Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
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From Technologies to Market
Advanced RF
System-in-Package
for Cellphones 2019
Sample
© 2019
TABLE OF CONTENTS
o Introduction 3 o RF SiP packaging 81 o Market forecasts 189
• Methodology • Technology & trends • Cellphone forecast by type & air
• Report synergies • Interconnection trends standards
• Objectives, scope, definitions • Challenges & requirements for 5G • RF components packaging market
at wafer-level & SiP level
• Advanced packaging platforms • Antenna in package
• RF SiP Forecasts in units & market
• Roadmap
• By cellphones category
o Executive summary _______18 • EMI Shielding
• By air standards
o Packaging substrate materials for • By types of SiP modules
5G 150
o Market drivers and dynamics _45 • Wafer starts for RF SiP
• Evolution of cellular networks • Interconnects trend forecast
• Nature of 5G o Players and supply chain 170 • OSATs vs IDMs packaging market
o Disruptions and opportunities • Player landscape and positioning trend
o RF SiP in smartphones 66 • Company strategies o Conclusion 221
o Architectures
o Trend for 5G o Yole Développement presentation
225
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 2
ABOUT THE AUTHOR
Biography & contact
Santosh Kumar
Santosh Kumar is currently working as Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea. He is
involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main
interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-
out / fan-in WLP, flip chip, and 3D/2.5D packaging.
He received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University
of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has
presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
contact: kumar@yole.fr
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 3
COMPANIES CITED IN THE REPORT
(non-exhaustive list)
Amkor (J-Devices, Nanium), Acco, Apple, ASE Group, AT&T, Avago Technologies, Broadcom, Cavendish Kinetics, Cisco, Deca
Technologies, Ericsson, GLOBALFOUNDRIES, Google, HiSilicon, Huawei, Infineon, Intel, JCET/STATS ChipPAC, Lenovo, LG,
Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Murata, NTT Docomo, ON Semiconductor, OPPO, Panasonic,
Peregrine Semiconductor/Murata, Powertech Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks
Solutions, Soitec, Spreadtrum, SPIL, Sprint, TDK-EPCOS, TSMC, Wisol, Xiaomi, ZTE and more…
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 4
REPORT METHODOLOGY
Market forecast methodology
Market segmentation methodology
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 5
REPORT METHODOLOGY
Technology analysis methodology Information collection
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 6
WHO SHOULD BE INTERESTED IN THIS REPORT?
RF component manufacturers Mobile phone OEMs
• Evaluate market potential of future technologies and products • Evaluate market potential of future technologies and products to
differentiate your products
• Understand the differentiated value of your products and
technologies in this market • Evaluate the benefits of using these new technologies in your end
system, design architectures for the next generation of systems
• Build a roadmap for modules: which type of modules? When?
• Screen potential new suppliers able to provide new functionalities,
• Identify new business opportunities or cost and size savings
• Identify potential strategic partners or technology providers
• Monitor and benchmark your competitor’s advancements
R&D centers
• Assess market potential and trends about future technologies and
RF foundries, material and equipment suppliers, products
packaging houses • Distinguish the best candidates for technology transfer
• Understand what are the components and technologies that will
drive the volumes in 2023
• Identify new business opportunities and prospects Financial & strategic investors
• Understand the structure and value chain of RF cellular
technology
RF and component specialists (manufacturers, • Estimate the potential of new technologies such as SOI, RF
fabless), transceiver, modem, software vendors… MEMS,…
• Spot new opportunities and define diversification strategies linked • Get the list of the main key players and emerging start-ups of this
to RF components industry worldwide
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 7
KEY FEATURES OF THIS REPORT
The “RF SiP for Cellphones 2019” is the update of the of the “Advanced RF SiP for Cellphones 2017”
report.The objectives of the report are as follows:
Market overview
o Drivers and dynamics for 5G flavors: 5G mmWave and 5G sub 6 GHz
o Disruptions and opportunities thereof
o Focus on various SiP architectures in RF Front-End of cellphones
o Focus on both cellular and connectivity RF Front End modules
o Market forecast to include both wafer level & SiP level revenue
o RF Front End SiP forecast in Revenue,Wafers, Units by
Technology trends and forecasts
o Cell phone category/type o RF Front-End multi-die System-in-Package challenges and technology
o By cellular & Wi-Fi standards requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands
o By various types of RF Front End SiPs o 5G SiP packaging roadmaps for smartphone Front-End
o Interconnects trends forecsat for RF SiP o Packaging trends for both cellular & connectivity modules
o Antenna in Package (AiP) trends for 5G mmWave
o Substrate trends for 5G mmWave
Supply chain analysis
o Shielding trends
• Supply chain changes in the new 5G era o RF SiP Revenue,Wafer and Unit forecasts
• RF SiP assembly detailed supply chain of various players
• Strategies and outlook of current RF SiP manufacturers
• New entries and supply chain disruptions for mmWave packaging
• Substrate supply chain
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 8
WHAT IS NEW COMPARED TO 2017 REPORT (1/2) ?
