An Exclusive Look at Partner Products: A Showcase of The New AM5 Motherboards - August 4, 2022 | 11 AM CDT - igor sLAB
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An Exclusive Look at Partner Products: A Showcase of The New AM5 Motherboards August 4, 2022 | 11 AM CDT
Agenda MEET OUR EXPERTS AN EXCLUSIVE LOOK AT PARTNER PRODUCTS: A SHOWCASE OF THE NEW AM5 MOTHERBOARDS QUESTION & ANSWER CLOSING
How to Use the Console MEDIA PRESENTATION SUBMIT A EXPERT BIO TABLE OF HELP PLAYER QUESTION CONTENTS AMD ARENA SHARE THIS REGISTER RESOURCES SUBSCRIBE GIVE US YOUR WEBINAR NOW FEEDBACK
What we'll cover in today’s Meet the Experts Webinar: AM5 Ecosystem Solutions Socket AM5 X670E and X670 Flagship AM5 Motherboards Socket AM5 motherboard lineup, specifications, and features from ASUS, GIGABYTE, ASRock, MSI, and BIOSTAR The Next Frontier of Ryzen™ Motherboards How the Socket AM5 platform and AMD Ryzen™ 7000 Series processors deliver unbeatable performance
Meet Our Experts INSERT HEADSHOT INSERT HEADSHOT INSERT HEADSHOT INSERT HEADSHOT INSERT HEADSHOT JUAN J. GUERRERO MIKE YANG MICHIEL BERKHOUT SOFOS OIKONOMOU ANNY HSU ASUS Product Marketing Manager Sales Manager ASRock Europe BV EU Product Marketing Motherboard Product Manager Sales Manager ASUS ASRock MSI GIGABYTE BIOSTAR
ROG Crosshair X670E Extreme| ROG Crosshair X670E Hero Power Solution | Connectivity | Audio | ASUS Q-Design
ROG Crosshair X670E Extreme| ROG Crosshair X670E Hero Feature Overview & Sneak Peek Power Solution | Connectivity | Audio | ASUS Q-Design
ROG CROSSHAIR X670E EXTREME Procool II 4-Pin onboard PWM DDR5 Power Connector FAN Headers 4 DIMM Dual Channel Clear CMOS BIOS FlashBack™ 9 x USB 3.2 Gen 2 2 x PCIe 5.0 X16 (8A+1C) SafeSlot 5 x M.2 2 x M.2 2280 PCIe 5.0 X4 1 x M.2 22110 PCIe 5.0 X4 (PCIe 5.0 M.2 Card) Marvell® AQtion 10Gb Intel® 2.5Gb 1 x M.2 22110 PCIe 5.0 X4 USB 3.2 Gen2 Front 1 x M.2 22110 PCIe 4.0 X4 USB 3.2 Gen 2x2 Panel Connector (ROG GEN-Z.2) USB Type-C® with up to 6 x SATA 6Gb/s 2x USB4® 60W PD/QC4+ AniMe MatrixTM LED Display USB 3.2 Gen 2x2 Wi-Fi 6E Bluetooth v5.2 Optical S/PDIF SUPREMEFX 3 x Addressable Gen 2 ALC4082® CODEC Sonic Studio III 1 x Aura RGB LED-illuminated Sonic Studio Virtual Mixer DTS® Sound Unbound audio jacks Two-Way AI Noise Cancellation W_PUMP+
ROG CROSSHAIR X670E HERO Procool II 4-PIN onboard PWM DDR5 4 DIMM Dual Channel Power connector FAN Headers Clear CMOS BIOS FlashBack™ 1 x HDMI® port 2 x PCIe 5.0 X16 5 x M.2 2 x M.2 2280 PCIe 5.0 X4 SafeSlot 2 x M.2 2280 PCIe 4.0 X4 1 x M.2 22110 PCIe 4.0 X4 2 x USB4® (PCIe 5.0 M.2 Card) 6 x USB 2.0 6 x SATA 6Gb/s 9 x USB 3.2 Gen 2 USB 3.2 Gen 2x2 USB Type-C® with up to 60W (8A1C) PD/QC4+ Polymo Lighting USB 3.2 Gen 2x2 Intel® 2.5Gb 3 x Addressable Gen 2 1 x Aura RGB Wi-Fi 6E Bluetooth v5.2 Optical S/PDIF SUPREMEFX ALC4082® CODEC Sonic Studio III Sonic Studio Virtual Mixer Gold-plated DTS® Sound Unbound Two-Way AI Noise Cancellation audio jacks W_PUMP+
