INVESTOR PRESENTATION - February 2019 IIVI - II-VI Incorporated
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INVESTOR PRESENTATION
February 2019
IIVI
Safe Harbor Statement
This communication contains “forward-looking statements” within the meaning of the federal securities laws, including Section 27A of
the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements often address expected
future business and financial performance and financial condition, and often contain words such as “expect,” “anticipate,” “intend,”
“plan,” “believe,” “seek,” “see,” “will,” “would,” “target,” similar expressions, and variations or negatives of these words. Forward-
looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause actual
results to differ materially from those expressed in any forward-looking statements. Important factors that may cause such a difference
include: (i) the ability of II-VI Incorporated (“II-VI”) and Finisar Corporation (“Finisar”) to complete the proposed transaction on the
anticipated terms and timing or at all, (ii) potential litigation relating to the proposed transaction, (iii) inherent risks and costs associated
with the integration of the businesses and achievement of the anticipated synergies, (iv) potential disruptions from the proposed
transaction that may harm the parties’ respective businesses, (v) the ability of the parties to retain and hire key personnel, (vi) adverse
legal and regulatory developments or determinations that could delay or prevent completion of the proposed transaction, and (vii) the
ability of II-VI to consummate financing related to the transaction. Additional risks are described under the heading “Risk Factors” in II-
VI’s Annual Report on Form 10-K for the year ended June 30, 2018, filed with the U.S. Securities and Exchange Commission (the “SEC”)
on August 28, 2018, and in Finisar’s Annual Report on Form 10-K for the year ended April 29, 2018, filed with the SEC on June 15, 2018.
These risks, as well as other risks associated with the proposed transaction, will be more fully discussed in a joint proxy
statement/prospectus that will be included in a registration statement on Form S-4 to be filed by II-VI with the SEC in connection with
the proposed transaction. Neither II-VI nor Finisar assumes any obligation to publicly provide revisions or updates to any forward looking
statements, whether as a result of new information, future developments or otherwise, should circumstances change, except as
otherwise required by securities and other applicable laws.
Page 2
II-VI At a Glance
II-VI Overview
Refers to groups II and VI of
“TWO SIX” the Periodic Table of Elements
20%
31% 25%
Regions 46% Segments Markets 46%
40%
Q2 FY2019 Q2 FY2019 Q2 FY2019
22% Revenue Revenue Revenue
8% 10%
23% 11%
Core Competency 11,500+ 14 342.9M
52
ENGINEERED MATERIALS Worldwide employees Worldwide Locations Countries Q2 FY2019
Revenue
Page 4
Our Core & Growth Markets
Core Markets New Growth Markets
• Optical Communications • EUV Lithography
• Industrial Lasers • SiC for Wireless
• Military • SiC for EV
• 3D Sensing
Page 5
20+ Years of Tremendous Value Creation by Integration of Acquisitions
$1,159
$972
$827
$742
$683
$551
$487 $516
$316 $292 $333
$224 $225
$187
$123 $114 $128 $143
$62 $74 NASDAQ
$28 $38 $53 $61 S&P 500
IPO 1987 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018
ZnSe Optical Compound Semi.
Micro-optics UV Filters Selenium Micro-optics Optical Amplifiers
Growth Photop Technologies
Channel Oclaro Optical Amplifier Wafer Fab
VIrgo Optics Laser Power Corp Refinery
Laser Power Corp Monitors Kaiam Laser Limited(U.K.
Pacific Rare Metals Aegis Lightwave Fab)
Micro-
Silicon Carbide Thermo-electric Coolers Metal Matrix Epiwafer
optics
Lighting Optical
Litton SIC Group Marlow Industries Components Foundry
M Cubed Technologies Epiworks
Laser Processing Conformal Patterning Semiconductor Lasers Faraday Rotator
Acquisition History Heads
Highyag
Max Levy Autograph Oclaro Semiconductor Laser Integrated Photonics
Military & Aerospace Direct Diode Lasers
Optical Systems Direct Diode
LightWorks Optics
IIVI Advanced Coatings GaAs & GaN-SiC Devices
Oclaro Optical Coatings Anadigics
Page 6
Proven Integration Playbook Focused on Operational Improvements and
Investing for Growth
Oclaro Semiconductor Laser Business Case Study
Transaction Overview II-VI Laser Enterprise Revenue and Operating Margin
Target had a high unit Then (@ Acquisition) Now
cost structure
42%
1
With vertical integration
and wide applicability in
optical and industrial
markets, II-VI drove (45%)