• In 2017 RF SiP report, only PAMiD module forecast is covered. The current report extend the RF Front End SiP
scope to include all RF Front End SiP for both cellular & connectivity function in cell phone:
• Cellular
• PAMiD (Power Amplifier Module with Integrated Duplexer)
• PAM (Power Amplifier Module)
• Rx DM (Receive Diversity Module)
• ASM (switchplexer) (Antenna Switch Module)
• Antennaplexers (multiplexer)
• LMM (Low noise amplifier - multiplexer module)
• MMMB PA (Multi-Mode, Multi-Band Power Amplifier)
• mmW FEM
• Connectivity
• WiFi FEM
• WiGig FEM
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 9
WHAT IS NEW COMPARED TO 2017 REPORT (2/2) ?
• Packaging trend covering both wafer level packaging & SiP
• Interconnect trends for various components in RF SiP
• RF Front End SiP forecast in revenue, wafers, units by
o Cell phone category/type
o By cellular & Wi-Fi standards
o By various types of RF Front End SiPs
• Antenna in Package (AiP) trends for 5G mmWave application
• Substrate trends for 5G
• RF SiP assembly detailed supply chain of various players including substrate supply chain
• Packaging roadmap and challenges for 5G sub 6Ghz & mmWave applications
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 10SYSTEM INTEGRATION LEVELS
LEVEL 3:
End
Device/Equipment
iPhone X
LEVEL 1+2:
Semiconductor Package + Board
Semiconductor
LEVEL 2: package
Device/Equipment Si dies
board
iPhone X PCB
LEVEL 1:
Semiconductor
Packaging
Broadcom RF SiP
in the iPhone X
LEVEL 0:
Semiconductor Package Substrate Board (PCB)
Die/Wafer
Power amplifier in Semiconductor
Broadcom RF SiP wafer
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 11KEY TERM DEFINITIONS
• NOTE:
• From a logical viewpoint, the following terms are highly interchangeable and their usage is unfortunately not consistent
throughout the industry
• In order to avoid confusion and enable systematic segmentation, Yole Développement uses the following definitions
• Module: A fairly general term that usually refers to separate circuit(s)/die(s) or component(s) that form a whole due to
functional purpose or special features
• MCM: Multi-Chip-Module, a module containing multiple packages as final components (often, the whole module can be again
overmolded, lided or differently encapsulated)
• MCP: Multi-Chip-Package, any package with multiple dies, with or without integrated passives
• SiP: System-in-Package, strictly speaking, needs to be a type of system, containing 2 or more dies with different functionality, with
or without integrated passives. By definition, an SiP would be a type of multi-die package
NOTE: In this report, a System-In-Package is viewed from a packaging perspective, where the main challenge is integrating multiple dies,
regardless of their functionality. Therefore, in order to simplify and keep the emphasis on packaging technologies, the decision has been taken
to treat all multi-die packages as SiP, even if they do not strictly adhere to a definition of a system. In that sense, it would be fully correct just
to use the term multi-die packages but due to the commonly rooted usage of the term SiP in the industry, in this report SiP is used instead of
multi-die package. For example multiple dies of the same functionality in one package would still be considered as SiP. Furthermore, while it’s
often the case that SiPs include also passives, lack of passives would not change the SiP definition.
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 12KEY TERM DEFINITIONS
• PCB: Printed Circuit Board, abbreviation commonly used for system boards – Yole Développement makes a distinction between
PCB (boards) and semiconductor package substrates (also sometimes referred to as IC substrates)
• Substrate: While a substrate can be considered on various system levels, (i.e. a transistor Si bulk substrate), the term substrate
is here used for semiconductor package substrates (sometimes referred to also as IC substrate), which are package components
between the die and PCB built using semi-additive processing and lamination/build up technology, namely WB/FC package
substrates within FC CSP/BGA or WB CSP/BGA packages
• Thin film RDL: Particular form of redistribution layer formed by thin film technologies, refers to RDLs of Fan-In and Fan-Out
WLP/PLP
• Interposer: Technically, any kind of substrate/RDL has the function of “interposing” between the die and PCB, however for
practical purposes, the term interposer is used for additional interconnect components on top of a substrate, namely Si and
Glass interposers
• Front-End Module (FEM): A multi die package, placed between the transceiver and the antenna that typically consists of filters,
duplexers and switches, not necessarily a power amplifier
• Power-Amplifier Module (PAM): Essentially, a multi-die package of amplifiers but can integrate all components of a FEM as well
NOTE: For easier understanding and due to common usage in the industry, in this report FEM refers to a multi-die package that also contains
a power amplifiers. Therefore, the term FEM is used for multi-die packages that contain filters, switches, duplexers and power amplifiers
(FEMiD or PAMiD can be formal variations of the term FEM)
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 13SCOPE OF THE REPORT
Focus of the report
Mobile phones
Mobile Infrastructure
RF Front- RF front-end components (PA, LNA, filters, switches, antenna tuners)
Main focus
End SiP
packaging for RF Front-End packaging (FEM SiPs)
mobiles
2G, 3G, 4G, 5G technologies
Modems, transceivers, baseband processors, Wi-fi & Bluetooth modules…
Antennas, IPDs, …
Topics NOT included in the report
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 14RF PACKAGING OVERVIEW
>1000W
Power (W)
Power modules
100-1000W
Ceramic lid with Cu flange
Over molded plastic with Cu flange
1-100W
Plastic leadframe (QFN) packages
Ceramic leadframe
(QFN) packages
2.5D interposer
QFN WB/FC CSP WL CSP FO WLP
100
Frequency (GHz)
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 15RF PACKAGING OVERVIEW
>1000W
Power (W)
Power modules
100-1000W
Focus of this report!
