Webinar: Minimize Fire Risk in USB-C Connectors - John Hsieh Advanced Engineering Manager, DSM Engineering Materials - UL Prospector ...
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Webinar: Minimize Fire Risk in USB-C Conne ctors John Hsieh Advanced Engineering Manager, DSM Engineering Materials April 14, 2021
Introduction
• Taiwanese, lived in Shanghai for 15 years
• Master degree in Mechanical Engineering
• 20 years’ of experience in a broad range of electronics
applications across the value chain (electronics devices PM,
connector PM, industry marketing and then engineering material
technical marketing)
• Joined DSM in 2013 at Shanghai, and then relocated to California
in 2016, moved back to Shanghai again in 2018.
John Hsieh
Advanced Engineering Manager
DSM Engineering Materials
Quick facts and figure s
DSM Engineering Materials and DSM overall
DSM Workforce Ne t sale s R&T Inve stme nt Production Te chnology
Engine e ring
Mate rials ~1,900 ~€ 1.4 bn ~4.5% 8 ~90%
Figure s for 2019 of re ve nue production of all ne w cars and e le ctronics
re inve ste d in R&T facilitie s de vise s use DSM te chnology
DSM Workforce Ne t sale s Safe ty Plane t
ove rall
21,000 € 9.01 bn 0.28 #1 AAA
e xcluding Figure s for 2019 fre que ncy inde x globally in rating in the
affiliate s of re cordable sustainability MSCI inde x
injurie s for 2019 by Sustainalytics
3
Quick facts and figure s
Global footprint to support our customers
Togliatti - Russia
Emme n - Düsse ldorf - Ge rmany
Ne the rlands
Jiangyin - China
Inche on – South Kore a
Evansville - USA Sittard - Ne the rlands
Ge nk - Be lgium Shanghai-China
Tokyo - Japan
Ge le en - Ne the rlands
She nze n-China
De troit - USA Pantnagar - India
Silicon Valle y - USA
Gurgaon - India Taipe i - Taiwan
Pune - India Kaohsiung - Taiwan
Que ré taro - Me xico
Che nnai- India Ho Chi Minh City - Vie tnam
Bangkok - Thailand Singapore
DSM Engineering Materials
Production locations
São Paulo - Brazil
R&D locations
Office s
4
USB-C: The most popular data & powe rful inte rface in the
consume r e le ctronics industry
One connector for many devices
Tablet Earphone HDD Power TV Laptop
Smartphone Desktop
Smart speaker AR / VR
5
The mobile phone e volution
Thinnovation & Integration
Evolution Evolution
2007 - 2017 1988 - 2020
Highe r Powe r
Advance d Fe ature s Highe r Batte ry Capacitie s Fast Charging
Consumption
6
Fast Charging standards
Samsung MediaTek Qualcomm Motorola
USB 3.1 Oppo OnePlus Huawei PumpExpress Quick TurboPower
Charging USB 2.0 USB 3.0 Adaptive
(USB-C + Super WarpCharge SuperCharge 4.0 Charge 5* 30
Technology port port Fast
USB PD) VOOC 30 2.0
Charger (USB-PD) (USB-PD) (USB-PD)
Max Power 2.5W 4.5W 100W 45W 65W 30W 40W 25/ 30W 100W+ 28.5W
3V - 6V 5V/ 9V(USB
Voltage 5V 5V 5V - 20V 5/ 9/ 20V 5/ 10V 5V 5/ 9/ 10V PD) 5/ 9/ 12V
(10-20mV pe r 3.6V~20V
ste p)
0.5A/ 0.9A/ 2/ 1.67/ 2.25 5.7/ 2.85/ 2.15
Current 0.5A 0.5/ 0.9A 10/ 6.5A 2/ 6A 2/ 2/ 4A 5A+ 5A+
1.5A/ 3A/ 5A A A
• Qualcomm announced the Quick Charge 5 solution on July 27th , 2020. XiaoMi, ASUS, Lenovo and Samsung have
announced to use this technology in their new flagship models.
• The USB PD and various fast charging standards increase the burning risk dramatically, and this brings a new
challenge to smartphone and connector designers.
