Status of the CMOS image sensor industry - 2016 report sample - From Technologies to Market - Yole Développement
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From
Technologies
to Market
Status of the
CMOS image sensor
industry
2016 report sample
Authors: P. Cambou JL. Jaffard © 2016
Executive Summary
REPORT OBJECTIVES
Provide a clear understanding of applications and related technologies.
Ecosystem identification and analysis:
• Determination of the applications range
Ecosystem
• Technical market segmentation
• Economic requirements by segment
• Key players per market and analysis Market
• Market size and market forecast in $M and Munits
Analysis and description of market and technologies involved:
• Major actors on a global basis Techno
• Detailed applications per market segment
• Technology identification for different products and processes
• Competing technologies
• Main technical challenges
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 3METHODOLOGIES & DEFINITIONS
Yole’s market forecast model is based on the following elementary structured blocks:
Yole’s
analysis
framework
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 4WHAT IS TAKEN INTO ACCOUNT BY THE ANALYSIS ?
From wafer to first packaged sensor
Analysis at the
component
level Courtesy of Xiaomi Courtesy of Apple
Courtesy of Sony Courtesy of Omnivision Courtesy of On Semi
Courtesy of Valeo Courtesy of Tesla
Wafer Die Sensors Modules Systems
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 5TABLE OF CONTENT (1/2)
o GOSSARY 2
o TABLE OF CONTENT 3 3- ECOSYSTEM 52
o REPORT OBJECTIVES 5 • Recent consolidation
• M&A activity
o METHODOLOGY 7
• Ecosystem mapping
o COMPANY CITED 13 • Geographic mapping
o EXECUTIVE SUMMARY 14
1 - INTRODUCTION 30 4- PLAYER & RANKINGS 61
• Historical perspective • Revenue rankings
• Market segmentation • Volume rankings
• 2015 CIS market landscape by application • Revenue breakdown per player
• 2015 CIS market landscape by player • Revenue market share in mobile
• Revenue market share in digital photography
2- MARKET FORECAST 39 • Revenue market share in tablets
• Revenue breakdown • Revenue market share in laptop PC
• 2010 - 2021 CIS volume shipment (in Munits) • Revenue market share in automotive
• 2009 - 2020 CIS revenue forecast (in $M) • Revenue market share in security & surveillance
• 2009 - 2020 Wafer production (in 12”wafer eq.) • Revenue market share in medical X ray
• BSI penetration forecast • Revenue market share in machine vision
• 200mm (8”) to 300mm (12”) transition forecast
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 6TABLE OF CONTENT (2/2)
5 – MOBILE MARKET TREND 78
• Consumer tech device forecast • 2010 - 2021 Medical CIS market forecast
• 2010 - 2021 Mobile market forecast • 2010 - 2021 Security & surveillance market forecast
• Market drivers • 2010 - 2021 Machine vision market forecast
• Resolution mix
• Dual camera trend 8- TECHNOLOGY TREND 128
• Number of camera per smartphone forecast • Image sensor specifications
• BSI technologies
6- CONSUMER MARKET TREND 101 • Samsung S7 focus
• 2010 - 2021 Consumer photography market forecast • PDAF and LDAF approaches
• 2010 - 2021 Action camera market forecast • Key advances
• 2010 - 2021 VR & AR market forecast
• 2010 - 2021 Wearable & smartwatch market forecast 9- CONCLUSIONS 152
• 2010 - 2021 Personal robotics market forecast
10- COMPANY PROFILE 155
7- OTHER MARKET TREND 112
• 2010 – 2021 Computing market forecast
• 2010 – 2021 Automotive market forecast
• Automotive market drivers
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 7COMPANIES CITED IN THE REPORT
Almalence, Ambarella, Apple, Agilent, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, Cmosis, Cognex,
Continental, Core Photonics, Crysview, CSEM, Dongbu HiTek, DXO, Dynamax, e2v, Espros, Evg, Excelitas, Fairchild Imaging,
Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace Valley, Hamamatsu,
Hassellblad, Heliotis, Himax imaging, Honneywell, Hoya, HTC, Huawei, SK Hynix, Image Lab, Imec, Infineon, Invisage,
Invensense, JVC Altasens, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Lytro, Magna,
Magneti Marelli, Mantis Vision, Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging
Technologies, Nikon, NXP, Nvidia, Odos Imaging, Omnivision, Omron, ON Semi, Panasonic, Pelican Imaging, PerkinElmer,
Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Point Grey Research, Pyxalis, Raytrix, Rosnes, Samsung, Sanei Hytech, SETi,
Sharp, SiliconFile, Sirona, Soft Kinetic, SK Hynix, SMIC, Siemens, Socionext, Softkinetics, Soitec, Sony, STMicroelectronics,
SuperPix, Teledyne Dalsa, Teradyne, Tessera, Toshiba, Trixell, Tsmc, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis,
Viimagic, WLCSP, Xiaomi, X-Fab, XinTec, ZTE and more …
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 8ABOUT THE AUTORS OF THIS REPORT
Biography & contact
Pierre Cambou
From 1999, Pierre Cambou has been part of the imaging industry. Pierre took several positions at Thomson TCS which became
Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded a start-up called Vence Innovation (now Irlynx) in
order to bring to market a disruptive infrared Man to Machine interaction technology. He has an Engineering degree from
Université de Technologie de Compiègne and a Master of Science from Virginia Tech. More recently he graduated from Grenoble
Ecole de Management’s MBA. He joined Yole Développement as Imaging Activity Leader in 2014.
