TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules

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TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
TQ-Embedded Product Catalogue 2017
Beyond Embedded Modules
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
Content

TQ – Who?  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 2
      Technology in Quality  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 2
TQ – What?  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 3
      E2MS and Obsolescence Management  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 3
TQ – Where?  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 4
      Overview of Industries  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 4
TQ – Why?  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 5
      We offer everything from one source  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 5
Processor architectures  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 6
      ARM® | Power Architecture™ | x86  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 6
Overview  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .    8
      ARM® | Power Architecture™ Modules  .  .  .  .  .                         .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .    8
      x86 Modules  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .            .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .    9
      ARM® | Power Architecture™ Starterkits  .  .  .  .                        .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .   10
      ODM Platform Concepts  .  .  .  .  .  .  .  .  .  .  .                  .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .     12
      Embedded Technologies for Medical Solutions                             .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .      .     13
ARM® Modules  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                15
     TQMa6ULx(L) – Energy efficient for future designs (plug-in connector + directly soldered)  .  .  .  .  .  .  .  .  .                                                                                                                                                                      15
     TQMa7x – Energy efficient and optimized for secure applications  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                            16
     TQMLS102xA – For the networks of tomorrow  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                       17
     TQMa6x – Scalable performance and multimedia module  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                            18
     TQMa53 – The Multimedia module  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                19
     TQMa335x(L) – Multifunctional talent for universal applications (plug-in connector + directly soldered)  .  .                                                                                                                                                                             20
     TQMa28(L) – Functional talent for various applications (plug-in connector + directly soldered)  .  .  .  .  .  .  .                                                                                                                                                                       21
Power Architecture™ Modules  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 23
      TQMT1042/T1040 – Higher Performance and Less Power Consumption with the new 64-Bit Multi-Core
      Processors  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 23
      TQMP1020 / P2020 – The move-in of Multicore  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 24
x86 Modules  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                              27
      TQMxE39S – SMARC Module with Intel® Atom™ x5/x7 E3900  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                               27
      TQMxE38M – COM Express® Mini Module with Intel® Atom™ E3800  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                                  28
      TQMxE39M – COM Express® Mini Module with Intel® Atom™ x5/x7 E3900  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                                     29
      TQMxE38C – COM Express® Compact Module (Type 6) with Intel® Atom™ E3800  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                                        30
      TQMxE39C1 – COM Express® Compact Module
      with Intel® Atom™ x5/x7 E3900 and soldered DDR3L with ECC option  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                                31
      TQMxE39C2 – COM Express® Compact Module
      with Intel® Atom™ x5/x7 E3900 and SO-DIMM memory  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                           32
      TQMx50UC – COM Express® Compact Module (Type 6) with 5th Generation Intel® Core™ i3/i5/i7 5000U  .  .  .                                                                                                                                                                                 33
      TQMx60EB – COM Express® Basic Module (Type 6)
      with 6th Generation Intel® Core™ i3/i5/i7 6000E and Xeon® E3-1500 v5  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                            34
      TQMx70EB – COM Express® Basic Module (Type 6)
      with 7th Generation Intel® Core™ i3/i5/i7 7000E and Xeon® E3-1500 v6  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                                                                                                                            35
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
Content

x86 Single Boards | ODM Platform Concepts  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 36
       MSys – COM Express® Mini (Type 10) based eNUC platform for embedded PC applications  .  .  .  .  .  .  .  .  . 36
       COMSys – COM Express® based System platform for embedded PC applications  .  .  .  .  .  .  .  .  .  .  .  .  .  . 37
ARM® ODM Platforms  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 38
     BluePower – Energy efficient and still powerful  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 38
     TinyBox – Modular datalogger and gateway for fast system solutions  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 39
Power Architecture™ ODM Platforms  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 40
      BluePro – With Power Architecture™ processor  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  . 40
x86 ODM Platforms  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .      .      .      .      .      .   41
      MBox – Ultra compact BoxPC platform for embedded PC applications and IoT edge gateways  .  .                                                 .      .      .      .      .     41
      COMBox – Highly flexible BoxPC solutions based on modular Embedded PC platform COMSys  .  .                                                    .      .      .      .      .   42
      COMPanel – Highly flexible PanelPC solutions based on modular Embedded PC platform COMSys                                                      .      .      .      .      .   43
Embedded Technologies for Medical Solutions  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                       44
     TQ Medical-PC Platform – High-end technology meets medical  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                                    44
     InCover One – Industrial tablet with Intel® Atom™ Z3745  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                                              45
     Modul No.1 mini  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .  .                          46

                                                                                                                                                                                      1
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
TQ – Who?
Technology in Quality