7
The diffe re nt ge ne rations of USB conne ctor
Available receptacles for each connector Connector type Zoom in
USB 1.0 USB 2.0 USB 2.0 USB 3.0 USB 3.1 USB 3.2 USB4
Generations 1996 2001 Revised 2011 2014 2017 2019
1.5 Mbit/ s 1.5 Mbit/ s (Low Spe e d)
(Low Spe e d) 12 Mbit/ s 40 Gbit/ s
5 Gbit/ s 10 Gbit/ s 20 Gbit/ s
Data rate (Full Spe e d) (SuperSpe ed+ and
12 Mbit/ s (SuperSpe ed) (SuperSpe ed+) (SuperSpe ed+)
480 Mbit/ s Thunde rbolt 3)
(Full Spe e d) (High Spe e d)
Type A Type A
De pre cate d
Standard
Type B Type B De pre cate d
N/ A Type C (e nlarge d)
Mini A
N/ A
Mini Mini B De pre cate d
N/ A Mini AB
N/ A
Micro B Micro B De pre cate d
Micro N/ A
Micro AB De pre cate d
USB 1.0 USB 2.0 USB 2.0 USB 3.0 USB 3.1 USB 3.2 USB4 Type C Type C
Connectors re ce ptacle s plugs
1996 2001 Re vise d 2011 2014 2017 2019
8USB type C connector is the only one interface to support USB 4 and onward version’s USB devices.
Thunde rbolt 3, 4 & USB 4
Thunderbolt is used in high end laptop/ ultrabook.
9
USB4 SI analysis
Both ForTii Eco E11 and Stanyl HFX33S meet USB 4 standard
Item Plug (Dk, Df) Rec (Dk, Df)
1 LCP (3.4, 0.004) LCP (3.4, 0.004)
2 E11 (3.6, 0.01) E11 (3.6, 0.01)
3 HFX33 (3.48, 0.01) HFX33 (3.48, 0.01)
4 LCP (3.4, 0.004) E11 (3.6, 0.01)
5 LCP (3.4, 0.004) HFX33 (3.48, 0.01)
10 * Performed by Dr. James Lin (Lotes Co., Ltd.)USB type C conne ctor challe nge s and solutions 11
Challe nge s with traditional mate rials Thinner walls require high -strength and more durable materials • Liquid crystal polymers (LCP) are widely used for micro -USB connectors • USB-C connectors require thinner walls than previous generations • Fast charging increases the risk of connector defect • Alternative materials are needed to produce reliable thin - walled connectors 12
Addre ssing safe ty conce rns Re ce ntly Qualcomm re le ase d the late st
Quick Charge 5 solution, and se ve ral
New thinner devices pose fire risks smartphone companie s are using the
te chnology in ne w de vice s.
• Connectors with higher voltage rates and smaller pitch
are more likely to result in electrical breakdown
• The tracking resistance of the insulator plastic is
essential to reducing fire hazards
Source capabilities organized as profiles
Hand-held devices, 10W
Profile 1 5V @ 2A Default start -up
today’s peripherals profile
Tablets, VR/AR devices, 5V @ 2A
Profile 2 18W
most peripherals 12V @ 1.5A Requires
new
Thinner notebooks, 5V @ 2A detectable
Profile 3 36W
larger peripherals 12V @ 3A cables for
>1.5A or >5V
5V @ 2A 60W
Larger notebooks, hubs,
Profile 4 12V @ 3A Limit for
docks
20V @ 3A micro A/B
5V @ 2A 100W
Workstations, hubs,
Profile 5 12V @ 5A Limit for standard
docks
20V @ 5A A/B
13Unde rstanding tracking
Insulating plastics may create fire risks
Potential real -life failure mode
• The build -up of dust, sweat or moisture creates a
conductive track on plastic materials – increasing the
risk of fire
LCP after testing with 12 droplets —
significant burn marks and electrical breakdown
14Tracking re sistance te sting High CTI material decreases safety risks for connectors and devices • Materials need a high comparative tracking index (CTI) to ensure products are safe • Higher CTIplastic remains structurally intact even after testing of 60 droplets! 15
Insights
Charging electronics have been linked to device fires
• Some fires may result in property
damage or injury
Charging cell phone blamed for
• If liable, manufacturers risk recalls, damage fire that destroyed Frayser home
to their reputation and legal action
• Tracking posed fire risks with the previous
generations of USB connectors. With USB-C, Cell phone charger not ruled out as
the smaller pitch and increased power cause of Tuesday house fire in Redding
density may further increase the risk of fire.