Aesthetic & Spec Overview ROG Crosshair X670E Extreme| ROG Crosshair X670E Hero Power Solution | Connectivity | Audio | ASUS Q-Design
Power design that bucks trends The monstrous compute power of high performance processors necessitates a power circuit that rapidly responds to massive current swings. And those demands increase exponentially when the CPU is overclocked. Featuring an array of 22 strategically paired power stages, the Crosshair X670E generation’s VRM is geared for any workload and all operating conditions. PROCOOL II POWER CONNECTORS ProCool connectors ensure a snug and reliable connection to the ATX and server-grade EPS12V power lines. 110A POWER STAGE 22 latest 110 amp power stages comprise the Extreme VRM. MICROFINE ALLOY CHOKES Each power stage is accompanied by a high-permeability alloy-core choke rated to handle 45 amps. Extreme Hero 10K PREMIUM CAP Input and output filtering is provided by solid-polymer capacitors rated to last 20+2 18 + 2 thousands of hours at extreme temperatures ranging from minus 180°C to Architecture Teamed power stages Teamed power stages 125°C, the widest in the industry. 110 Amps 110 Amps Vcore PWM IC Infineon ASP2205 Infineon ASP2205 Power Stage Vishay SIC850 Vishay SIC850
High-performance networking, ultra-fast connectivity EXTREME only AX210 Marvell® AQtion AQC113CS Intel® I225-V Wi-Fi 6E 10Gb Ethernet 2.5Gb Ethernet PCIe x16/ M.2 USB 3.2 GEN 2X2 TYPE-C® PCIe 5.0 support USB4® QUICK CHARGE 4+
Next level of audio experience ROG Crosshair X670E Extreme and Hero feature the audio codec to the latest ALC4082 which applies USB interface instead of conventional HDA interface. Paired with ESS® ES9218 integrated DAC provides clear output in both stereo and surround sound for music and games. ALC 4082 ESS® Premium LED-Illuminated Switching CODEC ES9218 Audio CAPS Audio Jacks MOSFETS The ALC4082 codec uses USB The ESS® Fine-quality components that Allows you to easily identify Specialized circuits to remove instead of the conventional ES9218 integrated DAC is capable of produce a warmer, natural audio ports and saves you from audio pop noises high-definition audio (HDA) reaching sound with exceptional clarity fumbling around in the dark. interface and improves -106dB THD+N to provide playback and fidelity. playback audio resolution from that conveys all the subtlety and 192 to 384 kHz. nuances of the audio track. And the 121dB DNR provides an extremely low noise-floor.
ASUS Q-Design M.2 PCIe Q-Latch Q-Release Q-Code Q-Connector Q-DIMM Q-LED
Stay tuned.