   TQ stands for technology with highest quality standards.
For us this name represents a challenge which we do our best                  Highlights:
to meet at every single step of the process – from the original
idea right through to the finished product. We see ourselves                  ¢¢ TQ offers the complete range of services - from concept to
in this context as partners for our customers and support                        finished product.
them in the pursuit of their strategic objectives. As a corpo-                ¢¢ All services are available on a modular basis or as a complete
rate group we cover the whole bandwidth of this compre-                          package - highly customized.
hensive product and service spectrum and we can thus meet                     ¢¢ Our product range covers various areas such as drive motors
the special wishes of all our customers with great flexibility.                  as well as minimodules.
TQ – your reliable partner for the whole world of electronics.                ¢¢ Embedded modules enable cost-efficient and time-saving
                                                                                 solutions to keep up with today’s rapidly developing high
                                                                                 technology market.
As an electronics service provider (E²MS supplier and CEM)
TQ offers the complete range of services from development,
through production and service right up to product life cycle                 TQ-Embedded Modules
management. The services cover assemblies, equipment and
systems including hardware, software and mechanics. Cus-                      TQ-Embedded offers a comprehensive and wide-ranging ser-
tomers can obtain all services from TQ on a modular basis as                  vice covering the whole spectrum of components for embed-
individual services and also as a complete package according to               ded systems. We guarantee our customers a reliable supply
their individual requirements. We offer standard products such                at ideal economic conditions.
as microcontroller modules (minimodules) and drive motors.
Through the combination of electronics services and finished                  To remain competitive in today’s rapidly evolving high-tech
system components, TQ offers customer-specific products as                    markets, companies must keep on presenting new and more
ODM products and thereby addresses customers who would                        powerful products at ever shorter intervals. This often leaves
like to receive finished products and at the same time benefit                no room for completely new developments. To improve our
from the advantages of a customer-specific solution. ODM                      customers’ situation, we have developed our modular concepts.
products are provided on time and economically using a                        Designing a device on a modular basis will, for its further devel-
comprehensive solution kit. The set includes finished electronic,             opment, bring substantial savings in time and cost. In virtually
mechanical and software components including certification                    all applications nowadays microprocessors take up a central
and licenses.                                                                 position. And the processor environment is usually organized
                                                                              along similar lines, with its memory structure and a correspond-
                                                                              ing number of interfaces.
                                                                              One very sensible step is to use a microprocessor module. For
                                  SUCCESSFUL TOGETHER
                                                                              the customer this brings not only the benefits of saving time
                                                                              and cost but also other key advantages, e.g. flexibility, continui-
                                                                              ty, and a saving on space requirements.
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        WE ARE THE LEADING SOLUTION PROVIDER
        FOR INNOVATIVE TECHNOLOGIES

Our motto “Successful together“ is visible throughout all our activities.

2
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
TQ – What?
E2MS and Obsolescence Management

   From the initial product idea right through to readiness         LOGISTICS – Our experienced purchasing department ensures,
for series production: TQ, a competent partner for a wide           through its policy of continuously monitoring market devel-
variety of industrial concerns, develops and produces elec-         opments, stockpiling all critical parts, and procuring parts on a
tronic modules and devices exactly to customer specifica-           worldwide, manufacturer-independent basis, that all parts are
tions. An active Obsolescence Management rounds out the             available for our customers at any time – and that it is thus
spectrum of services and makes TQ a lifelong partner for            able to meet demands exactly and at optimal conditions.
you - at least for your product lifecycle.
                                                                    SERVICE –Our service department offers rapid and competent
From Concept to Finished Product                                    routine maintenance, calibration, repair, and retooling– from
                                                                    individual board level right through to the complete device.

                                                                    Obsolescence Management

                                                                    Obsolescence is the lack of delivery by the original supply
                                                                    source and the consequent lack of availability due to various
                                                                    influences.
                                                                    The result of obsolescence is that the required product avail-
                                                                    ability, which can exceed 50 years in many business sectors,
                                                                    can no longer be achieved. In addition, an efficient strategy
                                                                    for handling Product Change Notifications (PCNs) and Product
                                                                    Discontinuance Notifications (PDNs) is absolutely necessary.
                                                                    TQ is operating an active Obsolescence Management. Particu-
                                                                    larly in new developments, it is a great advantage to incorpo-
                                                                    rate the current lifecycle status of the components. Monitoring
                                                                    current assemblies allows clients to be proactive rather than
                                                                    reactive. All in all, the long-term availability of assemblies and
                                                                    systems benefits clients because of the considerable added val-
                                                                    ue. Their products are protected against obsolete components,
DEVELOPMENT – Using the newest technologies, we                     costly redesigns, uncertain sources and high cost brokerware.
provide sophisticated hardware and software solutions – from        Information from the supply chain is absolutely necessary to be
the initial concept right through to readiness for series produc-   proactive in Obsolescence Management. For this reason, TQ yet
tion – for virtually all areas of electronics (e.g. automation      again relies on the support of vendors and manufacturers.
technology, medical engineering, and measuring systems).