Advanced packages
for RF devices in
smartphone Front-
Ceramic lid with Cu flange
Ends
Over molded plastic with Cu flange
1-100W
Plastic leadframe
(QFN) packages Ceramic leadframe
(QFN) packages
2.5D interposer
QFN WB/FC CSP WL CSP FO WLP
100
Frequency (GHz)
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 16CELLULAR TECHNOLOGY DEVELOPMENT
From 2G to 5G: Less than a 30 years’ journey
Other standards from IEEE family
including WiMAX and iBurst
TDD-
CDMA2000 EV-DO Rev LTE-
CDMA CDMA2000 1xRTT 1xEV-DO A/B/C TDD-LTE Advanced LTE-A
5G sub-6GHz 5G mmWave
TD-SCDMA TD-HSPA Pro
GSM GPRS EDGE TD-CDMA FDD-
FDD-LTE LTE-
WCDMA HSPA HSPA+ Advanced
All belong
to UMTS Will be a globally
technology unified standard!
2G 2.5G 2.75G/Pre-3G 3G 3.5G 3.9G/Pre-4G 4G 4.5G Pre-5G 5G
It takes around 10 years between two cellular generations, including a long transition phase with intermediate technologies.
1992 1997 2001 2007 2010 2013 2018 2020
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 17APPLICATION MAPPING
Cloud Computing
Autonomous Vehicle
Frequency(GHz)
Advanced AI assistant Medical Robot MMWAVE
(>24GHZ)
5G use cases Robotic Service
extend far Wireless VR
SUB-6
beyond mobile
phone, from IoT GHZ
to autonomous Drone Delivery
vehicle, creating
New Gaming Content
AR
Real-time Translation SUB-1
new challenges
for the network Smart City GHZ
in terms of data 360° Video Telepresence
rate and latency Industrial Automation
4K video streaming
agility. 20 Smart Grid
15 2025
10 Connected 2024
Asset Tracking
5 2023
4 Wearable Agriculture
2022
3 Port Management
2 Connected Home 2021
1 2020
0.5 2019
Remote Surveillance
0.3 2018
Shared Utilities 0
2017
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 18DIFFERENT PATH, DIFFERENT USE CASES
Mobile broadband
Cat 21 Mostly video driven
Mass market
Mobile broadband
driven by down/up link
data rate race required
for video: multi Giga bit
UE devices and routers
penetrating the market.
IoT devices spread
through various market
segments (consumer,
industrial, automotive,
health, …) mostly
driven by the data
quest. IoT devices
Data centric (tracking, health, survey, …)
Plenty of different use cases
Huge market potential
Courtesy of U-Blox
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 19SMARTPHONE COMPONENTS FOUND IN SiP In SiP Not in SiP
GPS
Antenna
Front End PMU
Tuner Switch PA
Module Module
Battery Touchscreen LCD
PMU
Transceiver Modem
Front End LNA
Module USB/charger
TS Display
Antenna Front controller Driver
Filter /
Switch End LNA
Duplexer
Module Module
Pressure Gyro
3-axis
accelerometer Compass
Application processor
PA WiFi/BT/FM 6-axis IMU Barometer
(PoP)
Heart rate
WiFi FEM
Camera Audio
MEMS mic
NFC NFC Back codec
booster controller
Memory ISP
Camera
MEMS mic
Front
storage
LED Flash
LED Flash
driver
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 20RF FRONT-END MODULE DEFINITION
Front-End Module with Integrated Duplexer (FEMiD) and Power Amplifier Module with Integrated Duplexer (PAMiD)
An RF
FEM can
include power
amplifiers (PA)
or low noise
amplifiers
(LNA), filters,
switches and
an antenna
tuner.