INSERT HEADSHOT MIKE YANG Sales Manager ASRock Europe BV
ASRock X670E Motherboard Series Line Up
ASRock X670E Motherboard Series X670E Steel Legend X670E PG Lightning X670E Taichi Carrara X670E Taichi X670E Pro RS
Highlights on ASRock X670E Motherboards USB4 Type-C with fast charging DDR5 with Protection Circuit - Compatible with TBT devices - Protects your DRAM from surge current while installing PCIe 5.0 & M.2 Fan Heatsink - Making sure your high performance Gen5 M.2 SSD stays nice and cool! 8 Layer PCB - Provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency
INSERT HEADSHOT MICHIEL BERKHOUT EU Product Marketing
MEG X670E GODLIKE MEG X670E ACE Designed with the latest technology and advanced cooling to achieve maximum performance Tailor-made for demanding designers and content creators MPG X670E CARBON WIFI Tuned and styled for high gaming performance PRO X670-P WIFI Built for battle with an arsenal of Make life easier with products made to satisfy any performance essentials professional workflow for businesses and office use FOR GAMERS FOR CREATORS
MSI X570S Motherboards MSI X670(E) Motherboards Ready for Future Dominate the Future Support PCIe 4.0 / Support DDR4 PCIe 5.0 and 4.0 / Support DDR5 Power Design Strong Power Design Up to Direct 16+2 Phases with 90A SPS Up to 24 + 2 Phases with 105A Power stage PCB Materials Advanced PCB Materials Server Grade / 2oz Copper / Up to 6 layers Server Grade / 2oz Copper / Up to 10 layers Premium Thermal Design Extreme Thermal Design All Aluminum Design / Heat-pipe Wavy fin / Cross heat-pipe Connectivity More than USB USB 3.2 Gen 2x2 USB Type-C with PD 60W
POWERFUL DESIGN EXTREME 24 PHASES POWER DESIGN The MEG X670E GODLIKE features 24 VCORE phases with 105A Smart Power Stages, ready to push the Ryzen 7000 series processors to their limits. Power design Model (VCORE + SOC + MISC) GODLIKE 24(105A) + 2 + 1 ACE 22(90A) + 2 + 1 CARBON 18(90A) + 2 + 1 Pro 14(80A) +2 + 1
THERMAL DESIGN THE NEXT GEN VRM COOLING MOSFET Baseplate Stacked Fin Array MEG Direct Touch Heat-pipe
DIY FRIENDLY SCREWLESS M.2 SHIELD FROZR MEG MPG
DIY FRIENDLY SMART BUTTON Control a hardware function of choice with a customizable button. Available on the Case Reset Button as well as the dedicated Rear I/O Smart Button on MPG and MEG X670(E) motherboard models. MEG MPG
EXPANSION & CONNECTION M.2 XPANDER-Z GEN5 DUAL Included with the MEG X670E ACE and MEG X670E GODLIKE. Compatible with MEG 25110 devices PCIe 5.0 x4 PCIe 5.0 x4 M.2 detection LED Temperature LED Conforms to Double Ball Bearing PCIe 5.0 design Smart Fan Control specifications
EXPANSION & CONNECTION MORE THAN USB Front Lightning USB 20G on MEG X670(E) motherboards supports PD (power delivery) up to 20V@3A 60W*, which not only charges your phone faster, but also can charge for your tablet and even laptop. MEG PD 60W MEG PROSPECT 700R * Without connecting 6-pin power to PSU, the Type-C connector only supports up to 27W.
WORK SMARTER PRO X670-P WIFI combines stable functionality and high quality assembly to solve professional workflows. • Extended Heatsink Design • 14 + 2 phases / 80A SPS • Lightning Gen5 M.2 support • 1x Double-side M.2 Shield Frozr • Onboard 2.5G LAN with Wi-Fi 6E • USB Type-C supports up to DP1.4 HBR3
PERFORM IN STYLE MPG X670E CARBON WIFI bears a neutral carbon black with stylish pattens that accents its high performance design. • Extended Heatsink with heat-pipe • 18 + 2 phases / 90A power stage • Lightning Gen5 slot & M.2 support • Screwless M.2 Shield Frozr • Onboard 2.5G LAN with Wi-Fi 6E • USB Type-C supports up to DP1.4 HBR3
ACE YOUR ENEMIES Go for the gold with MEG X670E ACE, designed to stand out from the rest and win any competition. • Stacked fin array heatsink with heat-pipe • 22 + 2 phases / 90A power stage • Lightning Gen5 slot & M.2 support • Screwless M.2 Shield Frozr • M.2 Shield Frozr with magnetic design • Onboard 10G LAN with Wi-Fi 6E • 1x Front USB Type-C supports PD 60W
ONE BOARD TO RULE THEM ALL MEG X670E GODLIKE stands unrivaled at the pinnacle of all the motherboard capabilities. • Wavy fin heatsink with cross heat-pipe • 24 + 2 phases / 105A power stage • Lightning Gen5 slot & M.2 support • Screwless M.2 Shield Frozr • Onboard 10G + 2.5G LAN with Wi-Fi 6E • 1x Front USB Type-C supports PD 60W • M-Vision Dashboard
INSERT HEADSHOT SOFOS OIKONOMOU Motherboard Product Manager
GIGABYTE X670 AORUS Series
Digital VRM Design To ensure maximum Turbo Boost and overclocking performance of AMD's new generation CPU, GIGABYTE AORUS series motherboard equip the best VRM design ever built with the highest quality components.