PRODUCTION – Using state-of the-art production equipment            Advantages of an active
– from high-speed automatic placement – by way of nitrogen          Obsolescence Management at TQ:
soldering – right through to automatic bonding – we produce
electronic PCB assemblies with both conventional and the latest     ¢¢ Combination of the services offered in any manner
innovative technologies.                                            ¢¢ Early identification of at-risk components
                                                                    ¢¢ Avoid unexpected redesigns and re-qualifications
TESTING – Our products are tested using up-to-date measur-          ¢¢ Dispense with high-cost brokerware
ing and testing procedures – from in-circuit tests – by way         ¢¢ Overview of the total product lifecycle cost
of flying-probe tests, boundary-scan tests and burn-in tests,       ¢¢ Flexible operating times
right through to end-to-end functional tests – individually and     ¢¢ Above-average on-time delivery performance
exactly to customer specifications. The hardware and software       ¢¢ Highest data quality via active integration into the
needed is put together by our in-house test resources develop-         supply chain
ment and construction department.                                   ¢¢ A direct contact in our OM corporate department
                                                                    ¢¢ Consistency due to clearly defined, stable processes
ASSEMBLY – In our assembly works we manufacture complex
electro-mechanical, optical modules and devices – on request
also in our clean-room environment.

                                                                                                                                        3
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
TQ – Where?
Overview of Industries

  TQ offers electronic manufacturing and engineering services as well as embedded systems for the following industry fields
(among others). For all services and products, the high and specific requirements in terms of quality, reliability, service life
and long-term availability are taken into account. We are aware of and consider the applicable standards as well as the diverse
customer and product-specific requirements.
Regardless your industry - your particular requirements are handled with experience, care and thoroughness.

             Drive technology                                                   Medical
Our platform solutions for Embedded Drives exceeds existing        We offer a wide spectrum of electronic modules and complete
standards due to high torque combined with very compact            devices for medical-technology companies – ranging from
design.                                                            pocket-format end-user devices up to large equipment for
                                                                   clinics.

             Automotive
Based on our ISO/TS 16949 certification, we develop and pro-                    Maritime Traffic
duce customer-specific products using automotive processes         We manufacture control and guidance systems for maritime ap-
while obeying the pertinent standards and regulations.             plications. Displays and operating units (HMIs) complement our
                                                                   customers applications. Additionally we manufacture switch-
                                                                   gears from individual terminal boxes to high-tech controls.

             Energy | Smart Grid
Based on our know-how of power electronics and control tech-
nology, we are creating regulations for transformers to secure
the network against sudden power surges, for example.                           Telecommunication
                                                                   In telecommunications fast and efficient networking is crucial.
                                                                   Large quantities of data must be processed in a short time. Our
                                                                   solutions additionally imply long-term availability, industrial
                                                                   capability and use in an expanded temperature range.
             Building automation
Our smart products in distributed building control point the
way to added efficiency in building automation. This renders
complex building automation tasks easy to handle.
                                                                                Transportation
                                                                   Our products and solutions in this area are widely used from
                                                                   ticket printers over forklifts to locomotive controls. We de-
                                                                   sign and manufacture controls and display units which fulfill
             Industry | Automation                                 challenging requirements set, in particular those relating to the
Our solutions are used for various industrial applications, e.g.   temperature range.
as mechanical engineering, automation, measurement, control
and regulation-, process-, and monitoring technology.

                                                                                IoT
                                                                   Intelligent objects, secure data communication, worldwide
             Aerospace                                             management as well as centralized and, to some extent, decen-
As an aviation customer you benefit from our expertise which       tralized storage and data processing require reliable and secure
has already been incorporated into a wide variety of different     systems on all levels.
development and production projects.

4
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
TQ – Why?
We offer everything from one source

   TQ-Systems, your competent partner for a wide variety of          Partnerships
industrial concerns, develops and produces electronic mod-
ules and devices exactly to customer specifications. Many            Due to increasing complexity and decreasing product life
years of experience, comprehensive know-how, and a highly            cycle times it is essential to concentrate on core competencies.
efficient organization together form the right foundations           TQ-Embedded modules have been developed therefore with
for customer satisfaction and on-going partnership and               the objective of offering exactly the right solution in as many
cooperation.                                                         applications as possible. As hardware specialist for embedded
                                                                     systems we have sought to close ranks with leading specialists
Choosing a modular solution has wide-ranging consequences,           in the development tools and software sector. We are working
so it is therefore very important to make the right decision.        in close partnership with all leading semiconductors and oper-
During the decision process, you have to think about module          ating system vendors.
and technologies as well as potential suppliers. In any case,
the goal is to find a long-term, reliable solution, as the one-off
investment to purchase a modular design should have lasting
positive effects.

TQ is optimally positioned as your solution provider and long-
term partner to grow with you.
We offer software support as well as hardware development
support. Our support does not only cover the module itself but
we also offer assistance for your individual application board.
We have comprehensive experience in various industries and
application environments. Our design support, like schematic
review, speeds up the modular design and improves safety and
security. This helps you prevent any mistakes.
Beside the development and layout phase, we provide produc-
tion services, which enables us to react more quickly and
more flexibly to your requests.
Our proven record with respect to longevity show that your
choice for TQ covers all aspects for a positive and value oriented
long-term cooperation.

Highlights:

¢¢ Application kit (starterkit)
¢¢ BSP Support
¢¢ Schematic mainboard review
¢¢ Mainboard layout and production
¢¢ Customer specific mainboard design
¢¢ Complete system design, well-founded application design
   knowledge
¢¢ Own production ISO 13485, EN 9100 & ISO 16949 certified

                                                                                                                                        5
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
Processor architectures
ARM® | Power Architecture™ | x86

   TQ is one of very few suppliers worldwide, offering solutions on all common processor architectures – from ARM®, Power
Architecture™ up to x86, we cover the whole product range with our wide embedded module spectrum.