RF FEM in a cellular handset
Courtesy of Qualcomm, modified by Yole
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 21RF SIP PACKAGING
SMT
Wire
BGA/LGA
bond
Various
process
SiP
modules used assembly
in SiP assembly
Inspection
Molding
& Test
Shielding
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 22MOBILE RF FEM PACKAGE TREND
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 23RF FRONT END ARCHITECTURE- HIGH END PHONE (5G MM WAVE)
mmWave baseband
modem
Enveloppe
Tracker
SiP technology Antenna+RF
LNA Filter transceiver+PMIC
mmWave AiP
PA Filter
5G PAM
• RF front end has Tuner
3G/LTE PAM MHB
been complexified
since integration of Baseband
new technologies Modem
3G/LTE LB PAM
such as Carrier Multiplexer Tuner
4x4 MIMO DL
Aggregation, MIMO Transceiver CA
and later on dual (integrated with PMIC) 2G PAM
connectivity.
mmWave Tuner
connectivity will Antennaplexer
add another RF MIMO
Filter
path to the UE. LNA
Filter Tuner
GPS module Diversity receive
May be shared
2x2 MIMO DL
Wi-Fi/BT module Diversity receive
Diversity receive
May be integrated
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 24INTERCONNECTS IN RF SIP
Interconnects
in RF SiP
Flip-chip TSV + RDL+ TSV + Wire
Wire-bond
( Bump) Flip-chip bond
Power Amplifiers, BAW Filters Power Amplifiers
Switches, Filters
Different Cu pillar Au bump
Solder
interconnects (plated) (plated/stud)
in SiP
Power Amplifiers, BAW SAW filters,
Filters, Switches BAW filters
Paste printing Ball drop Plated
Filters Filters
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 25TECHNOLOGY TOOLBOX FOR RF SIP FOR 5G MOBILE
Double side
assembly
Low loss materials Double side mold
Packaging Antenna in
Embedded active
package
innovations integration
& passives
needed at
various levels
Miniaturized Conformal &
passive compartmental
components shielding
Thin substrate
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 26ANTENNA KEY PARAMETERS
Effective area
Polarization Gain
Antenna
Antenna
parameters key
parameters
Efficiency Bandwidth
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 27ANTENNA FOR 5G MM-WAVE SMARTPHONES
Considerations
for antenna for
5G mm-Wave
smartphones
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 28SUBSTRATE MATERIALS FOR MM WAVE APPLICATION
Key parameters for 5g substrate
Stability of Electrical
and Physical
Properties against
Temperature and
Humidity Variation
Manufacturing
Design Rule
Supply Chain
Capability
Readiness
Various
parameters
have to keep
in mind to
select
substrate for
5G Panel Size, Process
application Throughput and
Cost
Multilayer Capability
Electrical Properties
Process tolerances
vs. Frequency
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 29RF FRONT-END ECOSYSTEM COMPLEXITY
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 30CELLPHONE AIR INTERFACE STANDARD DEVELOPMENT
Despite a slow
down in mobile
market growth,
RF Front-End
market is still
expected to
increase
because of
complexity
encountered in
LTE-A Pro and
5G sub 6.
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 31ASSEMBLY / PACKAGING MARKET FOR RF SIP FOR MOBILE
Included in Component available as
Cap wafer RDL/
market forecast SMT component in SiP TSV Bumping Dicing
assembly / Flip-chip bonding UBM
Wafer level BAW filters SAW filters Filters / Switches / IPDs
Assembly of Prior to SiP
various RF assembly
components in Assembly of RF
SiP basically components
consists of 2
process: Wafer
level assembly Component available as
& SiP level Wafer Wafer
bare die (in wafer form) in Inspection
assembly SiP assembly / wire-bond
grinding dicing
process
Included in SiP level
SMT Wire bond Molding Shielding BGA/LGA Test
market forecast
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 32TOTAL ASSEMBLY MARKET FORECAST FOR RF SIP IN MOBILE
Total assembly
/ packaging
market for the
RF SiP in
mobile will
grow at 11%
CAGR to
reach from
$XX B in 2017
to $XX B by
2023
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 33RF FEM MARKET FORECAST
By cellular & connectivity air standards (in $M)
Limited
adoption of
5G mmWave,
in terms of
revenue.
