ATLAS Upgrade Jon Taylor on behalf of the Liverpool ATLAS Upgrade group - J.Taylor Liverpool HEP Xmas Meeting 20/12/19 - Indico
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ATLAS Upgrade Jon Taylor on behalf of the Liverpool ATLAS Upgrade group J.Taylor Liverpool HEP Xmas Meeting 20/12/19
Liverpool build plans and ITk deliverables • Liverpool share of ATLAS UK upgrade grant: £1.9M • ~30FTE CG-funded physicist, engineer & technician effort (over 6 years) • 500 pixel Modules ATLAS Pixel TDR: CERN-LHCC-2017-021 ; ATLAS-TDR-030 • 500 strip Modules • Procurement of all 15000+ strip barrel hybrids. • 3000 strip hybrids • 110 strip stave cores Timeline of Production Phase • 1 pixel endcap (assembled and delivered) J.Taylor Liverpool HEP Xmas Meeting 20/12/19 2
What’s new this year? Reviews (PDR, FDR, PRR) • ITk Strip detector modules - FDR passed, transitioning into pre-production phase • ITk Pixel detector modules - PDR passed, transitioning out of R&D phase Money • New consolidated grant has all posts for ATLAS upgrade maintained Old / new faces / roles • WP20 Pixel Endcap integration (Helen and Tim) • WP13 Pixel Endcap modules (Jon T) • Strip software offline co-ordinator (Helen) • Pixel EndCap project engineer (Peter S) • 4 members of UK Tracker Upgrade Management team • Liam Boynton moves from apprentice role to ATLAS Upgrade technical post • Congrats to Carl Gwilliam on ATLAS lectureship - he will be sentenced to 6 months hard labour in the LSDC Gulag • Thanks to Yanyan Gao who moved to Edinburgh but still continues to work with us on upgrade activities J.Taylor Liverpool HEP Xmas Meeting 20/12/19 3
ITk layout - where strips fit in • Replace the whole inner detector with the all silicon Inner Tracker system • Pixel region: • 5 barrel layers • 4 layers of pixel rings 3 of which are in the end-caps • Strip region: • 4 barrel layers • 6 strip disks in each end-cap • Full detector hermeticity up to |η| = 4 • 7.5m long within 2T magnetic field ATLAS Pixel TDR: CERN-LHCC-2017-021 ; ATLAS-TDR-030 • Strip System: • ≈18k modules • ≈60 million channels • 165m2 of silicon • ≈2 x1015 1MeV neq/cm2 dose • Pixel System: • ≈10k modules • ≈100 million channels • 10m2 of silicon • ≈2 x1016 1MeV neq/cm2 dose J.Taylor Liverpool HEP Xmas Meeting 20/12/19 4
Stave Assembly Tim Jones, Dave Sim (Stave Dave), Peter Sutcliffe Hamish Teagle (PhD) Assembled first 14-module stave at Liverpool this year • Using basic assembly method from Oxford with refinements from Liverpool • All carbon foam parts have been manufactured in the DFF • Part of the tools for the whole collaboration have been produced at Liverpool • Will produce several more staves throughout 2020 Tiring work! J.Taylor Liverpool HEP Xmas Meeting 20/12/19 5
Barrel tools New Tools for strip module assembly designed at Liverpool • First set of tools for each of the 6 UK groups have been produced by industry with subsequent metrology at Liverpool • Successfully used in UK to assemble hybrid • Final design for production to be produced begin 2020 John Carroll, Sven Wonsak J.Taylor Liverpool HEP Xmas Meeting 20/12/19 6
Hybrid QC • For Quality Control, produce test coupons together with hybrids • Developed test system for coupons at Liverpool –Arduino shield –Pogo-Pin probe card –LabVIEW software • System installed at LBL Liam Boynton, Ashley Greenall, Sven Wonsak J.Taylor Liverpool HEP Xmas Meeting 20/12/19 7
Hybrid crate Designed Crate system for barrel hybrid tests: • Hybrid burn-in requires testing hybrids for 100h at 40°C • For mass-testing a crate system was designed • Allows to test 36 hybrids at 640Mbit/s readout speed Design: Ashley Greenall J.Taylor Liverpool HEP Xmas Meeting 20/12/19 8