Semiconductor margin expansion over
Laser business subsequent years FY14 FY18
Revenue Op. Margin
1. Oclaro’s semiconductor laser business was acquired in FY2014.
Page 7
Acquisition of Finisar
A Transformative Combination
$2.5B
Pro Forma Revenue1 7 Target End Markets
$570M $22B
Pro Forma EBITDA1 Addressable Market Size2
70 24K+
Locations Worldwide Total Employees Worldwide
Diversified Global Footprint
Note: Pro forma Revenue and EBITDA represents LTM 09/30/2018 for II-VI and LTM 07/29/2018 for Finisar.
1. Represents LTM 09/30/2018 for II-VI plus LTM 07/29/2018 for Finisar and includes $150mm run-rate synergies for EBITDA. EBITDA excludes amortization of intangibles, the impact of SFAS 123(R) stock-based compensation
expense and one-time charges.
2. 2022 estimated market size. Includes 3D Sensing, Power Devices for Automotive and Wireless RF size from Yole, Optical Communications from Lightcounting and Ovum, Industrial Processing, Military, Life Sciences from
Strategies Unlimited.
Page 9
Strategic Window of Opportunity Now
Right Technology + Right Team + Right Time Combined broad base of talent,
technology and manufacturing enhances
our ability to hit market windows today
TAM ($B)
Disruptive Megatrends Inflection Point
$20 CAGR 20%
$15 CAGR 16%
Electric & Proliferation of
3D Sensing Autonomous Vehicles Cloud Services $10
Window of
$5 Opportunity1
Increased Data and Accelerated deployments in $-
Video Consumption Mobile & 5G Communications 2018 2019 2020 2021 2022
Datacom TRx Telecom TRx ROADM 3DS & LiDAR RF Electronics Power Electronics
Note: Market size forecast from Lightcounting, Ovum and Yole.
Page 10Transaction Strategic Rationale
Creates One of the Largest Photonics and Compound Semiconductor Companies with $2.5B of Revenue1
Combination Addresses Multiple Strong and Growing Markets
Complementary Expertise in Datacom & Telecom Strengthens Position in Optical Communications
Creates the Most Compelling 3D-Sensing and LiDAR platform with Faster Time to Market
A Leader in Engineered Materials and Compound Semiconductors
Expected to Achieve $150mm Run-Rate Cost Synergies within 36 months
1. Represents LTM 9/30/2018 for II-VI plus LTM 07/29/2018 for Finisar.
Page 11Finisar Brings Significant Next-Generation Technologies For
Communications, 3D Sensing, and LiDAR Enabling New Market Growth
InP
Datacom Transceiver Technology Telecom Transceiver Technology ROADMs
WSS
GaAs
Optics
High-Speed GaAs VCSEL High-Speed InP DML I-Temp Tunable Tunable Laser
LCoS
DBR Laser + MZ Mod + InP Modulator
3D Sensing
Coherent Coherent Tx+Rx Diffraction
2D VCSEL Array Tunable Laser Assemblies Gratings
Laser Driver Transimpedance Clock & Data Silicon Photonics
Amplifier Recovery PIC + EIC Integrated Circuits
Page 12Irreversible Megatrends I Addressing Multiple Strong and Growing Markets
3D Sensing Optical RF Electronics in Power Electronics
& LiDAR Communications Wireless For Green Energy
GaAs | InP GaAs | InP | Si Photonics GaAs | GaN/SiC | Diamond SiC
For 3D sensing in For terrestrial, For 4G remote radio For electric vehicles
consumer electronics submarine & wireless heads, 5G beam (EV/HEV), smart grid
& LiDAR in automotive optical infrastructure forming antennas & power switching, solar
and datacenters RF electronics and wind energy
2022 Market $2.9B $12.1B $1.1B $1.2B
2018-22 CAGR 60% 13% 26% 27%
Source: 3D Sensing & LiDAR, Wireless RF and Power Electronics for Green Energy from Yole, Optical Communications from Lightcounting and Ovum.
