Inter-DCI & co-packaged optics - EPIC technology meeting on roadmap 2021 for co-packaged optics
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Inter-DCI & co-packaged optics EPIC technology meeting on roadmap 2021 for co-packaged optics 3 March 2021
ADVA’s solutions
Ensemble network management and control
Synchronization Internet
content provider
and timing Communication
service provider Cloud and OTT
services
Metro / Core
Distribution and hosting
Service delivery
and assurance Enterprise
Business continuity
Cloud access Disaster recovery
Cloud interconnect
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Data center architecture
Long-Haul: 1000s of km
Challenges in DCs
Tier 3 coherent optics
• high-speed interface
Metro: < 80km
Tier 3 between silicon and optics
≤2km optics …
• i/o power reduction
• faceplate density
Tier 3
Tier 2 Tier 2 Tier 2 … Tier 2 • cost reduction
≤2km optics so… when do we see CPOs?
Tier 1 Tier 1 Tier 1 … Tier 1 25.6T? 51.2T? 102.4T?
Active optical cables
Tier 0 Tier 0 Tier 0 But we see steps in this direction
… Copper cables
for inter-DCI…
3 © 2021 ADVA. All rights reserved. Confidential.
The IC-TROSA – a coherent CPO module Integrated Coherent Transmit Receive Optical Sub-Assembly • 400G coherent module • solder reflow compatible (BGA) • includes DP-IQ modulator, DP-Co-Rx, quad-driver, quad-TIA, MCU • 22.5 x 15 x 3.6 mm footprint • non-hermetic package • no laser included (yet) • Standardized in OIF OIF-IC-TROSA-01.0 4 © 2021 ADVA. All rights reserved. Confidential.
Co-packaged optics
How does it compare to the IC-TROSA?
• Compact formfactor
• Need many modules close to switch ASIC
(16x8 at 51.2T)1
• Exhaustive
• Includes DSP, RF electronics,
modulator, receiver, MCU, laser
• External multi-λ laser source?
• High RF bandwidth
• BGA or LGA
• Easy cooling
• Avoiding thermal crosstalk
• Low cost
• Simplified assembly
116x8 400G Modules DR4 or FR4 for 51.2T switch generation (3.2 Tb/s Copackaged Optics Optical Module Product Requirements Document, OIF)
5 © 2021 ADVA. All rights reserved. Confidential.
Laser integration integrated external (FR4 implementation) • “monolithic” integration1 • surface/edge coupled2 • etched cavity3 1Norman, Justin C., et al. "Perspective: The future of quantum dot photonic integrated circuits." APL Photonics 3.3 (2018): 030901. 2Haglund, Erik, et al. "High-power single transverse and polarization mode VCSEL for silicon photonics integration." Optics express 27.13 (2019): 18892-18899. 3Juvert, Joan, et al. "Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing." Optics express 26.17 (2018): 21443-21454. 6 © 2021 ADVA. All rights reserved. Confidential.
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