Ultra Durable™ SMD PCIe® 5.0 Armor GIGABYTE X670E AORUS series motherboard’s exclusive stainless-steel PCIe shielding becomes 20% wider, and increase the number of iron claw, providing reinforced tensile strength.
Ultra Durable™ SMD PCIe® 5.0 x4 M.2 Slot Design The first PCIe® 5.0 x4 M.2 Slot supports the latest M.2 25110 form factor. Reinforced PCIe® 5.0 M.2 Slots with metal shielding to provide higher strength.
Outstanding Thermal Solution GIGABYTE Motherboards' Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.
M.2 Thermal Guard III for PCIe® 5.0 M.2 SSD M.2 Thermal Guard III constructed with 9X optimized heat dissipation surface and double-sided heatsinks with thermal pads to prevent throttling and bottlenecks on high-speed / larger capacity of PCIe® 5.0 M.2 SSDs.The special design of heatsink grooves in the direction of CPU further enhances the in-chassis air flow and optimizes the heat convection efficiency. Throttle-free Performance * The result is based on internal lab test for reference only, real performance may vary. Test conditions are under open case, 25°C ambient temperature, no airflow, AIO Cooler and the latest Gen4 7000 SSD running IO meter for two hours. * The appearance design of M.2 Thermal Guard III may affect the CPU tower cooler installation; therefore, it is recommend to use CPU liquid cooler.
Screw-less EZ-Latch Plus Design for Better DIY Experience
20 Gbps USB 3.2 Gen 2x2 TYPE-C Featuring the USB 3.2 Gen 2x2 connectivity design, which is double performance than the current USB 3.2 Gen 2. It works up to 20 Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Users can enjoy the ultimate connection flexibility to access and store massive amounts of data rapidly.
High Speed GbE LAN The AQUANTIA® AQC113C is a high-performance, backward compatible with 10GBASE-T/ 5GBASE-T/ 2.5GBASE-T/ 1000BASE-T/ 100BASE-TX Ethernet Controller which is able to provide up to 10 GbE network connectivity, with 10 times faster transfer speeds compared to general 1GbE networking and is perfectly designed for media centers, workstations and gamers. 2.5GbE LAN for Other X670 MBs Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2X faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience. Support Multi- Gig (10 / 100 / 1000 / 2500 Mbps) RJ-45 Ethernet. 10GbE LAN for Other X670E AORUS XTREME MB
802.11ax WIFI 6E The 802.11ax Wireless LAN with new dedicated 6 GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4 Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
X670E AORUS XTREME • AMD Socket AM5:Supports AMD Ryzen™ 7000 Series Processors • Unparalleled Performance:Direct 18+2+2 Phases Digital VRM Solution • Dual Channel DDR5:4*SMD DIMMs with XMP Memory Module Support • Next Generation Storage:4*NVMe SMD PCIe 5.0 x4 M.2 Connectors • Fins-Array III & M.2 Thermal Guard III:To Ensure VRM Power Stability & 25110 PCIe 5.0 M.2 SSD Performance • EZ-Latch Plus:SMD PCIe 5.0 x16 Slot & M.2 Connectors with Quick Release & Screwless Design • Hi-Fi Audio with DTS:X® Ultra:ALC1220 CODEC and Rear ESS SABRE Hi-Fi 9118 DAC with Front ESSential USB DAC Bundled • Fast Networks:AQUANTIA® 10GbE LAN & Intel® Wi-Fi 6E 802.11ax • Extended Connectivity:DP, HDMI, USB-C® 10Gbps, Dual USB-C® 20Gbps and Upcoming GIGABYTE USB4 AIC Support • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