Page 13Most Compelling Platform for 3D Sensing & LiDAR
II-VI’s GaAs Platform + Finisar’s InP Platform
= Enhanced competency in 3D Sensing and LiDAR
Optimization of R&D, Capital and Asset Utilization
= Faster Time to Market
Vertically integrated 6 inch GaAs compound
semiconductor platform, one of the largest in the world
= RF Devices and advanced optoelectronic device integration
The iPhone Is Just The Tip of the Iceberg For Potential Applications
Auto Security /
VR / AR eCommerce Video Game
Tablets LIDARs Biometrics
Consoles
VCSEL Arrays For 3D Sensing & LiDAR CAGR (’18-22): +60%
Source: Yole
Page 14Growth Opportunities in 5G Mobile Infrastructure
5G OPTICAL ACCESS 5G RF
Backbone Network Front- & Backhaul Network Base Stations Handsets
Coherent TRx HPC WSS LPC WSS 25G FH TRx Bidi DWDM TRx
Line Cards Amplifiers OCM/OTDR DWDM Filters Subsystems 100G BH TRx GaN/SiC RF GaAs RF
2022 TAM: $2.4B Source: LightCounting
Note: TAM is all inclusive
$1.4B Sources: LightCounting
& II-VI Estimates
$1.1B Sources: Yole, JP Morgan & II-VI
Estimates
2018-22 CAGR: 13% (not exclusively 5G driven) 124% 63% (GaN/SiC RF includes 4G & 5G)
Global backbone buildouts in II-VI signs agreement with SEDI to 5G mmWave standard to drive II-VI to complete qualification & to
anticipation of 5G traffic develop GaN/SiC on 150 mm GaN/SiC RF demand begin production of GaN/SiC
2017 2018 2019 2020
WSS: Wavelength Selective Switch; HPC/LPC: High/Low Port Count;
OCM: Optical Channel Monitor 5G optical access deployments begin 5G Smartphones & IoT to drive 5G service to become broadly
OTDR: Optical Time Domain Reflectometer in Asia to support 5G New Radio 5G GaAs RF demand, 5G Optical available
TRx: Transceiver; FH: Front-haul; BH: Backhaul; RF: Radio Frequency
BiDi: Bidirectional; DWDM: Dense Wavelength Division Multiplexing Access deployments continue
Page 15RF Electronics for Wireless Infrastructure
II-VI’s GaAs & SiC on 6” platform + Finisar’s microelectronics design expertise
= Access to larger & growing markets
Collaboration with SEDI for GaN/SiC RF electronics
For wireless: efficient, high power RF amplification with GaN/SiC HEMT
Thin-film diamond on silicon for next generation high speed wireless electronics
SiC Substrates GaAs Epiwafers GaAs pHEMT
5G
WIRELESS
Beam-forming Antenna
For 4G & 5G For RF Devices in Wireless For RF Applications in
Wireless Antennas Handsets Wireless 4G
WIRELESS
A world leading supplier of SiC substrates
GaN/SiC for RF Electronics
Market CAGR (‘18-’22): 26% Remote Radio Head
Source: Yole
Page 16Power Electronics for Green Energy
II-VI’s SiC on 6” platform + Finisar’s microelectronics design expertise
= Access to larger & growing markets
High efficiency voltage and power conversion
= SiC MOSFETs for Green Energy
Applications
Electric cars (EV/HEV)
Solar & Wind Energy
Smart Grid Power Switching
A world leading supplier of SiC substrates
SiC for High Power Electronics HV Battery
Market CAGR (’18-’22): 27% Electric Charger
Source: Yole
Bi-Directional Converter/ Inverter/ Electric Motor
DC-DC Converter
Page 17II-VI and Finisar Both Positioned for Near Term Margin Expansion, with
Added Benefits from Combination
Key Drivers of Margin Improvement
Combination
Ramp in Silicon Carbide and Significant traction for 100G CWDM4 $150 million run-rate cost
3D-Sensing Gen3 platform synergies
Increasing vertical Large upside potential for 200G and 400G Improved time to market,
integration CDWM4 from Hyperscale customers time to profitability and
Developing a complete portfolio of 400G time to scale
solutions
Design wins for next-generation coherent
products
Page 18Significant Value Creation Potential from Synergies
Annual Estimated Synergies
Achieved Within 36 months
Cost of Goods Sold Supply chain management - Procurement
Infeed - Internal supply of enabling ~$85 million
materials and components
More efficient R&D with scale
Research & Development Complementary engineering and design teams
Consolidation of overlapping corporate costs
~$65 million