RF FEM SiP
supporting
5G mmW
and 5G sub6
will grow at
CAGR of
111% & 51%
respectively
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 34RF FEM SIP PACKAGING MARKET FORECAST
By smartphone type (in $M)
In 2023, high-end
smartphone
contributes XX
% RF FEM SiP
assembly market,
followed by low-
end smartphone
(XX %) and
luxury
smartphone (XX
%)
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 35INTERCONNECT TREND IN RF SIP FOR MOBILE
%age in terms of interconnects units counts
XXXXX
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 36RELATED REPORTS
Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019 37Source: Wikimedia Commons
Yole Développement
From Technologies to Market
© 2019YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE
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& Healthcare & Software & Software
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Life Photonics,
Sciences & Sensing
Healthcare
& Display
Power Photonics,
& Wireless Sensing & Display
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o Power Electronics o MEMS, Sensors & Actuators
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©2019 | www.yole.fr | About Yole Développement 24 BUSINESS MODELS
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• Market data & research,
marketing analysis
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©2019 | www.yole.fr | About Yole Développement 36 COMPANIES TO SERVE YOUR BUSINESS
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consulting Teardown and reverse engineering Patent assessment
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©2019 | www.yole.fr | About Yole Développement 4OUR GLOBAL ACTIVITY
Europe office
Frankfurt
Paris
Nantes
Yole Korea Yole Inc.
HQ in Lyon
Seoul Phoenix
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Nice Palo Alto
40%
Greater
China office
Hsinchu
of our business
30%
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and Market
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Breadth of the analysis
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Q&A Meet the Custom
Service Analyst Analysis
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users and software
developers
Our analysts Device manufacturers
provide
market
analysis,
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evaluation, Suppliers: material, equipment,
and business
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Industrial Medical
We work and defense systems
across
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understand Energy
the impact of management Automotive
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Moore
technologies
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to system Transportation and
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From A to Z…
©2019 | www.yole.fr | About Yole Développement 8REPORTS COLLECTION
o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now
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and 10 new monitors. Combining respective expertise and methodologies from the three companies, they cover:
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©2019 | www.yole.fr | About Yole Développement 9OUR 2019 REPORTS COLLECTION (1/4)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
Market – Technology – Strategy – by Yole Développement
Yole Développement (Yole) offers market reports including quantitative market forecasts,
technology trends, company strategy evaluation and indepth application analyses. Yole will The markets targeted are :
publish more than 55 reports in 2019, with our partner PISEO contributing to some of
the lighting reports. • Mobile & Consumer
Reverse Costing® – Structure, Process and Cost Analysis – by • Automotive & Transportation
System Plus Consulting
The Reverse Costing® report developed by System Plus Consulting provides full • Medical
teardowns, including detailed photos, precise measurements, material analyses,
manufacturing process flows, supply chain evaluations, manufacturing cost analyses and • Industrial
selling price estimations. The reports listed below are comparisons of several analyzed
components from System Plus Consulting. More reports are however available, and over
60 reports will be released in 2019.The complete list is available at www.systemplus.fr.
• Telecom & Infrastructure
Patent Reports – by KnowMade • Defense & Aerospace
More than describing the status of the IP situation, these analyses provide a missing link
between patented technologies and market, technological and business trends. They offer
• Linked reports are dealing with the same topic to provide
an understanding of the competitive landscape and technology developments from a
patent perspective. They include key insights into key IP players, key patents and future
• a more detailed analysis.
technology trends. For 2019 KnowMade will release over 15 reports.
©2019 | www.yole.fr | About Yole Développement 10OUR 2019 REPORTS COLLECTION (1/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
MEMS & SENSORS RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Status of the MEMS Industry 2019 - Update • RF GaN Market: Applications, Players, Technology,
• Status of the Audio Industry 2019 - New and Substrates 2019 - Update
• Uncooled Infrared Imagers and Detectors 2019 – Update • 5G’s Impact on RF Front-End Module and Connectivity