Contact: cambou@yole.fr
Jean-Luc Jaffard
From 1966 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at the forefront of the emergence and
growth of this business. At STMicroelectronics Imaging Division he was successively appointed as Research Development and
Innovation Director managing a large multidisciplinary and multicultural team and later on promoted to Deputy General
Manager and Advanced Technology Director in charge of identifying and developing breakthrough Imaging Technologies and to
transform them into innovative and profitable products. In 2010 he was appointed STMicroelectronics Intellectual Property
Business Unit Director. In January 2014 he created the Technology and Innovation branch of Red Belt Conseil.
©2016 | www.yole.fr | Status of ©2015
the CMOS image sensor
| www.yole.fr industry
| Camera Module| Industry
Sample 9Body sample
© 2016WHAT WE GOT RIGHT WHAT WE GOT WRONG
Forecast over the years
We are raising our Historical revenue forecast (in $M)
forecast for CMOS 2010 Fcst 2012 Fcst 2014 Fcst 2015 Fcst 2016 Fcst
Image Sensors
Mostly driven by 20 000
smartphone camera 18 000
crase and the renewal
Our goal is to of applications in the 16 000
predict +/-10% in consumer space, CIS 14 000
5 years time market keeps its 12 000
momentum while
passing the $10B Revenue ($M)
10 000
landmark 8 000
6 000
The main reason for
this forecast increase is 4 000
the early introduction of 2 000
dual cameras in 0
smartphones 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 115TH CMOS IMAGE SENSOR REPORT
• When Yole Développement presented its first report in 2010, the imaging industry was at a turning point as CMOS
image sensor revenues were breaking the 50% threshold in respect to CCD.
• Since last year, the industry has reached the $10B landmark and has become a key technology for major
semiconductor companies such as Sony, Samsung,On Semi and now SK Hynix.
Imaging has
become a • Mobile remains the key application market for CIS, it is demanding in term of volume and performances therefore
mature ASP are kept at a good level for the top notch technology. The industry has reached $10.3B in 2015 and with 10.4%
industry CAGR forecasted for the 2015-2021 period, and will reach $18.8B in 2021.
• Currently the most dynamic CIS markets are mobile and automotive. New features and performance are needed to
serve those markets.
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 12CMOS IMAGE SENSOR PLAYERS
2015 CIS market landscape by player
Leveraging its 2015 - CIS market landscape
by player
technology leadership 1 000
roothed in digital High End
photography and Players
High End
Players
applied to mobile Teledyne Dalsa
$3.0B
markets and benefiting Hamamatsu
Excelitas
$1,2B
100 $0.2B
from resolution Fairchild
Sony is now increases of mobile Canon
taking the lead in secondary camera,
Average Selling Price ($)
AMS Cmosis
volume Sony grabbed both e2v
10 Sharp Samsung
revenue and volume On Semi Sony
leadership in 2015 Panasonic
Toshiba
SK Hynix confirmed it STMicro
was able to supply this 1
Pixart
technologically Pixelplus
Omnivision
Galaxycore Key Players
Key Players
demanding market as Himax SK Hynix
it proved itslelf an Superpix
2nd Tier Players
alternative to 0
2nd Tier Players
Galaxycore -100 100 300 500 700 900 1 100 1 300
Volume Shipment (M units)
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 13CIS REVENUE BREAKDOWN (IN $M)
by market
2015 CIS Revenue breakdown
by market
Security Industrial/Space/Defence
3,8% 2,6%
Medical
0,3%
2014 2015 CAGR2015-2021
Automotive
5,2%
Mobile $5,908 $6,665 12%
2015
Consumer $1,611 $1,401 1%
CIS Revenue Computing $1,187 $1,052 -3%
breakdown Automotive $279 $537 23%
Computing
10,2%
Medical $29 $34 15%
Security
Industrial/Space/Defe
$140 $388 11% 2014 2015
nce $146 $271 10% $9,300M $10,348M
TOTAL $9,300 $10,348 10,4% Consumer
13,5%
Mobile
64,4%
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 14CIS REVENUE RANKING (IN $M)
by player
2015 CIS Revenue market share
by player
PixartPixelplus Other Yole Développement © May 2016
YoY STMicro 2% 1% 5%
2015
Company 2014 Growth 2%
(in $M) Galaxycore
(%)
3%