• “Home fires due to electrical failure or
malfunction primarily involve some form
of arcing. Arc faults can be produced by
damaged connectors…”
Source: “Home Electrical Fires” report by NFPA
16USB type C Re ce ptacle structure and challe nge s
1st part (grey)
Challenge 4
3rd part Over mold (purple)
Challenge 3
2nd part (black)
Challenge 1 Challenge 1 Challenge 2
Challenge 1: the over mold parts need to be bounded with 1 st and 2nd parts well
Challenge 2: Very thin wall in the both sides (0.1~0.2mm only), need very high flow material
Challenge 3: front end plastics to protect metal contact, need high wear resistance material to ensure the reliability and
durability during mating/ un-mating cycles.
Challenge 4: inappropriate tooling design may cause other issues such as void inside the housing or delamination
17USB type C Plug structure and challe nge s
1st part (green)
2nd part (light green)
Challenge 6
EMI
springs
Challenge 7
Challenge 5 3rd part (grey)
Challenge 5: There is welding line in the front end and very easy to be broken. The broken parts may cause connector
malfunction. Need high welding line strength material
Challenge 6: The ribs are very thin (~0.15mm) and very easy to break during EMI spring assembly. Need high stiffness
material
Challenge 7: Deformation in the front end of plug housing, need higher strength material
18Ove rcoming plug housing challe nge s
Meeting all durability, flow and toughness needs
• Molding thin ribs requires high flow, highly durable materials
• Final components must retain a balance between toughness and
stiffness
• High-strength weldlines are very durable
Stanyl shows the highest weldline strength among competitors
Normal Weldline
tensile bar tensile bar
Base polyme r [-] PA46 PA9T PA6T/ 66 LCP
GF conte nt [%] 20 35 45 35 35
Mechanical property
[MPa] 60 50 22 40 17
we ldline stre ngth
Low weldline strength material
Weldline strength measurement is based on UL tensile bar shows cracking in plug designs
19Diffe re nt polyme r structure le ads to diffe re nt mate rial characte ristics LCP has very rigid molecular structure in both solid and melt state, Stanyl/PA46 has flexural molecular chain, easier for therefore the very few entanglements and chemical interactions cause entanglement, and Fast crystallization to solidify the the very low weldline strength entanglement area 20
We ar re sistance comparison of Haloge n Fre e V0 grade s
Stanyl shows the highest wear resistance
Stanyl
ForTii F11 GF30% PA9T GF45% PA6T GF35% LCP GF+MD35%
HFX33S GF20%
Wear &
Friction
Depth 8μm 22μm 47μm 36μm 23μm
21 * Test Condition: 20g, Stroke 40mm, Speed 70cycle/min, 100Kcycles. Probe Pin Front end R 0.4mmFull product portfolio for diffe re nt de sign Supplie r DSM Compe titor A Compe titor B Compe titor C Standard Grade [-] HFX33S HFX61S HFX82S GP2450NH-2 FR52G35NHF E471i base polyme r [-] PA46 PA9T PA6T/ 66 LCP GF conte nt [%] 20 35 45 45 35 35 Mechanical property TM [MPa] 7400 11500 15000 15100 12800 13800 ISO 527-1/ -2 TS [MPa] 110 145 180 146 135 130 ISO 527-1/ -2 EAB [%] 2.7 2.1 2.2 1.5 1.4 2.5 ISO 527-1/ -2 • Stanyl HFX33S has highest elongation at break ration and ductility among competitions • DSM provides the product portfolio solution to meet different connector design needs 22
Bliste ring fre e solution
JEDEC MSL-1 test
Sample: Connectors
Material: Stanyl HFX 31S/33S/61S BK
pre-dried: 105℃*16hrs
Preconditioning: MSL-1(85℃×85%RH×168hrs) MSL-2(85℃×60%RH×168hrs)
Reflow profile:Sony profile with peak temp. 260℃
Reflow time: one time pass
Material Sample type Pre-conditioning Water absorption(%) Blistering
HFX 61S with metal shell 0.4 0/9
85℃*85%RH*168hrs
HFX 61S without metal shell 1.7 0/9
connectors
HFX 61S with metal shell 0.2 0/9
85℃*60%RH*168hrs
HFX 61S without metal shell 0.8 0/9
Note: The moisture absorption was measured by weight gain, which is only for reference due to metal pin included.
