., Collins Aerospace
>>Additive-Print Process-Performance Interaction for Ink-Jet and Direct-Write Circuits
with Surface Mount Components
*Pradeep Lall, Ph.D., Auburn University
>>An Approach to Use Reduced Sample Sizes for Qualification Testing Based on
Failures in Time (FITS) Analysis and the Poisson Exponential Binomial Distribution for
Low Volume Custom Components
Jacob Weber, Collins Aerospace
SMTAI Conference & Exhibition * Designates Speaker of Distinction
26 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
TI3: Process Transformation 10:30am - 12:30pm
Room 203AB
Chair: Greg Vance, Rockwell Automation
>>An Automated PCB Design Constraint Extraction and Verification from
the SOC Platform Design Collateral
Alan Hatfield, Intel Corporation
Minoru Ishikawa, Siemens Digital Industries Software
>>Aerosol Jet Printed Interconnects for Millimeter-wave Components
Bryan Germann, Optomec
>>An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in
Re-Work Applications
Dan Jenkins, Steel Camel
>>Improving Immersion Silver Performance for 5G Applications
Denis Jacques, Technic Inc.
INS1: Inspection and Test 1:30pm - 2:30pm
Room 203AB
Chair: Mike Konrad, Aqueous Technologies
>>A New X-Ray Tube Technology to Revolutionise Electronics Inspection
*Keith Bryant, KB Consultancy
>>SIR Glass Test Vehicle Designed to Characterize Process Materials
*Mike Bixenman, DBA, Magnalytix
SMTAI Conference & Exhibition * Designates Speaker of Distinction
27 November 2 - 4, 2021 | Minneapolis Convention CenterTECHNICAL
SESSIONS
LTS5: Reliability Testing (2) 1:30pm - 3:00pm
Room 200E
Chair: Dale Lee, Plexus Corp.
>>Solder Ball Drift Behavior of Hybrid SnAgCu‐LTS Solder Interconnects
in Accelerated Thermal Cycling
*Luke Wentlent, Universal Instruments Corporation
*Jim Wilcox, Universal Instruments Corporation
>>Challenges To Maintain High Electrical Reliability of Low Temperature Solder Paste
Ramakrishna Hosur Venkatagiriyappa, Ph.D., MacDermid Alpha Assembly Solutions
>>Thermal Cycling Behaviors of Hybrid and Homogeneous Low Temperature Solder Interconnects
*Luke Wentlent, Universal Instruments Corporation
*Jim Wilcox, Universal Instruments Corporation
HE1: Challenges and Durability 1:30pm - 3:00pm
Room 200AB
Chair: Gary Tanel, Electronics Alliance
>>Challenges of Interpreting and Applying New IPC J-STD-001 Cleanliness
Standards in High-Rel Applications
*William Capen, Honeywell FM&T
>>Effect of Temperature on the Mechanical Fatigue of Solder Joints in Ball Grid Array Assembly
Xin Wei, Auburn University
>>Electrical Performance Impact of Disinfecting Near and Around Electronic Systems
*Phil Isaacs, IBM Corporation
SMTAI Conference & Exhibition * Designates Speaker of Distinction
28 November 2 - 4, 2021 | Minneapolis Convention CenterNew for 2021
VT-S1080
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SMTAI Conference & Exhibition expertise can help achieve your smart factory goals
29 November 2 - 4, 2021 | Minneapolis Convention CenterON-DEMAND
CONFERENCE
On Monday, November 15th, SMTA will launch the on-demand SMTA International
Conference that will feature technical presentations for attendees to stream.
You can attend the conference virtually and stream recorded presentations starting November 15th with access
through the end of the year (December 31st). Virtual conference access will be included with each in-person
conference registration. The full list of papers available to stream can be found online.