X670E AORUS MASTER • AMD Socket AM5:Supports AMD Ryzen™ 7000 Series Processors • Unparalleled Performance:Twin 16+2+2 Phases Digital VRM Solution • Dual Channel DDR5:4*SMD DIMMs with XMP Memory Module Support • Next Generation Storage:2*NVMe SMD PCIe 5.0 x4 and 2*NVMe PCIe 4.0 x4 M.2 Connectors • Fins-Array III & M.2 Thermal Guard III:To Ensure VRM Power Stability & 25110 PCIe 5.0 M.2 SSD Performance • EZ-Latch Plus:SMD PCIe 5.0 x16 Slot & M.2 Connectors with Quick Release & Screwless Design • Hi-Fi Audio with DTS:X® Ultra:ALC1220 CODEC • Fast Networks:Intel® 2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax • Extended Connectivity:DP, HDMI, USB-C® with DP Alt Mode, Dual USB-C® 20Gbps and Upcoming GIGABYTE USB4 AIC Support • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
X670 AORUS PRO AX • AMD Socket AM5:Supports AMD Ryzen™ 7000 Series Processors • Unparalleled Performance:Twin 16+2+2 Phases Digital VRM Solution • Dual Channel DDR5:4*SMD DIMMs with XMP Memory Module Support • Next Generation Storage:1*NVMe SMD PCIe 5.0 x4 and 3*NVMe PCIe 4.0 x4 M.2 Connectors • Mega-Heatpipe & M.2 Thermal Guard III:To Ensure VRM Power Stability & 25110 PCIe 5.0 M.2 SSD Performance • EZ-Latch:PCIe x16 Slot & M.2 Connectors with Quick Release & Screwless Design • Fast Networks:Intel® 2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax • Extended Connectivity:HDMI, Dual USB-C® 20Gbps and Upcoming GIGABYTE USB4 AIC Support • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
X670 AORUS ELITE AX • AMD Socket AM5:Supports AMD Ryzen™ 7000 Series Processors • Unparalleled Performance:Twin 16+2+2 Phases Digital VRM Solution • Dual Channel DDR5:4*SMD DIMMs with XMP Memory Module Support • Next Generation Storage:1*NVMe SMD PCIe 5.0 x4 and 3*NVMe PCIe 4.0 x4 M.2 Connectors • Mega-Heatpipe & M.2 Thermal Guard:To Ensure VRM Power Stability & 25110 PCIe 5.0 M.2 SSD Performance • EZ-Latch:PCIe x16 Slot & M.2 Connectors with Quick Release & Screwless Design • Fast Networks:2.5GbE LAN & Wi-Fi 6E 802.11ax • Extended Connectivity:HDMI, Dual USB-C® 20Gbps and Upcoming GIGABYTE USB4 AIC Support • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
Model Name X670E AORUS XTREME X670E AORUS MASTER X670 AORUS PRO AX X670 AORUS ELITE AX Power Design Direct 18 Phases Digital ( SPS 105A ) Twin 16 Phases Digital ( SPS 105A ) Twin 16 Phases Digital ( SPS 90A ) Twin 16 Phases Digital ( SPS 70A ) PWM Controller Renesas RAA229628 Renesas RAA229620 Infineon XDPE192C3 Infineon XDPE192C3 MOSFET (Vcore) Renesas RAA2201054 SPS 105A Renesas RAA2201054 SPS 105A Renesas ISL99390 SPS 90A Infineon TDA21472 SPS 70A MOSFET (SOC) 2 * ON NCP303160 SPS 60A 2 * ON NCP303160 SPS 60A 2 * ON NCP303160 SPS 60A 2 * ON NCP303160 SPS 60A MOSFET (MISC) 2 * Renesas ISL99390 SPS 90A 2 * Renesas ISL99390 SPS 90A 2 * Renesas ISL99390 SPS 90A 2 * Renesas ISL99390 SPS 90A Active OC Y Y Y N DDR Frequency (MHz) 4 * DDR5 4 * DDR5 4 * DDR5 4 * DDR5 Expansion Slot 1 * PCIe® 5.0 