General & Administration Optimization of operating model
Sales & Marketing Savings from scale
Total ~$150 million
Page 19Strong Deleveraging Profile
II-VI and Finisar have combined EBITDA 4.5
4.1x
generation today of $570mm1,2 including 4
$150mm run-rate synergies 3.5
3
Combined company has a strong deleveragingII-VI Additional Markets
II-VI Core Market I Industrial Laser Materials Processing
High Power Semiconductor Lasers & Laser Optics
A full suite of components for multiple laser modalities
Strong CO2 deployed base in active use and strong secondary market
Industrial laser components: 25-35% of worldwide revenue
FIBER LASER OPTICS CO2 LASER OPTICS LASER BARS CUTTING HEADS DIRECT DIODE LASER ENGINE
Laser Components, Processing Heads, Beam Delivery Optics / Components
Fiber Lasers Market CAGR (‘17-‘22): +8%
Direct Diode Market CAGR (‘17-‘22): +7%
Source: Strategies Unlimited
CO2 laser optics: 15-20%
One micron products: 15-20%
Page 22II-VI Core Market I Military
Military-Aerospace business serves four strategic areas
• Intelligence surveillance & reconnaissance (ISR)
• Missiles and ordnance
• EMI & survivability
Highly differentiated core capabilities & products
• Materials engineered in-house
• Complex electro-optics sub-assemblies with high value add
Emerging strategic platforms
World leader in large sapphire panel output 24,000 sf dedicated facility
Infrared Countermeasure Systems Market
CAGR (’17-’22): +8%
Source: Strategies Unlimited
Page 23II-VI Growth Applications I EUV Lithography
EUV Lithography already started for 7 nm node production
Multiple II-VI products used in each EUV system, ~1-2% of total value
Products leverage II-VI materials: ZnSe, CdTe, CVD Diamond and RBSiC
REAR MIRRORS OUTPUT COUPLERS MODULATOR REACTION BONEDED SIC CVD DIAMOND
Structural Ceramic Subsystems
EUV Lithography Systems
Market CAGR (‘16-’22): 9% EUV Source System: Focusing Optics
Source: Allied Market Research
Beam Transport System
CO2 System: Seed Laser, Power Amplifiers
EUV Lithography System
Page 24II-VI Financial Summary
II-VI Segment Revenue by End Markets for Full Year FY18
End Market Distribution of Full Year FY18 Revenue
Fiber Optic & Life Science,
FY18 FYY18 Op Margin FY18/FY17 Revenue Industrial
Reported Segments Wireless Military Semi Cap Consumer,
Revenue – GAAP Growth (Automotive)
Comm. Other
Laser Solutions ** $406M 9.5% 28% 67% 12% 3%* 7% 11%
(1%)
Photonics ** $487M 13.5% 10% 13% 77% 0% 3% 7%
15%
Performance Products $266M 11.6% 24%
(2%)
13% 40% * 19% 13%
33%
II-VI Consolidated $1,159M 11.7% 19%
(1%)
39% 10% 8% 10%
* Now managed in Performance Products as of Q4FY18
** The Laser Solutions and Photonics’ results adjusted for the LSG move from Laser Solutions to Photonics
Page 26II-VI Segment Revenue by End Markets for Q2FY19
End Market Distribution of Q2FY19 Revenue
Q2FY19/
Q2FY19 Op Fiber Optic & Life Science,
Q2FY18 Q2FY19 Q2FY18 Industrial
Reported Segments Margin – Wireless Military Semi Cap Consumer,
Revenue Revenue Revenue (Automotive)
GAAP Comm. Other
Growth
Laser Solutions $105M $106M 12% 1% 57% 14% 5% 7% 17%
(1%)
Photonics $115M $160M 15% 38% 8% 83% 0% 3% 6%
21%
Performance Products $61M $77M 15% 26%
(6%)
12% 41% 17% 9%
27%
II-VI Consolidated $282M $343M 12% 22%
(2%)
46% 11% 7% 9%
Page 27II-VI Financial Trends
Booking/Revenue/Backlog Margin Performance
40.0% 39.8% 38.9%
37.8%
$1,210 $1,159
$1,072
$972
$875 $827
$704 $657 18.1% 19.5% 19.1% 18.7%
$451 $513
$399 11.1% 11.9% 11.7% 11.7%
$290
FY16 FY17 FY18 H1FY19 FY16 FY17 FY18 H1FY19
Booking Revenue Backlog Gross Margin EBITDA Operating Margin
Cash and Liquidity FY16 FY17 FY18 H1 FY19 Expectations
Cash and
Equivalents $218M $271M $247M $230M
FY18 FY19
Cash Flow
from Operations $123M $118M $161M $88M Gross Margin 39.8% 38.5%-41%
Long-Term Debt EBITDA 19.1% 18.5%-21%
(Including current portion) $235M $342M $439M $481M
Operating Margin 11.7% 11%-13%
Shareholder’s Equity $782M $900M $1,024M $1,073M
Typical industry EPS adjustments are detailed at the end of this presentation.