                                                                                               ARM

                                                                                       Power

                                                                                                     x86

6
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
ARM®                                                                 Key Features
ARM® based minimodules represent a very high integration             ¢¢   High integration
of functionalities and CPU-interfaces, which enable cost-opti-       ¢¢   Cost-optimized systems
mized systems. Using the latest processor technology from NXP        ¢¢   Low power loss with optimized processing power
or Texas Instruments. ARM® minimodules are not only state-of-        ¢¢   Versatility of interfaces
the-art, but already ahead of today’s industry’s world. Addition-    ¢¢   Free choice of operating system
ally ARM® based systems operate at low power consumption             ¢¢   Long-term availability
and optimized processing power. The high availability of inter-
faces enables most system requirements to be implemented
with minimal time effort.
This interface variety, a free choice of the operating system and
the optimal application support for various industries makes
ARM® based modules universally applicable. We offer a long-
term availability of 10-15 years for our ARM® modules.

Power Architecture™                                                  Key Features
The Power Architecture™ based modules are a perfect fit for all      ¢¢   High computing performance
applications requiring high computing and I/O performance            ¢¢   Outstanding I/O performance
combined with robustness, reliability and long-term availability.    ¢¢   64-bit single- and multi-core processors
The latest generation supports 64-bit QorIQ T-series processors      ¢¢   Robust and reliable
from NXP offering unique scalability within the product port-        ¢¢   Linux operating system
folio and multiple I/O connectivity at low power consumption.        ¢¢   Longevity of supply
The integrated multi-core technology and optional encryption
engines, combined with dedicated operating systems, enable
also the realization of safety and security critical applications.
The longevity of supply period covers at least 10-15 years,
which makes it easy to support durable solutions and industrial
goods in a wide area of markets.

x86                                                                  Key Features
The TQMx86 product portfolio is based on latest Intel® 64bit         ¢¢ Wide range scalability with full software compatibility
embedded CPUs in the mid to high range performance class.            ¢¢ Most flexible in software / operating systems
To support scalability and interchangeability, all CPU modules       ¢¢ Plug-and-Play for hardware and software
are based on the world wide established standard COM Express         ¢¢ Up to high end integrated graphics
(by PICMG). This enables future proof platform concepts with         ¢¢ Up to 32GB Dual-Channel DDR4-2133 high speed
most flexibility in CPU, graphics and interface performance.            memory (> 30 GB/s)
The x86 architecture which is a CISC (complex instruction set        ¢¢ Performance-per-Watt optimized by intelligent power man-
computing) architecture with full backward compatibility guar-          agement and Intel®’s leading fabrication processes
antees easiest software implementation and cost efficient usage
of existing functions and ready-made software applications.
There are additional innovations such as separated video
encode/decode engines, security and advanced management,
hyper threading (HT), TurboBoost and virtualization.

                                                                                                                                   7
TQ-Embedded Product Catalogue 2017 - Beyond Embedded Modules
Overview
ARM® | Power Architecture™ Modules

    ARM®                                  Memory            Operating           Power              NOR
    Modules          CPU                  (RAM/Flash)       System              Supply             Flash          Dimensions
                     ARM® Cortex™A7
                     i.MX6UL              DDR3L-SDRAM:
                     (G1, G2, G3)         Up to 1 GB        Linux
                     I.MX6ULL             eMMC Flash:       On request:         TQMa6ULx: 5 V
     TQMa6ULx(L)     (Y0, Y1, Y2)         Up to 32 GB       QNX                 TQMa6ULxL: 3,3 V   Up to 256 MB   38 x 38 mm

                     Single- /            DDR3L-SDRAM:
                     Dual-Core ARM®       Up to 2 GB        Linux
                     Cortex™-A7 core      eMMC Flash:       On request:
       TQMa7x        i.MX7 (Solo, Dual)   Up to 32 GB       QNX                 5V                 Up to 256 MB   54 x 44 mm

                     ARM® Dual            DDR3L-SDRAM:      Linux, QNX
                     Cortex™ A7           Up to 2 GB        On request:         3,3 V
                     LS1020A,             eMMC Flash:       VxWorks, PikeOS,    Voltage monitor-   Up to 512 MB
     TQMLS102xA      LS1021A, LS1022A     Up to 16 GB       Integrity           ing (optional)     Quad SPI NOR   55 x 44 mm

                     ARM® Cortex™ A9                        Linux, VxWorks,
                     i.MX6 (Solo, Dual,   DDR3L-SDRAM:      QNX, Integrity
                     Quad, Dual Plus,     Up to 2 GB        On request:
                     Quad Plus, Dual      eMMC Flash:       Windows Embed-
       TQMa6x        Lite)                Up to 16 GByte    ded 7, Android      5V                 Up to 128 MB   70 x 46 mm