SMTAI Conference & Exhibition
30 November 2 - 4, 2021 | Minneapolis Convention CenterEXHIBITOR
A-Z
Acculogic Akrometrix
Booth 3236 Booth 3419
Scott Moser Mark Venco
6475 Sycamore Court N., Maple Grove, MN 2700 N.E. Expy., Building B-500, Atlanta, GA
s.moser@acculogic.com mvenco@akrometrix.com
480-635-2283 404-486-0880
Acculogic provide a range of Automated Test Equipment, Akrometrix, over the last 25 years, has established itself as
Robotic Flying Probe, Test Program Development on most ATE the worldwide leader of Warpage Measurement Systems and
platforms and Contract Testing Services. Doesn’t matter if you Testing Services. Our solutions determine the actual warpage
need ICT, FCT, Device Programming or Boundary Scan testing characteristics of electronic assemblies/components down to the
services – we support it all from our Maple Grove, MN facility. sub-micron level, from extreme sub-freezing to high temperature
conditions. Whether it be sample testing in a Q.C. lab, developing
ACL STATICIDE & JW Sales new products in engineering or room-temperature testing on
Booth 3233 the manufacturing floor, Akrometrix metrology solutions provide
our customers critical data that leads to repeatable and reliable
Dan Kaiser electronic assemblies utilized in consumer products up to mission
17964 90th Place N., Maple Grove, MN critical military applications.
dkaiser@ACLSTATICIDE.COM
763-402-1825 Allfavor Technology
For over 50 years, ACL, Inc. has developed innovative products Booth 3502
for static control and critical cleaning. We offer cleaning
products for contamination control, PCB basics, and ESD-safe Barry Zielke
products for manufacturing and EPAs including anti-static 905 Albion Ave. , Schaumburg, IL
mats, meters, dissipative floor coatings, and anti-static topicals barry@allfavorpcb-usa.com
including Staticide®. Certified to ISO 9001:2015.
630-913-4263
Allfavor is a PCB manufacturer, manufacturing PCB’s since
Aegis Software 2005. 3 factories located in Shenzhen, Nanjing, & Zhuhai China.
Booth 3328 Producing, high mix, low to medium / high volume rigid PCB’s
Deb Geiger 2-14 layers, flex, rigid flex, RF/HF, & metal clad. We are UL for up
220 Gibraltar Road, Suite 300, Horsham, PA to 6oz copper, Proto’s 3-5 days, Small production 7-10 days and
standard production, 15 days. Our 4th facility focusing on HDI
dgeiger@aiscorp.com
boards will be complete Jan 2022. Our motto is “service beyond
215-773-3571 expectation
Aegis Software delivers a uniquely adaptive manufacturing
execution solution (MES) platform, built on an IIoT backbone,
to improve manufacturing speed, control, and visibility across Alltemated
the entire enterprise and throughout the supply chain. Aegis’ Booth 3340
platform, FactoryLogix®, is designed for today's manufacturing
reality, connecting business-critical systems, processes, and Randy Temple
people---unleashing transformative benefits of Industry 4.0. 541 Northgate Parkway, Wheeling, IL
Aegis is enabling manufacturing excellence in more than 2,200 randy.temple@actionir.com
factories across aerospace, defense, electronics, medical, and 847-394-1891
automotive industries. Since 1993, Alltemated has been the electronics industry’s
preferred choice for one-stop component-preparation services.
Alltemated sets the standard for tape and reel packaging,
IC programming, underflim technology and carrier tape
manufacturing. Widely known for supplying PLACE-N-BOND
underfilms a durable adhesive technology for bonding SMD
components to PCB. Seamlessly integrates with SMT assembly
and eliminates curing and dispensing.
SMTAI Conference & Exhibition
31 November 2 - 4, 2021 | Minneapolis Convention CenterEXHIBITOR
A-Z
American Standard Circuits ASM
Booth 3303 Booth 3025
David Lackey Mark Ogden
475 Industrial Drive, West Chicago, IL 3975 Lakefield Court, Suwanee, GA
815-403-3415 ogden.mark@asmpt.com
dlackey@asc-i.com 770-797-3189
American Standard Circuits (ASC) is a total solutions provider, ASM is the worldwide leading supplier of electronics assembly
manufacturing quality rigid, metal-backed, RF/Microwave, and microelectronics packaging equipment. For over 40 years
flex, and rigid flex PCB's for defense, aerospace, medical, our DEK Screen Printing and SIPLACE Pick and Place SMT
automotive, and industrial markets in volumes from test and machines have been enabling our customers to manufacture
prototypes to large production orders. products for the digital world. In addition, ASM is also provides
a suite of factory software, ASM Works. This enables our
ANDA Technologies customers to optimize workflows and increase productivity.