Page 28Appendix
Finisar Transaction Overview
Transaction Approximately $3.2 billion of total equity value
Consideration – Finisar shareholders to own approximately 31% of the combined company
$26.00 per share
Per Share – $15.60 in cash and 0.2218 shares of II-VI common stock, valued at $10.40 per share based on the closing price of II-VI’s
Consideration common stock of $46.88 on November 8, 2018
– Fixed exchange ratio
$2.0 billion of new funded debt in the form of fully committed financing (in addition to $450mm unfunded revolver)
– Permanent financing expected to come through pro rata and institutional markets
Sources of – Revolver and TLA, 5 year tenor; TLB, 7 year tenor, blended interest rate expected L+225 bps
Financing – Expect to de-lever to current levels within 2 years
$1.0 billion of combined balance sheet cash
$1.4 billion of equity issued to Finisar shareholders
Approval by II-VI and Finisar shareholders
Approval Process
Regulatory approvals
Expected Timeline Middle of calendar year 2019, subject to customary closing conditions
$150mm of expected annual cost synergies realized within 36 months of close
Financial Highlights Expected to drive accretion in Non-GAAP earnings-per-share for the first full year post close of approximately 10% and more
than double that thereafter
Page 30Finisar Transaction Financing
Transaction $2.0 billion new funded debt, fully committed by BofA Merrill Lynch
Financing – $450 million unfunded revolver at close
($ in billion) x LTM EBITDA (w/ synergies)1
Pro-forma Gross Debt $2.4 4.1x
Capitalization
Cash $0.3 0.6x
Statistics
Net Debt $2.0 3.5x
Taken together, company has EBITDA generation of $570mm1
Deleveraging and
Capital Allocation Combined company has a strong deleveraging profile
Ongoing ability to maximize strategic opportunities
1. Represents LTM 09/30/2018 for II-VI and LTM 07/29/2018 for Finisar and includes $150mm run-rate synergies. EBITDA excludes amortization of intangibles, the impact of SFAS 123(R) stock-based compensation expense and one-
time charges.
Page 31II-VI Historical GAAP EPS and Adjusted EPS Equivalent
To calculate EPS comparable to some peers, below are the values of typical adjustments used by other companies
II-VI Consolidated Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2
Summary of Typical Industry Non-GAAP
Adjustments FY17 FY17 FY17 FY17 FY18 FY18 FY18 FY18 FY19 FY19
Amortization 3.2 3.2 3.1 3.2 3.6 3.8 3.6 3.6 3.7 4.1
Share Based Comp - COGS 0.7 0.6 0.7 0.5 1.0 0.8 0.4 0.6 1.0 0.5
Share Based Comp - SGA 3.4 3.3 3.8 3.0 5.3 4.5 3.2 3.8 4.3 4.5
M&A Related Expenses - - - 0.3 2.0 - - - 1.9 8.6
7.3 7.1 7.6 7.0 11.9 9.1 7.2 8.0 10.9 17.7
Tax - - - (8.4) - - (0.1) (0.2) - (0;1)
Impact of the “Tax Cuts and Jobs Act” and - - - - - 15.8 (6.5) (1.3) - -
Company Actions
PAT 7.3 7.1 7.6 (1.4) 11.9 24.9 0.6 6.5 10.9 17,7
Outstand Shares 63.6 64.4 65.0 65.0 65.3 65.0 65.1 65.1 66.2 65.7
EPS Impact of Typical Industry Non-GAAP 0.11 0.11 0.12 (0.02) 0.18 0.38 0.01 0.10 0.16 0.27
Adj.
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