                                          DDR3-SDRAM:
                                          Up to 1 GB        Linux, QNX
                     ARM® Cortex™ A8      eMMC Flash:       On request:
       TQMa53        i.MX537              Up to 16 GByte    Android, WEC 7      5V                 -              55 x 44 mm

                                                            Linux, QNX, Win-
                                          DDR3L-SDRAM:      dows Embedded                                         TQMa335x
                     ARM® Cortex™ A8      Up to 512 MB      Compact 2013        3,3 V                             54 x 38 mm
                     AM3352, AM3354,      eMMC Flash:       On request:         Voltage monitor-   TQMa335x       TQMa335xL
     TQMa335x(L)     AM3357, AM3359       Up to 16 GB       VxWorks, Android    ing (optional)     Up to 128 MB   38 x 38 mm

                                          DDR2-SDRAM:       Linux, WinCE 6.0,                                     TQMa28
                     i.MX28 with an       Up to 256 MByte   QNX                                                   26 x 40 mm
                     ARM®926 core         eMMC Flash:       On request:                                           TQMa28L
      TQMa28(L)      i.MX287, i.MX283     Up to 16 GB       VxWorks             5V                 -              30 x 30 mm

    PowerPC                               Memory            Operating           Power              NOR
    Modules          CPU                  (RAM/Flash)       System              Supply             Flash          Dimensions
                     TQMT1042:            DDR3L-SDRAM:
                     T1042 Quad-Core      Up to 8GB w.ECC   Linux
                     TQMT1040:            eMMC Flash:       On request:
                     T1040 Quad-Core      Up to 8 GB        PikeOS, VxWorks,
    TQMT1042/T1040   with 8-Port Switch   (optional)        Wind River Linux    5V                 Up to 256 MB   74 x 54 mm

                     TQMP1020:            DDR3-SDRAM:
                     P1020 Dual-Core      Up to 4GB w.ECC   Linux, QNX
8                    TQMP2020:            DDR3-SDRAM:       On request:
    TQMP1020/P2020   P2020 Dual-Core      Up to 8GB w.ECC   VxWorks             3,3 V              128 MB         74 x 54 mm
Overview
       x86 Modules

x86                               Memory              Operating        Power                                 Form factor /
Modules      CPU                  (RAM/Flash)         System           Supply         Temperature            Dimensions
                                  LPDDR4-SDRAM:
                                  2/4/8 GB,
             Intel® Atom™         dual-channel        Windows, Linux
             E3900 series         soldered            On request:                     0°C...+60°C            SMARC 2.0
  TQMxE39S   (Apollo Lake)        4 – 64 GB eMMC      VxWorks, QNX     3,0 – 5,25 V   -40°C...+85°C          82 x 50 mm

             Intel® Atom™         DDR3L-SDRAM:        Windows, Linux                                         COM Express®
             E3800 series         2/4/(8) GB, w.ECC   On request:                     0°C...+60°C            Mini Type 10
 TQMxE38M    (Bay Trail-I)        soldered            VxWorks, QNX     4,75 – 20 V    -40°C...+85°C          55 x 84 mm

                                  DDR3L-SDRAM:
                                  2/4/(8) GB,
             Intel® Atom™         dual-channel        Windows, Linux                                         COM Express®
             x5/x7 E3900 series   soldered            On request:                     0°C...+60°C            Mini Type 10
 TQMxE39M    (Apollo Lake-I)      4 – 64 GB eMMC      VxWorks, QNX     4,75 – 20 V    -40°C...+85°C          84 x 55 mm

                                  DDR3L-SDRAM:
             Intel® Atom™         2/4/(8) GB, w.ECC   Windows, Linux                                         COM Express®
             E3800 series         soldered            On request:                     0°C...+60°C            Compact Type 6
  TQMxE38C   (Bay Trail-I)        4 – 64 GB eMMC      VxWorks, QNX     4,75 – 20 V    -40°C...+85°C          95 x 95 mm

                                  DDR3L-SDRAM:
                                  4/8 GB, w.ECC
             Intel® Atom™         dual-channel        Windows, Linux                                         COM Express®
             E3900 series         soldered            On request:                     0°C...+60°C            Compact Type 6
 TQMxE39C1   (Apollo Lake)        4 – 64 GB eMMC      VxWorks, QNX     4,75 – 20 V    -40°C...+85°C          95 x 95 mm

                                  DDR3L-SDRAM:
                                  Up to 8 GB,
             Intel® Atom™         dual-channel        Windows, Linux                                         COM Express®
             E3900 series         (2 SO-DIMMs)        On request:                     0°C...+60°C            Compact Type 6
 TQMxE39C2   (Apollo Lake)        4 – 64 GB eMMC      VxWorks, QNX     4,75 – 20 V    -40°C...+85°C (opt.)   95 x 95 mm

                                  DDR3L-SDRAM:
             Intel® Core™         4-16 GB,            Windows, Linux                                         COM Express®
             5000U series         dual-channel        On request:                     0°C...+60°C            Compact Type 6
 TQMx50UC    (Broadwell-U)        soldered            VxWorks, QNX     8,5 – 20 V     -40°C...+85°C (opt.)   95 x 95 mm