1 Sony $2,779 $3,645 31% SK Hynix
2015 2 Samsung $1,825 $1,930 6% 3% Sony
35%
CIS Revenue 3 Omnivision $1,378 $1,250 -9% Panasonic
3%
ranking 4 On Semi $670 $810 21%
5 Canon $482 $404 -16% Toshiba
3%
6 Toshiba
7 Panasonic
$360
$244
$350
$336
-3%
38% Canon
4%
2014 2015
8 SK Hynix $200 $325 63%
9 Galaxycore $325 $275 -15%
$9,300M $10,348M
10 STMicro $260 $200 -23% On Semi
8%
11 Pixart $166 $170 2%
12 Pixelplus $114 $130 14%
Other $498 $523 5%
$9,300 $10,348 Omnivision Samsung
12% 19%
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 15MOBILE MARKET TREND
The mobile camera will become a multi sensor optronics interface
# of sensors
Embedded 3D
Interactive
Embedded 3D The world becomes interactive
Photography computational
3+ sensors New embedded 3D imaging
Technology is & video Courtesy of Sony
almost ready Catching up with
DSLR and video
Players are cameras
3 sensors
working on
the killer
applications
2 sensors • Dual Main & sub
• Main & sub camera
camera • 3D mapping
• Dual main or
• Range finder • VR localization
sub camera
• LED Flash • 3D sensing
1 sensor
• Main & sub • LED Illuminator
camera
• LED Flash
Courtesy of Panono Courtesy of Microsoft
2012 2014 2016 2018 2020 2022
©2016 | www.yole.fr | Status of ©2015
the CMOS image sensor
| www.yole.fr industry
| Camera Module |Industry
Sample 16MOBILE MARKET TREND
Dual camera rollout scenario
Dual camera
Penetration
(%) Breaking the 20%
threshold means Apple
Samsung should
or Samsung have
follow
integrated at least one
accordingly
20%
iPhone 7 & 7S dual camera
The question is with dual camera
no more if but
when? Front or back ?
10%
P9 (Rear 13+13Mp) Next HW updates
for Apple
G5 (Rear 16+8Mp)
2%
Yole Développement © May 2016
2016 2017 2018 2019 2020 2021
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 17CONSUMER MARKET TREND
Light field imaging has many intermediaries
Processing x Interactive
Complexity World
Augmented/
- Virtual Mix Reality
Reality 3D/Sphere 3D
- Enhanced videocall
- Morphing Video
3D
Sphere Video
- Video/Movies 3D Video
- Videochat
Pandora’s
box is open
3D
2D Video
virtual world
with interaction
Photosphere
- Object Mapping
-Smart environment
Photosphere - Photosphere interaction
2D Photo 3D
- Photosphere
- Picture 3D 4D Evolution
2D - Selfie
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 18USE OF MACHINE VISION TECHNOLOGY
Disruptive vision sensing technology is transforming all markets
Medical
Systems Industrial
Generation of images Automotive Military
are less and less & Transport & Scientific
intended for human
usage Video
Camcorders Low Volumes
Robotics and Machines have great 1B units
technologies for autonomy & >1M units
will transform interaction Mobile Phones
the imaging Security &
CIS sensors are a key Surveillance >100M units
landscape >10M units
part of this technology
revolution
DSLR & DSC High Volumes
Cameras
Consumer Notebook & tablets
robot
Viewer & Gaming
devices
©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 19EVERY YEAR, YOLE DÉVELOPPEMENT ATTENDS MAIN EVENTS. MEET WITH US AT*:
• NEPCON Japan • ECTC
January 13-15, 2016 – Tokyo, Japan May 31-June 3, 2016 – Las Vegas, USA
• CS International
March 1-2, 2016 – Brussels, Belgium • Sensors Expo & Conf
June 21-23, 2016 – San José, USA
• Image Sensors
March 15-17, 2016 – London, UK • SEMICON West
July 12-15, 2016 – San Francisco, USA
• International Conference and Exhibition on
Device Packaging
March 15-17, 2016 – Fountain Hills, USA • LED Professional Symposium – LpS
September 20-23, 2016 – Bregenz, Austria
• Lab-on-a-Chip European Congress
March 15-16, 2016 – Madrid, Spain • SEMICON Europa
October 25-27, 2016 – Grenoble, France
• APEC
March 20-24, 2016 – Long Beach, USA
• SEMICON Japan
• PCIM Europe December 14-16, 2016 – Tokyo, Japan
May 10-12, 2016 – Nuremberg, Germany
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©2016 | www.yole.fr | Status of the CMOS image sensor industry | Sample 20ORDER FORM
Status of the CMOS image sensor industry 2016: new dynamics in market and technology
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pending orders, without being liable for any compensation.