Automatic visual inspection of hybrids Original Annotated • Scan all hybrids after passive attachment –Look for solder splash and missing/wrong components –1200dpi sufficient for bond-pad contamination at reasonable file size • Easy to use interface • Future development: use Machine learning to fully automate the process Andy Mehta, Sergey Burdin, Sam Powell, Adam Ruby (PhD) J.Taylor Liverpool HEP Xmas Meeting 20/12/19 9
Hybrid and module assembly Liverpool and RAL first groups that have built and tested barrel strip hybrids and modules with the new ABCStar and HCCStar chips Assembled mechanical hybrids for Glasgow and Sheffield for module building tests (production work-flow) 5-Module Short-Strip segment for electrical tests of most heavily loaded multi-drop CCR (clock, control) segment of stave • 3 of those modules built at Liverpool Liam Boynton, Ashley Greenall, Sven Wonsak, Mike Wormald J.Taylor Liverpool HEP Xmas Meeting 20/12/19 10
Next steps • Strip Module Final Design Review has been passed (September 2019) with significant contributions from Liverpool • Passing FDRs allow progression to pre-production • Pre-Production: – Produce 5% of total number of ITk modules for site qualification and ramp-up to production – First sensors to be delivered January 2020 – First hybrids to be build at Liverpool in July 2020 – Module site qualification to be completed: November 2020 – Module Production Readiness Review: December 2020 – Module pre-production to be completed: 2021 – First staves due to arrive at CERN c2022, work at CERN beyond current production grant - completion bid to be submitted during 2020, opportunity for Liverpool? If something is expensive and hard to build, why not set it on fire? J.Taylor Liverpool HEP Xmas Meeting 20/12/19 11
ITk layout - where pixels fit in • Replace the whole inner detector with the all silicon Inner Tracker system • Pixel region: • 5 barrel layers • 4 layers of pixel rings 3 of which are in the end-caps • Strip region: • 4 barrel layers • 6 strip disks in each end-cap • Full detector hermeticity up to |η| = 4 • 7.5m long within 2T magnetic field Serial Power: "A physicists ATLAS Pixel TDR: CERN-LHCC-2017-021 ; ATLAS-TDR-030 • Strip System: dream and engineers nightmare!” • ≈18k modules • ≈60 million channels • 165m2 of silicon • ≈2 x1015 1MeV neq/cm2 dose • Pixel System: • ≈10k modules • ≈100 million channels • 10m2 of silicon • ≈2 x1016 1MeV neq/cm2 dose J.Taylor Liverpool HEP Xmas Meeting 20/12/19 12
Half-cylinder tooling Epoxy tooling board Master Lay-up with HX42 tooling pre-preg Peter Cooke, Paul Sinclair, Warren Jones, Tim Jones, Peter Sutcliffe, Helen Hayward Vacuum bag & cure Final secondary mould J.Taylor Liverpool HEP Xmas Meeting 20/12/19 13
Half-cylinder tooling End-flange tooling Cut end-flange laminae (M55J/EX1515) Peter Cooke, Paul Sinclair, Warren Jones, Tim Jones, Peter Sutcliffe, Helen Hayward Lay-up M55J/EX1515 end-flanges Final end-flanges removed from tool J.Taylor Liverpool HEP Xmas Meeting 20/12/19 14
Half-cylinder tooling Integration of end-flanges Completing the lay-up Peter Cooke, Paul Sinclair, Warren Jones, Tim Jones, Peter Sutcliffe, Helen Hayward Add pressure plate Cured Half-cylinder & mould tool J.Taylor Liverpool HEP Xmas Meeting 20/12/19 15
3D services routing and integration 1.HV TP36 x 44 2.LV TP18 x 6 3.CAN TP32 shielded x 22 4.LV TP18 x 10 5.VCAN TP32 x 22 6.Tilock TP32 x 22 7.LV TP18 x 6 Dark Pink: TwinAx x 13 Rings 1,2,3 Green: TwinAx x 13 Rings 4,5,6 Blue: TwinAx x 5 Rings 7,8,9,10,11 – considerably less phi-space used, now there is room for cable clips and guides! Tim Jones, Peter Cabling mock-up in Sutcliffe, Helen Hayward 2020 to verify design J.Taylor Liverpool HEP Xmas Meeting 20/12/19 16