Booth 3001
Asys Group Americas Inc
Brian Strumm Booth 3019
47639 Lakeview Blvd., Fremont, CA
510-270-8648 Veronika Merino
bstumm@anda.us 140 Satellite Blvd., N.E., Suite D, Suwanee, GA
Anda (Guangdong Anda Automation Solutions Co., Ltd.) veronika.merino@asys-group.com
established in 1999, is an industry 4.0 smart equipment 678-907-5328
and automation solutions manufacturer with over 20 years’ Asys Group Americas, Inc. is located in Suwanee, GA, United
experience manufacturing, developing intelligent automation States and is part of the Commercial and Industrial Machinery
systems, and providing sales/service to fluid applications. Anda and Equipment (except Automotive and Electronic) Repair and
smart equipment and automation systems are used across Maintenance Industry.
industries worldwide. Our products include high precision
dispensing, conformal coating, plasma treatment, curing ovens, BlueRing Stencils
multi-functional assembly, semiconductor manufacturing Booth 3416
equipment, medical electronic dispense/assembly machines,
and smart manufacturing system solutions. Jeremy Glanzer
140 Mount Holly Bypass, Unit 10, Lumberton, NJ
jglanzer@fctassembly.com
ASC International 866-763-3873
Booth 3532
BlueRing is a “full service” stencil & machined parts
Steve Arneson manufacturer committed to supplying advanced technologies
830 Tower Drive, Suite 200, Medina, MN and solutions to various industries. We offer on-time delivery
of high-quality laser cut stencils, transfer increasing nano-
sarneson@ascinternational.com
coatings, fixtures & parts, engineering & development services,
763-479-6210 all committed to give you the highest quality assembly for
ASC International is a leading global manufacturer of 3D solder your specific process. We have heavily invested in the best
paste inspection (SPI) and automated optical inspection (AOI) technology & developed the most qualified team members with
systems. New product innovations will be highlighted by the decades of manufacturing & engineering experience.
industry's most cost effective LineMaster Fusion 3D inline
SPI system and the VisionPro Prey portfolio of offline / inline
AOI solutions. For more information, please visit us at www. BTU International
ascinternational.com Booth 3412
Kirsten Mattson
23 Esquire Road, North Billerica, MA
kmattson@btu.com
978-667-4111
BTU International, a wholly-owned subsidiary of Amtech Group
(Nasdaq: ASYS), is a global supplier and technology leader
of advanced thermal processing equipment solutions in the
electronics manufacturing market. BTU’s high-performance
convection reflow ovens are used in the production of SMT
printed circuit board assemblies and in semiconductor
packaging processes.
SMTAI Conference & Exhibition
32 November 2 - 4, 2021 | Minneapolis Convention CenterEXHIBITOR
A-Z
CCL Design Condair
Booth 3103 Booth 3317
Jeff Zeilinger Erica Ziino
2S004 Lakewood Lane, Wheaton, IL 2700 90th Street, Sturtevant, WI
jzeilinger@cclind.com erica.ziino@condair.com
414-712-9577 509-628-6139
CCL is the global leader of ID solutions and labeling products, For over 70 years, Condair has been the leading commercial
specializing in auto-apply products that can withstand extreme manufacturer of humidification, dehumidification, and
and harsh prossessing challenges in the SMT environment. evaporative cooling for electronics manufacturing and data
CCL products are successfully used in various industries such storage facilities. Ensuring proper humidification can improve
as electronics, medical, aviation, energy, military, automotive, production output, elevate product quality, and boost ROI
security and more. by controlling ESD, reducing de-soldering occurrences,
minimizing brittle components, and offering energy efficiencies.
Circuits Assembly (UP Media) In addition, scientific studies reveal maintaining an optimum
indoor humidity between 40-60%RH improves human health
Booth 3213
and well-being. Visit Booth 3317 to LEARN MORE.
Frances Stewart
fstewart@upmediagroup.com Conductive Containers, Inc.