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endeavours to inform the Buyer of an indicative release date with similar Products meeting the needs of the Buyer. This 8. MISCELLANEOUS
and the evolution of the work in progress. modification shall not lead to the liability of the Seller, All the provisions of these Terms and Conditions are for the
2.2 Some weeks prior to the release date the Seller can propose provided that the Seller ensures the substituted Product is benefit of the Seller itself, but also for its licensors, employees
a pre-release discount to the Buyer similar to the Product initially ordered. and agents. Each of them is entitled to assert and enforce those
The Seller shall by no means be responsible for any delay in 4.6 In the case where, after inspection, it is acknowledged that provisions against the Buyer.
respect of article 2.2 above, and including incases where a the Products contain defects, the Seller undertakes to replace Any notices under these Terms and Conditions shall be given in
new event or access to new contradictory information would the defective products as far as the supplies allow and without writing. They shall be effective upon receipt by the other Party.
require for the analyst extra time to compute or compare indemnities or compensation of any kind for labor costs, The Seller may, from time to time, update these Terms and
the data in order to enable the Seller to deliver a high quality delays, loss caused or any other reason. The replacement is Conditions and the Buyer, is deemed to have accepted the latest
Products. guaranteed for a maximum of two months starting from the version of these terms and conditions, provided they have been
2.3 The mailing of the Product will occur only upon payment delivery date. Any replacement is excluded for any event as set communicated to him in due time.
by the Buyer, in accordance with the conditions contained out in article 5 below.
in article 3. 4.7 T
he deadlines that the Seller is asked to state for the mailing 9. GOVERNING LAW AND JURISDICTION
2.4. The mailing is operated through electronic means either by of the Products are given for information only and are not 9.1
Any dispute arising out or linked to these Terms and
email via the sales department or automatically online via an guaranteed. If such deadlines are not met, it shall not lead to Conditions or to any contract (orders) entered into in
email/password. If the Product’s electronic delivery format any damages or cancellation of the orders, except for non application of these Terms and Conditions shall be settled
is defective, the Seller undertakes to replace it at no charge acceptable delays exceeding [4] months from the stated by the French Commercial Courts of Lyon, which shall have
to the Buyer provided that it is informed of the defective deadline, without information from the Seller. In such case only, exclusive jurisdiction upon such issues.
formatting within 90 days from the date of the original the Buyer shall be entitled to ask for a reimbursement of its first 9.2 French law shall govern the relation between the Buyer and
download or receipt of the Product. down payment to the exclusion of any further damages. the Seller, in accordance with these Terms and Conditions.Yole Développement
From Technologies to Market
© 2016FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
Imaging Photonics
MEMS &
Sensors
MedTech
Compound
Semi.