Pixel module building and QC 3267-10-Q4 1 150 120 I bias, nA 90 Burn-In 60 After 1h 30 Glued 0 0 50 100 V bias, V 150 200 250 2 Modules with new hybrid flex have been built at Glasgow, 3 Oxford and Liverpool, QA carried out: 4 1. IV’s of bare/assembled module 2. Hybrid flex QA • 10A current test on power rails • HV test with 1.5kV to look for pin-holes • Resistance of power rails over time 3. Metrology of module • Optical inspection • Mass measurements • Measure flatness of chips Ilya Tsurin, Paul Dervan, 4. Tuning / source tests on module transport card Shen Wang, Jon Taylor, Yanyan Gao J.Taylor Liverpool HEP Xmas Meeting 20/12/19 17
Endcap demonstrator Ring-0 Transport frame Module loading at RAL Dummy module on ring Ring-0 in test box • L3 ring with one quadrant fully populated with 12 electrical quad modules (6/side) • 4 electrical quad modules built by each of the UK module building sites • Readout with HSIO-II (RCE) DAQ using all 18 data links • Patch panels above ring for cable saving board and CPLD interlock for monitoring of T & RH • Cooling via chiller with water monethylene-glycol flushed through Ti cooling pipe + cool air • Constant current source used to supply serial power (SP) • SP on both sides of HR joined to form single SP chain 12 quad modules long • Sr90 source mounted on moveable arm attached to rotary stage and stand • Python code developed by A. Taylor allowing scanning movement in steps of
Endcap demonstrator Ring-0 Mean noise value / FE in SP chain SP • Combined I-V of modules reflects sensor spec of V_Breakdown > Vdep + 70V - Micron make very nice silicon! • Parylene coating of RD53A quads will allow safe operation up to >= 200V • 37MBq Sr90, source scan HV, Side A • Automated positioning with motorised stage developed using a rotary stage rather ~250nA @ -100V than the linear one used in OB demonstrators • Allows check of disconnected bumps after module loading J.Taylor Liverpool HEP Xmas Meeting 20/12/19 19
Pixel module QA Paul Dervan, Ilya Tsurin, Disconnected bumps as a function of thermal cycles Shen Wang, Jon Taylor, Joe Bryan (MPhys) HV cycling to 1kV after parylene and irradiation LN2 cooling system Parylene Coater • Destructive testing of pixel modules via thermal cycling and HV cycling and thermal shock • Allows exploration of failure modes that could occur during integration or operation of ITk pixel detector • Bump bond disconnection, delamination, HV dbreakdown J.Taylor Liverpool HEP Xmas Meeting 20/12/19 20
RD53A quad module building program Designed by Ilya Tsurin Market Survey test beam reconstruction Designed by Ilya Tsurin Ricardo Gonzalez (PhD), Matt Sullivan (PhD), Yanyan Gao, Shen Wang, Paul Dervan Monica D’Onofrio, A. Biondini (PhD), QT starting J.Taylor Liverpool HEP Xmas Meeting 20/12/19 21
Next steps for pixels • Pixel Module and local support Preliminary Design Reviews has been passed (October 2019) with significant contributions from Liverpool on hybrid design and module building and half ring manufacture • Passing PDR allows progression to FDR • 2020 will focus on finalisation of all parts of design for FDR • The building of a new pixel demonstrator (Ring-1) will commence after the the next round of module building with the new pixel chip RD53A J.Taylor Liverpool HEP Xmas Meeting 20/12/19 22
Thanks and end A lot of work from many dedicated people, looking forward for an intense 2020, also with further contributions from our academics :) Merry Christmas! Thanks to all staff in the DFF (Workshop), the AML, LSDC and HEP Computing support who made all of the work presented here possible J.Taylor Liverpool HEP Xmas Meeting 20/12/19 23
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