             Intel® Core™         DDR4-SDRAM:
             6000E series         Up to 32 GB,
             Intel® Xeon®         dual-channel        Windows, Linux                                         COM Express®
             E3-1500 v5 series    (w.ECC)             On request:                     0°C...+60°C            Basic Type 6
  TQMx60EB   (Skylake-H)          (2 SO-DIMMs)        VxWorks, QNX     8,5 – 20 V     -40°C...+85°C (opt.)   95 x 125 mm

             Intel® Core™         DDR4-SDRAM:
             7000E series         Up to 32 GB,
             Intel® Xeon®         dual-channel                                                               COM Express®
             E3-1500 v6 series    (w.ECC)                                             0°C...+60°C            Basic Type 6
  TQMx70EB   (Kaby Lake-H)        (2 SO-DIMMs)        Windows, Linux   8,5 – 20 V     -40°C...+85°C (opt.)   95 x 125 mm

                                                                                                                              9
Overview
ARM® | Power Architecture™ Starterkits

 ARM®              Performance            Suitable CPU      Form factor /   Integration
 Starterkits       Class / Scalability    Module standard   dimensions      Levels
                   ARM® Cortex™-A7
                   i.MX6UL
                   (G1, G2, G3)
                   I.MX6ULL
      STKa6ULx     (Y0, Y1, Y2)           –                 170 x 170 mm    Hardware Kit

                   Single- /
                   Dual-Core ARM®
                   Cortex™-A7 core
       STKa7x      i.MX7 (Solo, Dual)     –                 170 x 170 mm    Hardware Kit

                   ARM® Cortex™-A9
                   (i.MX6 Dual Plus /
      STKa6x-Set   i.MX6 Quad Plus)       –                 170 x 170 mm    Hardware Kit

                   ARM® Cortex™-A8
       STKa53      (i.MX53)               –                 170 x 170 mm    Hardware Kit

                   ARM® Cortex™-A8
                   (AM3352, AM3354,
      STKa335x     AM3359)                –                 170 x 170 mm    Hardware Kit

                   i.MX28 with an
                   ARM®926 core
       STKa28      i.MX287, i.MX283       –                 175 x 120 mm    Hardware Kit

 PowerPC           Performance            Suitable CPU      Form factor /   Integration
 Starterkits       Class / Scalability    Module standard   dimensions      Levels
                   TQMT1042:
                   T1042 Quad-Core
                   TQMT1040:
                   T1040 Quad-Core with
      STKT104x     8-Port Switch          –                 240 x 170 mm    Hardware Kit

                   TQMP1020:
                   P1020 Dual-Core
                   TQMP2020:
      STKP2020     P2020 Dual-Core        –                 240 x 170 mm    Hardware Kit

10
Overview
x86 Starterkits | ODM Platform Concepts

x86 Boards                 Performance                Suitable CPU               Form factor /   Integration
and Starterkits            Class / Scalability        Module standard            dimensions      Levels

                                                                                                 Mainboard,
                                                      COM Express®               eNUC            Hardware Kit,
         MSys             Intel® Atom™                Mini Type 10               100 x 100 mm    BoxPCs

                                                                                                 Mainboard,
                                                      COM Express®               Mini ITX        Hardware Kit,
                           Intel® Atom™               Mini Type 10               170 x 170 mm    BoxPCs, PanelPCs

                                                                                                 Mainboard,
                           Intel® Atom™ up to         COM Express®               Mini ITX        Hardware Kit,
                           Intel® Core™ i7            Compact Type 6             170 x 170 mm    BoxPCs, PanelPCs

       COMSys

                                                                                                 Mainboard,
                           Intel® Atom™ up to         COM Express®               Mini ITX        Hardware Kit,
                           Intel® Core™ i7 / Xeon®    Basic Type 6               170 x 170 mm    BoxPCs, PanelPCs

Note: x86 Starterkits (STKx...) for evaluation are available based on COMSys mainboards.

                                                                                                                    11
Overview
ODM Platform Concepts

 ARM®            Performance
 ODM Platforms   class / Scalability   Focus Markets          Box PC   PanelPC (Size)

                 ARM9 (i.MX28),
     BluePower   ARM11 (i.MX35)        Industrial             –        ü (7")

                  ARM® Cortex™-A8
     Tiny Box    (i.MX53)              Industrial             ü        –

 PowerPC         Performance
 ODM Platforms   class / Scalability   Focus Markets          Box PC   PanelPC (Size)

      BluePro    MPC5200               Industrial             –        ü (7”)

 x86             Performance
 ODM Platforms   class / Scalability   Focus Markets          Box PC   PanelPC (Size)

       MBox      Intel® Atom™          Industrial / various   ü        –

                 Intel® Atom™ up to
     COMBox      Intel® Core™ i7       Industrial / various   ü        –

                 Intel® Atom™ up to
     COMPanel    Intel® Core™ i7       Industrial / various   –        ü (15 - 32”)

12
Overview
Embedded Technologies for Medical Solutions

                    Performance
                    class / Scalability   Focus Markets   Box PC   PanelPC (Size)

                    Intel® Core™ i3
    Medical-PC      up to Intel® Xeon®    Medical         –        ü (15 - 32”)