x16 / 1 * PCIe® 4.0 x4 / 1 * PCIe® 3.0 x2 1 * PCIe® 5.0 x16 / 1 * PCIe® 4.0 x4 / 1 * PCIe® 3.0 x2 1 * PCIe® 4.0 x16 / 1 * PCIe® 4.0 x4 / 1 * PCIe® 3.0 x2 1 * PCIe® 4.0 x16 / 1 * PCIe® 4.0 x4 / 1 * PCIe® 3.0 x2 Fully Covered Heatsink for T-MOS, Enlarged Heatsink for R- Fins-Array III for T-MOS & R-MOS, 8 mm Heatpipe, Fins-Array III for T-MOS, Enlarged Heatsink for R-MOS, Fully Covered Heatsink for T-MOS, Enlarged Heatsink for R-MOS, Thermal Solution MOS, 12 W/mK Thermal Pad, 10 GbE LAN Chip, Baseplate 8 mm Heatpipe, 12 W/mK Thermal Pad, Baseplate 8 mm Heatpipe, 7 W/mK Thermal Pad 8 mm Heatpipe, 5 W/mK Thermal Pad M.2 Heatsink 1 * 4 cm Height Heatsink + 3 * Enlarged Thermal Guard 1 * 4 cm Height Heatsink + 3 * Enlarged Thermal Guard 1 * 4 cm Height Heatsink + 3 * Enlarged Thermal Guard 4 * Enlarged Thermal Guard Fan Headers 10 10 8 5 Temperature Sensors 9 9 9 6 M.2 Slot 4 * PCIe® 5.0 x4 2 * PCIe® 5.0 x4 / 2 * PCIe® 4.0 x4 1 * PCIe® 5.0 x4 / 3 * PCIe® 4.0 x4 1 * PCIe® 5.0 x4 / 3 * PCIe® 4.0 x4 SATA6 6 * SATA III 6 * SATA III 6 * SATA III 4 * SATA III PCB Layer 8 8 6 6 PCB Size E-ATX:305 * 269 E-ATX:305 * 269 ATX:305 * 244 ATX:305 * 244 LAN AQUANTIA AQC113c 10 GbE Intel® i225V 2.5 GbE Intel® i225V 2.5 GbE 2.5 GbE Wireless LAN Intel® AX210 Wi-Fi 6E Intel® AX210 Wi-Fi 6E Intel® AX210 Wi-Fi 6E AMD RZ616 Wi-Fi 6E 160 MHz Audio ALC1220 + ESS 9118 ALC1220 ALC897 ALC897 Thunderbolt™ THB_U4 Header THB_U4 Header THB_U4 Header THB_U4 Header USB 3.2 Gen 2x2 2 ( 1F / 1R ) 2 ( 1F / 1R ) 2 ( 1F / 1R ) 2 ( 1F / 1R ) USB 3.2 Gen 2 Type-C 1(R) 1 ( R ) with DP-Alt 0 0 Total USB Port 21 21 22 22 BIOS Q-Flash Plus Q-Flash Plus Q-Flash Plus Q-Flash Plus Onboard Display HDMI 2.0 4K60 * 1 / DP 1.4 4K144 * 1 HDMI 2.0 4K60 * 1 / DP 1.4 4K144 * 1 / USB-C DP 1.4 4K144 * 1 HDMI 2.0 4K60 * 1 HDMI 2.0 4K60 * 1 RGB Headers RGB * 3 / Digital * 2 RGB * 3 / Digital * 2 RGB * 3 / Digital * 2 RGB * 3 / Digital * 2
•Thank You Thank You
INSERT HEADSHOT ANNY HSU Sales Manager
BIOSTAR x AMD x MTE2022
Model Name X670E VALKYRIE Chipset AMD X670 Chipset CPU Socket AMD Socket AM5 CPU Support AMD Socket AM5 Ryzen™ 7000 Processors Form Factor ATX 305 x 244mm VRD 22 Phase Memory 4 x DIMM DDR5 Slots 2 x PCI-E 5.0 x16 Slots (x16 or x8 mode) Expansion Slot 1 x PCI-E 4.0 x16 Slot (x4 mode) 1 x M.2 (E Key) Support type 2230 WiFi / BT module 6 x SATA III Storage 2 x M.2 (M Key) Support PCI-E 5.0 Mode 2 x M.2 (M Key) Support PCI-E 4.0 Mode Video 1 x Display (1.4) / 1 x HDMI (2.1) USB3.2 Gen2 x2 : 1+1 (Type C + Type C) USB (F/R) USB3.2 Gen2 : 2+9 USB2.0 : 4+0 Audio Realtek® ALC1220 , 7.1CH (5Port+SPDIF), HD Audio LAN Intel® I225V 2.5 Gigabit LAN Port AURORA Utility Dual BIOS Features SAMRT BIOS UPDATE button SAMRT BIOS USB Port Thunderbolt™ Header
Digital PWM & 105A Dr.MOS Delivers superior efficiency and performance. DDR5 Memory Slots Support dual channels and lower power consumption. PCIe 5.0 M.2 & Cooling Protection The latest storage interface, delivers the highest bandwidth. 2oz Copper Low-loss PCB Design Providing stable power and higher energy efficiency. PCI-E 5.0 & Iron Slot Protection Data transfer rate from 64Gb/s PCIe 4.0 to 128Gb/s PCIe 5.0.