Manufacturing
LED
Power Advanced Packaging
Electronics Batteries / Energy
Management ©2016 | www.yole.fr | About Yole Développement 224 BUSINESS MODELS
o Consulting and Analysis o Financial services
• Market data & research, marketing analysis • M&A (buying and selling)
• Technology analysis • Due diligence
• Strategy consulting • Fundraising
• Reverse engineering & costing • Maturation of companies
• Patent analysis • IP portfolio management & optimization
www.yole.fr www.yolefinance.com
www.bmorpho.com
o Reports o Media
• Market & Technology reports • i-Micronews.com website
• Patent Investigation and patent infringement risk • @Micronews e-newsletter
analysis • Communication & webcast services
• Teardowns & Reverse Costing Analysis • Events
• Cost Simulation Tool www.i-Micronews.com
www.i-Micronews.com/reports
©2016 | www.yole.fr | About Yole Développement 23A GROUP OF COMPANIES
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Market,
technology and
strategy Manufacturing costs analysis
Teardown and reverse engineering
consulting
Cost simulation tools
www.systemplus.fr
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
©2016 | www.yole.fr | About Yole Développement 24OUR 2016 REPORTS PLANNING
o MEMS & SENSORS − Deposition Technologies Equipment & Materials 2016
− Gas Sensors and Combos 2016 − Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016
− Status of the MEMS Industry 2016*
− Sensors for Cellphones and Tablets 2016 o COMPOUND SEMICONDUCTORS
− Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities − SiC Modules, Devices and Substrates for Power Electronics 2016*
2016… − GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sensors for Biometry and Recognition 2016 − Sapphire Applications & Market 2016: from LED to Consumer Electronics*
− Finger Print Sensors Market and Technologies 2016 − RF GaN Technology and Market Analysis 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016 o LED
− Emerging Non Volatile Memories 2016* − Sapphire Applications and Market 2016: From LED to Consumer Electronics*
− LED Packaging 2016
o IMAGING & OPTOELECTRONICS − Microdisplays and MicroLEDs
− Status of the CMOS Image Sensor Industry 2016* − UV LED Technology, Manufacturing and Applications Trends 2016*
− Uncooled Infrared Imaging Technology & Market Trends 2016* − OLED for Lighting 2016
− Imaging Technologies for Automotive 2016 − LED in Automotive Lighting 2016
− Sensors for Drones & Consumer Robots 2016
− 3D Imaging & Sensing 2016** o POWER ELECTRONICS
− Silicon Photonics 2016 − Power Electronics in Electric and Hybrid Vehicles 2016
− Status of Power Electronics Industry 2016*
o MEDTECH − Passive Components Technologies and Market Trends for Power Electronics 2016
− BioMEMS 2016 − SiC Modules, Devices and Substrates for Power Electronics 2016*
− Point of Need Testing 2016: Application of Microfluidic Technologies − GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends & Market Expectations 2016
o ADVANCED PACKAGING − Power Electronics for Renewable Energy 2016
− FanOut WLP: Technology Trends and Business Update 2016* − Thermal Management for LED and Power 2016
− Embedded Die Packaging: Technology and Markets Trends 2016* − RF GaN Technology and Market Analysis 2016
− 2.5D & 3D IC Business Update 2016
− Status of the Advanced Packaging Industry 2016* o BATTERY
− Advanced Packaging for Wearables and Mobile Applications 2016 − Market Trends and Technologies in Battery Pack and Assembly 2016
− Advanced Packaging in Emerging Markets: China 2016 − Innovative and Emerging Technologies in Energy Storage Market 2016
− Supply Chain Readiness for Panel Manufacturing in Packaging 2016 **To be confirmed
o MANUFACTURING Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on
− Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016** www.i-micronews.com
− Emerging Materials for Advanced Packaging 2016
©2016 | www.yole.fr | About Yole Développement 25OUR 2015 PUBLISHED REPORTS LIST
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles o POWER ELECTRONICS
− Sensors for Wearable Electronics And Mobile Healthcare − Power Packaging Technology Trends and Market Expectations
− Status of the MEMS Industry − Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
− Uncooled Infrared Imaging Technology & Market Trends Electricity Storage Solutions
− Infrared Detector Technology & Market Trends − Status of Chinese Power Electronics Industry
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial − New Technologies and Architectures for Efficient Data Center
− Emerging Non Volatile Memory (NVM) Technology & Market Trends − IGBT Market and Technology Trends
− Status of Power Electronics Industry
o IMAGING & OPTOELECTRONICS − SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− Camera Module Industry − GaN and SiC Devices for Power Electronics Applications
− Uncooled Infrared Imaging Technology & Market Trends
− Status of the CMOS Image Sensors o ADVANCED PACKAGING
− Infrared Detector Technology & Market Trends − Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
o MEDTECH − Fan-in Wafer Level Packaging: Market and Technology Trends
− Sample Preparation Automation Through Emerging Microfluidic Technologies − Flip Chip: Technologies and Markets Trends
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and − Fan-Out and Embedded Die: Technologies & Market Trends
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
o COMPOUND SEMICONDUCTORS Applications
− Sapphire Applications & Market 2015: from LED to Consumer Electronics − Emerging Non Volatile Memory (NVM) Technology & Market Trends
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are
o LED available on www.i-micronews.com
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
©2016 | www.yole.fr | About Yole Développement 26CONTACT INFORMATION
• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Japan & Asia: Takashi Onozawa, Representative Director, Yole KK
Email: onozawa@yole.fr
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email eloy@yole.fr
• Report business
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
• Japan & Asia: Takashi Onozawa, Representative Director, Yole KK.
Email: onozawa@yole.fr Follow us on
• Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
• Taiwan: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
• General
• Email: info@yole.fr
©2016 | www.yole.fr | About Yole Développement 27You can also read