                    Intel® Atom™ Quad-                             Full HD (1920x1200)
   InCover One      Core („BayTrail-T“)   Medical         –        display

  Modul No.1 mini                         Medical         –

                                                                                         13
TQ Technology inside

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                                                                             ment System

14
ARM® Modules
TQMa6ULx(L) – Energy efficient for future designs
(plug-in connector + directly soldered)

                                                                                                          >> Need more details?
                                                                                                www.tq-group.com/EN/TQMa6ULx

The minimodule TQMa6ULx, based on the i.MX6UL and i.MX6ULL, combines the ARM® Cortex™-A7 core technology with a variety of
interfaces. The TQMa6ULxL is the TQMa6ULx variant without connector and is directly soldered with the baseboard. The LGA module
has been developed especially for the use in high volume projects.
The integrated graphics controller supports applications with display and touch screen requirements. For various applications such as
industrial automation and controls with requirements for low power and secure data processing, there are three CPU variants
available. With a Single Cortex™-A7 core and a clock rate up to 528 MHz the TQMa6ULx provides a balanced ratio between applica-
tions for visualization and control performance and power dissipation.

The highlights:

¢¢   Graphic
¢¢   Extended temperature range
¢¢   2x Ethernet with IEE1588
¢¢   Low power consumption (typ. 1 W)
¢¢   Camera Sensor Interface
¢¢   Security functions
¢¢   Long term availability

     Starterkit STKa6ULx

     The core of the STKa6ULx set is the TQMa6ULx module with
     a Cortex™-A7 CPU. The components contained in the start-
     erkit constitute a modular system enabling you to develop
     your own product ideas. Development of graphic interfaces
     can be started immediately using the prepared combination
     of closed display unit and starterkit that are matched to
     each other. To develop your own hardware you can use the
     certified and qualified circuit components of the starterkit in
     your own designs.

                                                                                                                                  15
ARM® Modules
TQMa7x – Energy efficient and optimized for secure applications

                                                                                                          >> Need more details?
                                                                                                  www.tq-group.com/EN/TQMa7x

The minimodule TQMa7x, based on the i.MX7 from NXP, combines an ARM® Dual Cortex™-A7 core technology with a variety of
interfaces. The integrated graphics controller supports applications with display and touch screen requirements. For various appli-
cations such as networking, industrial automation and controls with requirements for fast and secure data processing, there are two
CPU variants available. With a Single- / Dual-Core ARM® Cortex™-A7 core and a clock rate up to 2 x 1,0 GHz the TQMa7x provides a
balanced ratio between high performance and power dissipation.

The highlights:

¢¢ Graphic with full HD support
¢¢ Q-SPI NOR Flash on Board
¢¢ High-Speed communication via 2x Gigabit Ethernet and
   1x PCle interface
¢¢ Low power consumption (typ. 2 W)
¢¢ Integrated Cortex™ M4
¢¢ Smart Card Interface
¢¢ Security functions

     Starterkit STKa7x

     The core of the STKa7x set is the TQMa7x module with a Dual
     Cortex™-A7 CPU. The components contained in the starterkit
     constitute a modular system enabling you to develop your
     own product ideas. Development of graphic interfaces can
     be started immediately using the prepared combination
     of closed display unit and starterkit that are matched to
     each other. To develop your own hardware you can use the
     certified and qualified circuit components of the starterkit in
     your own designs.

16
ARM® Modules
TQMLS102xA – For the networks of tomorrow

                                                                                                          >> Need more details?
                                                                                             www.tq-group.com/EN/TQMLS102xA

The minimodule TQMLS102xA, based on the processor LS102xA from NXP, combines the ARM® core architecture with the QorIQ™
high speed communication technology. The integrated graphics controller supports applications with display and touch.
For various applications such as networking, industrial automation and controls with requirements for fast and secure data process-
ing, there are three CPU variants available.
The Dual-Core ARM® Cortex™-A7 core provides a cache coherent interconnect bus system and a clock rate up to 2 x 1,0 GHz.
Thus the embedded module TQMLS102xA provides a balanced ratio between high performance and power dissipation.

The highlights:

¢¢ Graphic
¢¢ QorIQ™ QUICC Engine
¢¢ High speed communication via 3x Gigabit Ethernet, 2x PCle
    and one USB 3.0 interface
¢¢ Low power consumption (typ. 3 W)
¢¢ ECC protection
¢¢ Cache Coherent Interconnect bus system
¢¢ IEEE 1588 hardware support
¢¢ Security functions

   Starterkit STKLS102xA

   The core of the STKLS102xA set is the TQMLS102xA module
   with a Dual Cortex™-A7 CPU from NXP. The components con-
   tained in the starterkit constitute a modular system enabling
   you to develop your own product ideas. Development of
   graphic interfaces can be started immediately using the pre-
   pared combination of closed display unit and starterkit that
   are matched to each other. To develop your own hardware
   you can use the certified and qualified circuit components of
   the starterkit in your own designs.