Thermocoup
le position
Material Sample type Pre-conditioning Water absorption(%) Blistering
HFX 31S/33S with metal 85℃*85%RH*168hrs 1.95 0/4
Connector
HFX 31S/33S without metal 85℃*60%RH*168hrs 3.89 0/4
23 * No blistering at the both receptacle and plug connectors testChoosing the be st mate rial
Robust plastics reduce fire risk COMPONENT MATERIALS
Cable Conductor: coppe r with tin or silve r plating
SDP Shie ld: AL foil or AL/ mylar foil
Coaxial shie ld: coppe r strand
• Multiple considerations go into picking Braid: Tin-plate d coppe r or aluminum
materials for USB-C components: Jacke t: PVC or haloge n-fre e substitute mate rial
Cable Ove rmold The rmose t or the rmoplastic
– Receptacle tongues Conne ctor She lls Stainle ss ste e l or phosphor bronze
Plug Side Latche s Stainle ss ste e l
– Plug housings
Re ce ptacle Mid-Plate Stainle ss ste e l
Plug inte rnal EMC Spring Stainle ss ste e l or phosphor bronze
• Choosing a halogen-free polyamide Re ce ptable EMC Pad Stainle ss ste e l or phosphor bronze
material reduces the risk of fire Re ce ptable She ll Stainle ss ste e l or phosphor bronze
Re ce ptable Tongue Glass-fille d nylon
The rmoplastics capable of withstanding le ad-fre e
Housing
solde ring te mpe rature
Note : Haloge n-fre e mate rials should be conside re d for all plastics
*Source : USB Type C spe cification re le ase 1.0Stanyl: Be st polyamide for incre ase d product safe ty and
re liability
Highest weldline strength and best wear resistance
• High CTI reduces the risk of electrical tracking by
PA46 PA9T PA6T LCP
50%
CTI 400V or avove
• Excellent flow properties ensure high yields to (Q)
5.0
lower molding costs Colorability (Q) in 4.0 Blister
some OEM Performance (Q)
• Up to 50% more wear resistance than competing 3.0
2.0
high temperature polyamides 1.0
Processability (D) 0.0 Flow (D)
• Unmatched reliability during use ensured by
extensive mating cycle testing
• Proven track record of more than 300 million Wear Resistance
(D)
Weld Line Strength
(D)
USB-C connectors with zero blistering or quality
Overmold Bonding
complains made by Stanyl for major OEMs Force(D)
25DSM Engine e ring Mate rials Your be st partne r for conne ctor de ve lopme nt 26
Bright Scie nce in advance d mate rials
Co-developing throughout the value chain
High-Performance Materials
System End
Monomer Polymer Compound Convertor OEM
Supplier User
24/ 7 Science, Expertise & Global Support
Measure Production
Design Compliance
Performance Support
• Re vie w application • Te mpe rature • Quality control • Docume ntation
re quire me nts • Me chanical • Ide ntify • Data she e ts
• Analyze datase ts • Che mical re sistance production • Re gulatory affairs
• CAE support • UL and othe r global e fficie ncie s state me nts
safe ty standards • Life cycle analysis
27Bright Scie nce in advance d mate rials
Delivering advanced material solutions for the world’s leading manufacturers
DSM
Material
Science
Innovation
End-User
OEM Design Expectations:
challenge Performance
and
Sustainability
28Summary
Why DSM Engineering Materials?
Materials trends in DSM Engineering Materials Delivering: A trusted partner with a
sustainability and supports with: strong track record
technology evolve rapidly
Engineers face challenges • Global footprint Security in selecting A preferred partner of
in staying up to date with • Broad materials portfolio the right materials for leading multinationals,
advanced materials • Application expertise applications with with a strong track record
science, innovations and • Design support speed and agility. in automotive, electronics
shifts in legislation - and in • Materials innovation & electricals and food
choosing the right solution • Sustainable solutions packaging.
for their design challenges • Security of supply
29DSM Engine e ring Mate rials
Contact us and stay up to date
Homepage
DSM.com/EngineeringMaterials
Product and Ask a question or
technical data request a quote
PlasticsFinder.com DSM.com/ContactDEM
30Que stions and Answe rs John Hsieh John.Hsieh@dsm.com +86 13818977651
32
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