Makes you overclock smoothly. Increases system efficiency. Improves thermal performance. Has faster transient performance. Delivers efficiency and performance. Delivers stable power and reliability.
Made of imported special SMT to increase compatibility and stability. Support dual channels and lower power consumption.
The introduction of new hardware PCIe 5.0 M.2 is the latest storage technology design. interface, it delivers the highest It can support the precise high-speed bandwidth and lower latency. signal required by Gen5 graphics card.
2oz Copper Low-loss 8 Layer PCB Design Providing stable power and higher energy efficiency. Super Durable Choke & Solid Caps Ensures genuine power efficacy and longer component life. Tough Power Conn & Iron Slot Protection Ensures stable and reliable power supply and extend longevity of the slot.
W-MOS + N-MOS Southbridge Heatsink M.2 Cooling Heatsink with pipe design & Audio Cover With more cores CPU, thermal solution and power design is more important to make sure the temperature keep lower. BIOSTAR design more heatsink and improves thermal dissipation.
Provides a user-friendly BIOS environment. Enjoy extreme overclocking performance.
It’s could do 4K 60Hz / 5K 60Hz, Real HDMI 2.1 and DP 1.4 spec Fills the entire screen with lifelike images. Expresses bright and highly detailed content.
◆ Keeps your computer stable ◆ Connects any kind of water coolers ◆ Enjoy awesome liquid cooling system
1. Connect the USB drive to the SMART BIOS USB port on the motherboard. 2. Press the SMART BIOS UPDATE button for three to five seconds until the Flash LED blinks, that the function is enabled. The easiest way to update the BIOS is provided.
For further information, please feel free to contact BIOSTAR.
Q&A Please submit your question via the Q&A Widget
Resource List MSI AM5 landing page Computex MSI Insider Livestream (YouTube) ASRock Showcases Latest Motherboard AM5^5 ASUS X670-Series Motherboards GIGABYTE Provides the Perfect Thermal Solution for Socket AM5 Motherboards AMD Partner Hub AMD Meet the Experts Webinars Subscribe to Partner Newsletters
Visit the AMD Partner Hub Partner website Newsletters for partners Incentivized partner training Sales & marketing resources Latest resources Learn, Earn, Win! Multiple languages Multiple languages arena.amd.com amd.com/partner Subscribe now! amd.com/PartnerSubscribe *See endnotes: GD-163
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Endnotes GD-106: Overclocking and/or undervolting AMD processors and memory, including without limitation, altering clock frequencies / multipliers or memory timing / voltage, to operate outside of AMD’s published specifications will void any applicable AMD product warranty, even when enabled via AMD hardware and/or software. This may also void warranties offered by the system manufacturer or retailer. Users assume all risks and liabilities that may arise out of overclocking and/or undervolting AMD processors, including, without limitation, failure of or damage to hardware, reduced system performance and/or data loss, corruption or vulnerability. GD-106. GD-163: AMD Arena is open to employees of AMD Partners. Employment verification is required. Geographic and other limitations apply. For the full terms and conditions see https://www.amd.com/en/partner/amd-arena-terms-conditions.
Disclaimer and Attributions The information contained herein is for informational purposes only and is subject to change without notice. While every precaution has been taken in the preparation of this document, it may contain technical inaccuracies, omissions and typographical errors, and AMD is under no obligation to update or otherwise correct this information. Advanced Micro Devices, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this document, and assumes no liability of any kind, including the implied warranties of noninfringement, merchantability or fitness for particular purposes, with respect to the operation or use of AMD hardware, software or other products described herein. No license, including implied or arising by estoppel, to any intellectual property rights is granted by this document. Terms and limitations applicable to the purchase or use of AMD’s products are as set forth in a signed agreement between the parties or in AMD's Standard Terms and Conditions of Sale. GD-18 ©2022 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, AMD RDNA, Ryzen, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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