• Consumer Biometrics:Technologies and Market Trends 2018 for Cell Phones 2019 – Update
• MEMS Pressure Sensor Market and Technologies 2018 • 5G Impact on Wireless Infrastructure 2019
• Gas & Particle Sensors 2018 • Radar and V2X Market & Technology for Automotive 2019 - Update
o STRUCTURE, PROCESS & COST REPORT • Advanced RF Antenna Market & Technology 2019 - New
• MEMS & Sensors Comparison 2019 • RF Standards and Technologies for Connected Objects 2018
• MEMS Pressure Sensor Comparison 2018 o STRUCTURE, PROCESS & COST REPORT
• Particle Sensors Comparison 2019 • RF Front-End Module Comparison 2019 - Update
• Miniaturized Gas Sensors Comparison 2018 • Automotive Radar RF Chipset Comparison 2018
o PATENT REPORT o PATENT REPORT
• MEMS Foundry Business Portfolio 2019 - New • Antenna for 5G Wireless Communications 2019 - New
• Miniaturized Gas Sensors 2019 - New • RF Front End Modules for Cellphones 2018
• RF Filter for 5G Wireless Communications: Materials and Technologies 2019
PHOTONIC AND OPTOELECTRONICS • RF GaN : Materials, Devices and Modules 2018
o MARKET AND TECHNOLOGY REPORT
• Photonic Integrated Circuit 2019 - New
• LiDARs for Automotive and Industrial Applications 2019 - Update
• Silicon Photonics 2018
o PATENT REPORT
• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New
• LiDAR for Automotive 2018
Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 11OUR 2019 REPORTS COLLECTION (2/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
IMAGING MICROFLUIDICS
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Status of the CIS Industry 2019: Technology • Status of the Microfluidics Industry 2019 - Update
and Foundry Business - Update • Next Generation Sequencing & DNA Synthesis - Technology,
• Imaging for Automotive 2019 - Update Consumables Manufacturing and Market Trends 2019 - New
• Neuromorphic Technologies for Sensing 2019 - Update • Organ-on-a-Chip Market & Technology Landscape 2019 - Update
• Status of the CCM and WLO Industry 2019 - Update • Point-of-Need Testing Application of Microfluidic Technologies 2018
• Machine Vision for Industry and Automation 2018 • Liquid Biopsy: from Isolation to Downstream Applications 2018
• Sensors for Robotic Vehicles 2018 • Chinese Microfluidics Industry 2018
o STRUCTURE, PROCESS & COST REPORT o PATENT REPORT
• Compact Camera Modules Comparison 2019 • Microfluidic Manufacturing Technologies 2019 – New
• CMOS Image Sensors Comparison 2019
o PATENT REPORT INKJET AND ACCURATE DISPENSING
• Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New o MARKET AND TECHNOLOGY REPORT
• Apple iPhone X Proximity Sensor & Flood Illuminator 2018 • Inkjet Printheads - Dispensing Technologies
& Market Landscape 2019 - Update
MEDICAL IMAGING AND BIOPHOTONICS • Emerging Printing Technologies
o MARKET AND TECHNOLOGY REPORT for Microsystem Manufacturing 2019 - New
• X-Ray Detectors for Medical, Industrial • Piezoelectric Materials from Bulk to Thin Film 2019 - New
• and Security Applications 2019- New • Inkjet Functional and Additive Manufacturing for Electronics 2018
• Microscopy Life Science Cameras: Market and Technology Analysis 2019 o STRUCTURE, PROCESS & COST REPORT
• Ultrasound technologies for Medical, Industrial • Piezoelectric Materials from Bulk to Thin Film Comparison 2019
and Consumer Applications 2018
o PATENT REPORT
• Optical Coherence Tomography Medical Imaging 2018
Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 12OUR 2019 REPORTS COLLECTION (3/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
BIOTECHNOLOGIES MEMORY
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• CRISPR-Cas9 Technology: From Lab to Industries 2018 • Status of the Memory Business 2019 - New
o PATENT REPORT • MRAM Technology and Business 2019 - New
• Personalized Medicine 2019 – New • Emerging Non Volatile Memory 2018
o STRUCTURE, PROCESS & COST REPORT
BIOMEMS & MEDICAL MICROSYSTEMS • Memory Comparison 2019
o MARKET AND TECHNOLOGY REPORT o PATENT REPORT
• Medical Wearables: Market & Technology Analysis 2019 - New • Magnetoresistive Random-Access Memory (MRAM) 2019 - New
• Neurotechnologies and Brain Computer Interface 2018 • 3D Non-Volatile Memory 2018
• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences
& Healthcare 2018 ADVANCED PACKAGING
o PATENT REPORT
o MARKET AND TECHNOLOGY REPORT
• 3D Cell Printing 2019 - New • Fan Out Packaging Technologies and Market Trends 2019 - Update
• Circulating Tumor Cells Isolation 2019 - New • 3D TSV Integration and Monolithic Business Update 2019 - Update
• Nanopore Sequencing 2019 - New • Advanced RF SiP for Cellphones 2019 - Update
• Status of Advanced Packaging 2019 - Update
SOFTWARE AND COMPUTING • Status of Advanced Substrates 2019 - Update
o MARKET AND TECHNOLOGY REPORT • Panel Level Packaging Trends 2019 - Update
• Artificial Intelligence Computing For Automotive 2019 - New
• System in Package (SiP) Technology and Market Trends 2019 - New
• Hardware and Software for Artificial Intelligence (AI)
• Trends in Automotive Packaging 2018
in Consumer Applications 2019 - Update
• Thin-Film Integrated Passive Devices 2018
• From Image Processing to Deep Learning 2019 - Update
o STRUCTURE, PROCESS & COST REPORT
• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC
and Gaming 2019 – New • Advanced RF SiP for Cellphones Comparison 2019
Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 13OUR 2019 REPORTS COLLECTION (4/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