678-817-1286 Booth 3133
Published by UP Media Group, and serving the global PCB
Kallan Blake
community through PRINTED CIRCUIT DESIGN & FAB/
CIRCUITS ASSEMBLY (print/digital monthly publication),
4500 Quebec Ave. N., New Hope, MN
pcdandf.com and circuitsassembly.com, PCBUPdate.com KBlake@corstat.com
e-newsletter, pcbwest.com conference and exhibition, 763-746-9774
PCB2Day.com seminars and webinars, PCBChat.com podcasts We take pride in providing unique static protective packaging
and other media. solutions that match the way you want your system to work
and our vertically integrated processes put us in the position to
Cluso North America choose the most cost effective way to meet your needs.
Booth 3332 When you add our package design and manufacturing
expertise with our raw material inventory and stock selection,
Bruce Davidson you have CCI’s formula for success.
1133 Northgraves Circle., Kanata, Ontario
bruce@brockelectronics.com
905-815-3693
Cluso InvMan is a system of hardware and software for Smart
Inventory Control storage and retrieval of components used
in the manufacturing operation as well as providing long term
traceability information and MSL device tracing within the
plant. Pick to Light smart shelving on mobile trolleys, fixed
shelving, or in dryboxes significantly improve kitting times and
storage times for much higher efficiency of operation and can
provide significant ROI benefits of well within one year in most
cases.
SMTAI Conference & Exhibition
33 November 2 - 4, 2021 | Minneapolis Convention CenterEXHIBITOR
A-Z
CTI Systems Eltek USA Inc
Booth 3145 Booth 3239
Daniel Gray Connie Herring
751 S Church Street, Goldston, NC 250 Commercial Street, Suite 3010, Manchester, NH
DanielG@ctisystems.net cherring@eltek.us
919-776-7227 Ext: 279 951-833-4763
CTI Systems is a world class manufacturer of PCB assembly ELTEK USA, PCB’s : Flex| Rigid-Flex, Complex Rigid PCB’s.
equipment/Laser marking/PCB depanelers and odd form Wide range of offering: HDI, high aspect ratio, bondable
component insertion. We also provide state of the art PCB finishes. Supporting Aero Space and Defense, Medical,
transport equipment using AGV’s, robotics, and custom Industrial, Communications, and Semiconductor. ITAR-AS900-
automation solutions. IS9001
CyberOptics Corporation ESSEMTEC USA
Booth 3125 Booth 3520
Andrew Larson Don Jeka
5900 Golden Hills Drive , Minneapolis, MN 420 Andbro Drive, Unit 3, Pitman, NJ
alarson@cyberoptics.com don.jeka@essemtec.com
336-814-5689 951-833-4763
CyberOptics Corporation is a leading global developer and Essemtec USA delivers SMT prototyping and highly flexible
manufacturer of high-precision 3D sensing technology pick-and-place equipment, micro dispensing & intelligent
solutions. CyberOptics’ sensors are used for inspection component storage systems.
and metrology in the SMT and semiconductor markets to
significantly improve yields and productivity. By leveraging
its leading edge technologies, the Company has strategically
Europlacer Americas Inc.
Booth 3413
established itself as a global leader in high precision 3D sensors.
Headquartered in Minneapolis, Minnesota, CyberOptics Mike Foster
conducts worldwide operations through its facilities in North 519 US Highway 301 S., Tampa, FL
America, Asia and Europe. mike.foster@europlacer.com
267-884-6760
ELANTAS PDG Europlacer designs, manufactures, sells and services advanced
Booth 3402 SMT Assembly Solutions to the global market, including
screen printing and placement equipment, complemented by
Shayna Kennedy
a suite of software tools designed to provide intuitive set-up,
5200 N 2nd Street, St Louis, MO programming and portable production monitoring functions.
shayna.kennedy@altana.com Over our 50+ years, Europlacer has been the proud recipient of
314-621-5700 numerous prestigious industry awards for product innovation
Every aspect of ELANTAS PDG, INC.'s operations is structured and service excellence, and is the first placement equipment
towards one goal - to accommodate the special needs of the provider to comply with the IPC CFX initiative.
individual customers, large or small, with customized products
for their unique applications. Finetech
ELANTAS PDG, INC. is built on the continuous improvement Booth 3136
concept. We will always provide the world's most reliable,
innovative and cost-effective products to the electrical and Adirenne Gerard
electronics industry by striving to exceed the defined needs and 560 E. Germann Road, Suite 103, Gilbert, AZ
expectations of our customers. adg@finetechusa.com
480-893-1630 114
Finetech supplies rework equipment for a wide range of
applications. The Fineplacer® Core provides precise temperature
and convection flow control, outstanding placement accuracy,
and robust process development for advanced applications.
The Expert 10.6 delivers automated component alignment, large
board handling, non-contact residual solder removal and solder
paste/flux dispensing. For a manual, cost-effective solution, the
Expert 5.6 handles the complete rework process with a high-
resolution camera for fast, accurate and reproducible placement
results. Complimentary units for standalone BGA-CSP reballing
and contactless extraction of residual solder are also available.
SMTAI Conference & Exhibition
34 November 2 - 4, 2021 | Minneapolis Convention CenterEXHIBITOR
A-Z
Fuji America Corporation Global SMT
Booth 3312 Booth 3336
Christine Paliferro Penny Jernigan
171 Corporate Woods Pkwy., Vernon Hills, IL PO Box 2338, Immokalee Road, Naples, FL
christinep@fujiamerica.com accounts@trafalgarmedia.com
224-214-9457 239-245-9264
The Fuji Corporation name is synonymous with reliability and Global SMT & Packaging is the EMS industry’s leading media
trustworthiness. Not only is Fuji Corporation a global leader brand, reporting on new technologies and processes related to
as a machine tool builder, Fuji Corporation ensures productive electronics manufacturing. The monthly magazine is supported
manufacturing of countless additional companies in almost by websites, newsletters and video channels with regular panel
every industry around the world. Fuji Corporation, is simply, the discussions and a Tech Talk Thursday vodcast. The company
standard. also hosts the Global Technology Awards, eSmart Factory and
LTS Conferences.
Garland Service Company
Booth 3212 Hanwha Techwin
Booth 3013
Britt Smith
714 Shepherd Drive, Garland, TX Clay Parkley
bsmith@gscusa.net 6000 Phyllis Drive, Cypress, CA
972-494-1911 clay.parkley@hanwha.com
Garland Service Company (GSC) is a company that specializes 714-373-4200
in the design and manufacturing of tooling and fixtures Hanwha Techwin delivers a comprehensive line of security
associated with the electronics manufacturing industry as well cameras and surveillance solutions for analog and network
as serving as a machining center for various other industries. based systems.
We are ISO 9001 certified and ITAR Registered.
Inovaxe Corporation
Glenbrook Technologies Booth 3307
Booth 3120
Margy Khoshnood
Steven Zweig 260 SW 12th Ave., Deerfield Beach, FL
11 Emery Ave., Randolph, NJ margy@inovaxe.com
szweig@glenbrooktech.com 954-531-1363
973-361-8866 Inovaxe provides innovative SMART Material Storage and
Glenbrook Technologies is a leading worldwide manufacturer Handling Systems. Our Ultra Lean Total Material Handling
of x-ray inspection systems with over 2,800 installations in Solutions address the challenges of dealing with SMT
62 countries worldwide. We offer a complete line of systems components and kits within the manufacturing stockroom
ranging from benchtop to fully automated. Our systems are in and WIP locations and facilitates vendor managed inventory.
use by the leading medical device manufacturers and electronic Find your materials in seconds utilizing InoAuto SMART
contract manufacturers. Glenbrook has offices in the US, Mobile Storage Carts and Racks, Stationary Stockroom and
Germany and Hong Kong. line side storage racks and our InoBar; intelligent storage for
Reels, Tubes, JEDEC trays, PCBs, Solder Stencils, Bulk Items,
Mechanical Bins, and Moisture Sensitive Devices, along with the
Stockroom Management and Inventory Locator Software tools.
SMTAI Conference & Exhibition
35 November 2 - 4, 2021 | Minneapolis Convention CenterYou can also read