SEMICONDUCTOR MANUFACTURING SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Nano Imprint Lithography 2019 - New • Status of the Solid State Light Source Industry 2019 - New
• Equipment and Materials for Fan Out Packaging 2019 - Update • Edge Emitting Lasers (EELS) 2019 - New
• Equipment for More than Moore: Thin Film Deposition • Light Shaping Technologies 2019 - New
& Etching 2019 - New • Automotive Advanced Front Lighting Systems 2019 - New
• Wafer Starts for More Than Moore Applications 2018 • VCSELs - Technology, Industry and Market Trends 2019 - Update
• Polymeric Materials at Wafer-Level • IR LEDs and Laser Diodes – Technology, Applications,
for Advanced Packaging 2018 and Industry Trends 2018
• Bonding and Lithography Equipment Market • Automotive Lighting 2018: Technology, Industry and Market Trends
for More than Moore Devices 2018 • UV LEDs - Technology, Manufacturing and Application Trends 2018
o STRUCTURE, PROCESS & COST REPORT • LiFi: Technology, Industry and Market Trends 2018
• Wafer Bonding Comparison 2018 o STRUCTURE, PROCESS & COST REPORT
o PATENT REPORT • VCSEL Comparison 2019
• Hybrid Bonding for 3D Stack 2019 – New o PATENT REPORT
• VCSELs 2018
DISPLAY
o MARKET AND TECHNOLOGY REPORT
• Next Generation 3D Display 2019 - New
• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New
• Micro-and Mini-LED Displays 2019 - Update
• QD and Wide Color gamut (WCG)
Display Technologies 2019 - Update
• Displays & Optical Vision Systems for VR,AR & MR 2018
o PATENT REPORT
• MicroLED Displays : Intellectual Property Landscape 2018
Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 14OUR 2019 REPORTS COLLECTION (5/5)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
POWER ELECTRONICS BATTERY & ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT o MARKET AND TECHNOLOGY REPORT
• Power SiC: Materials, Devices and Applications 2019 - Update • Status of the Rechargeable Li-ion Battery Industry 2019 - New
• Power Electronics for EV/HEV and e-mobility: • Li-ion Battery Packs for Automotive and Stationary Storage
Market, Innovations and Trends 2019 - Update Applications 2019 - Update
• Status of the Power Electronics Industry 2019 - Update o PATENT REPORT
• Discrete Power Packaging : Material Market • Battery Energy Density Increase: Materials
and Technology Trends 2019 - New and Emerging Technologies 2019 - New
• Status of the Power ICs Industry 2019 - Update • Solid-State Batteries 2019 - New
• Status of the Passive Components for the Power Electronics • Status of the Battery Patents 2018
Industry 2019 - Update
• Status of the Inverter Industry 2019 - Update COMPOUND SEMI.
• Status of the Power Module Packaging Industry 2019 - Update o MARKET AND TECHNOLOGY REPORT
• Wireless Charging Market Expectations • Emerging Compound Semiconductor
and Technology Trends 2018 Market & Technology Trends 2019 - New
• Power GaN 2018: Epitaxy, Devices, Applications • Status of the Compound Semiconductor Industry 2019 - New
and Technology Trends • InP Materials, Devices and Applications 2019 - New
o STRUCTURE, PROCESS & COST REPORT • GaAs Wafer and Epiwafer Market: RF, Photonics,
• Automotive Power Module Packaging Comparison 2018 LED and PV Applications 2018
• GaN-on-Silicon Transistor Comparison 2019 o PATENT REPORT
• SiC Transistor Comparison 2019 • GaN-on-Silicon Substrate: Materials, Devices
o PATENT REPORT and Applications 2019 - Update
• Power SiC : Materials, Devices and Modules 2019 - New
• Power GaN : Materials, Devices and Modules 2019 – Update
Update : 2018 version still available ©2019 | www.yole.fr | About Yole Développement 15OUR 2019 MONITORS COLLECTION (1/2)
Get the most updated overview of your market to monitor your strategy
Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to
provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can
benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.
Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.
MARKET MONITOR by Yole Développement o COMPOUND SEMI. – NEW
This monitor will describe how the compound semiconductor industry is evolving. It
A FULL PACKAGE: will offer a close look at GaAs, InP, SiC, GaN and other compounds of interest
The monitors will provide the evolution of the market in units, wafer area and revenues. providing wafer volumes, revenues, application breakdowns and momentum.
They will also offer insights into what is driving the business and a close look at what is Frequency: Quarterly, starting from Q3 2019
happening will also be covered in it.
o CAMERA MODULE – NEW
The following deliverables will be included in the monitors: This monitor will provide the evolution of the imaging industry, with a close look at
• An Excel database with all historical and forecast data image sensor, camera module, lens and VCM. Volumes, revenues and momentum of
companies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.
• A PDF slide deck with graphs and comments/analyses covering the expected Frequency: Quarterly, starting from Q3 2019
evolutions
o MEMORY – UPDATE
o ADVANCED PACKAGING – NEW For the memory industry you can have access to a quaterly monitor, as well as an
This monitor will provide the evolution of the advanced packaging platforms. It will additional service, a monthly pricing. Both services can be bought seprately:
cover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),
• DRAM Service: Including a quarterly monitor and monthly pricing.
Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5D
and 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q3 • NAND Service: Including a quarterly monitor and monthly pricing.
2019
REVERSE TECHNOLOGY MONITOR by System Plus Consulting
o SMARTPHONES – NEW
To stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone Reverse
Technology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at the
beginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.
©2019 | www.yole.fr | About Yole Développement 16OUR 2019 MONITORS COLLECTION (2/2)
Get the most updated overview of your market to monitor your strategy
PATENT MONITOR by KnowMade o Li-ion Batteries
Anodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made of
A FULL PACKAGE: Lithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium Nickel
Starting at the beginning of the year, the KnowMade monitors include the following Cobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), Lithium
deliverables: Metal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytes
including liquid, polymer/gel, and solid inorganics; ceramic and other separators;
• An Excel file including the monthly IP database of: battery cells including thin film/microbattery, flexible, cylindrical and prismatic; and
• New patent applications battery packs and systems.
• Newly granted patents o Post Li-ion Batteries
• Expired or abandoned patents Battery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-
• Transfer of IP rights through re-assignment and licensing air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,
• Patent litigation and opposition battery cells and battery packs/systems.
• Quarterly report including a PDF slide deck with the key facts & figures of the o Solid-State Batteries
quarter: IP trends over the three last months, with a close look to key IP players and Supply chain including electrodes, battery cells, battery packs/systems and
key patented technologies. electrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,
including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,
o GaN for Power & RF Electronics sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.
Wafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductor
devices such as transistors, and diodes, devices and applications including converters, o RF Acoustic Wave Filters
rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits Including Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, Bulk
(MMICs), packaging, modules and systems. Acoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-
Mounted Resonator (BAW-SMR), and Packaging.
o GaN for Optoelectronics & Photonics
Wafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices such o RF Power Amplifiers
as LEDs and lasers; and applications including lighting, display, visible communication, Including Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wave
photonics, packaging, modules and systems. technology.
o RF Front-End Modules
o Microfluidics
From components to chips and systems, including all applications.
©2019 | www.yole.fr | About Yole Développement 17MICRONEWS MEDIA
o About Micronews Media ONLINE ONSITE INPERSON
To meet the growing demand for market,
@Micronews e-newsletter
technological and business information,
i-Micronews.com
Micronews Media integrates several tools able Events Webcasts
i-Micronewsjp.com
to reach each individual contact within its FreeFullPDF.com
network.We will ensure you benefit from this.
Brand visibility, networking
Targeted audience
opportunities
involvement equals clear,
Unique, cost-effective ways Today's technology makes it
concise perception of your
to reach global audiences. easy for us to communicate
company’s message.
Online display advertising regularly, quickly, and
Webcasts are a smart,
campaigns are great strategies inexpensively – but when
innovative way of
for improving your understanding each other is
communicating to a wider
product/brand visibility. They critical, there is no substitute
targeted audience. Webcasts
are also an efficient way to for meeting in-person. Events
create very useful, dynamic
adapt with the demands of the are the best way to exchange
reference material for
times and to evolve an effective ideas with your customers,
attendees and also for
marketing plan and strategy. partners, prospects while
absentees, thanks to the
increasing your brand/product
recording technology.
visibility.
Benefit from the i-Micronews.com
traffic generated by the 11,200+ Several key events planned for Gain new leads for your business
monthly unique visitors, the 2018 on different topics to from an average of 340
10,500+ weekly readers of attract 120 attendees on average registrants per webcast
@Micronews e-newsletter
Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Director
©2019 | www.yole.fr | About Yole Développement 18CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT o FINANCIAL SERVICES (in partnership with Woodside
BUSINESS Capital Partners)
• North America: • Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Steve LaFerriere, Senior Sales Director for Western US &
Canada • Ivan Donaldson,VP of Financial Market Development
Email: laferriere@yole.fr – + 1 310 600-8267 Email: ivan.donaldson@yole.fr - +1 208 850 3914
• Troy Blanchette, Senior Sales Director for Eastern US & o CUSTOM PROJECT SERVICES
Canada
• Jérome Azémar, Technical Project Development Director
Email: troy.blanchette@yole.fr – +1 704 859-0453
Email: azemar@yole.fr - +33 6 27 68 69 33
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager, Asia Business o GENERAL
Development (India & ROA)
Email: onozawa@yole.fr - +81 34405-9204 • Camille Veyrier, Director, Marketing & Communication
Email: veyrier@yole.fr - +33 472 83 01 01
• Miho Othake, Account Manager (Japan)
• Sandrine Leroy, Director, Public Relations
Email: ohtake@yole.fr - +81 3 4405 9204
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Itsuyo Oshiba, Account Manager (Korea & Singapore)
• Email: info@yole.fr - +33 4 72 83 01 80
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager Follow us on
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
©2019 | www.yole.fr | About Yole Développement 19You can also read