                                                                                                                                      17
ARM® Modules
TQMa6x – Scalable performance and multimedia module

                                                                                                       >> Need more details?
                                                                                               www.tq-group.com/EN/TQMa6x

The minimodule TQMa6x, based on the processor i.MX6 from NXP, combines industry and multimedia. The integrated graphic con-
troller supports displays with a resolution up to Full HD.
Therefore the module is best suited for HMI and animated display screen- and accordingly multitouch applications.
With an ARM® Cortex™-A9 core and a clock rate up to 4 x 1,2 GHz the TQMa6x provides a balanced ratio between performance and
power dissipation. The TQMa6x supports also the CPU variants of the i.MX6 Plus. The i.MX Dual and Quad Plus CPUs enable enhanced
performance both in terms of the memory interface and graphics.

The highlights:

¢¢   Graphic
¢¢   Extended temperature range
¢¢   eMMC Flash
¢¢   NOR Flash
¢¢   Low power consumption (typ. 4 W)
¢¢   Long-term availability
¢¢   IEEE 1588 support
¢¢   Security functions

     Starterkit STKa6x-Set

     The core of the STKa6x-Set is the TQMa6x module with a
     Dual Cortex™-A9 CPU from NXP. The components contained
     in the starterkit constitute a modular system enabling you to
     develop your own product ideas.
     Development of graphic interfaces can be started immedi-
     ately using the prepared combination of closed display unit
     and starterkit that are matched to each other. To develop
     your own hardware you can use the certified and qualified
     circuit components of the starterkit in your own designs.

18
ARM® Modules
TQMa53 – The Multimedia module

                                                                                                          >> Need more details?
                                                                                                  www.tq-group.com/EN/TQMa53

The minimodule TQMa53, based on the processor i.MX537 from NXP, combines industry and multimedia. The integrated graphic
controller supports displays with a resolution up to UXGA. Therefore the module is best suited for HMI and animated display screen-
and accordingly multitouch applications.
With an ARM® Cortex™-A8 core and a clock rate up to 1,2 GHz the TQMa53 provides a balanced ratio between performance and
power dissipation.

The highlights:

¢¢   Graphic
¢¢   Extended temperature range
¢¢   eMMC flash
¢¢   Low power consumption (typ. 3 W)
¢¢   Long-term availability
¢¢   IEEE 1588 support
¢¢   Security functions

     Starterkit STKa53

     The core of the STKa53 set is the TQMa53 with the i.MX53
     CPU from NXP. With the preconfigured starterkit you can
     start immediately with the development of your application
     in order to achieve a fast time-to-market.
     To develop your own hardware you can use the certified
     and qualified circuit components of the starterkit in your
     own designs. A large accessory kit enables the connection of
     commercial monitors. Different display solutions for a direct
     connection to LVDS / TTL are available upon request.

                                                                                                                                  19
ARM® Modules
TQMa335x(L) – Multifunctional talent for universal applications
(plug-in connector + directly soldered)

>> Need more details?                                                                                 >> Need more details?
www.tq-group.com/EN/TQMa335x                                                               www.tq-group.com/EN/TQMa335xL

The minimodule TQMa335x, based on the AM335x processor, offers a balanced ratio between computing and graphic performance.
The minimodule TQMa335xL is the TQMa335x variant without connector and is directly soldered with the baseboard. The LGA mod-
ule has been developed especially for the use in high volume projects.
The basis for this is a ARM® Cortex™-A8 core with up to 1 GHz. The realised memory on the module provides best system support.
The module is best suited for visualization and control applications with real time demands.
A large number of interfaces and module functions are implemented in the CPU due to the high level of interface and function
integration. This allows the basic board to be developed easily and at low-cost.
All the processor’s functional pins are on the module plug-in connector.

The highlights:

¢¢   Real time communications subsystem
¢¢   LGA-variant recommended for high quantity use
¢¢   Low-cost due to highest level of integration
¢¢   Extended temperature range
¢¢   2x IEEE1588 Ethernet (int. Switch)
¢¢   Low power consumption (2 W)
¢¢   Long-term availability
¢¢   IEC61850 stack

     Starterkit STKa335x

     The core of the STKa335x is the TQMa3359 with an ARM®
     Cortex™-A8 CPU. The components contained in the starterkit
     constitute a modular system enabling you to develop your
     own product ideas. Development of graphic interfaces can
     be started immediately using the prepared combination of
     closed display unit and starterkit that are matched to each
     other.
     Please note, that for evaluation purposes we provide you
     with the starterkit STKa335x with the module TQMa335x (not
     TQMa335xL!). The module mainly differs in the plug-system.

20
ARM® Modules
TQMa28(L) – Functional talent for various applications
(plug-in connector + directly soldered)

>> Need more details?                                                                                      >> Need more details?
www.tq-group.com/EN/TQMa28                                                                        www.tq-group.com/EN/TQMa28L

The minimodule TQMa28, based on the i.MX28 processor, offers a balanced ratio between computing and graphic performance.
The basis for this is an ARM926 core with up to 450 MHz. The realised memory on the module provides best system support.

The minimodule TQMa28L is the TQMa28 variant without connector and is directly soldered with the baseboard. The BGA module
has been developed especially for the use in high volume projects. Due to the high level of integration it is extremely space- and
cost-saving. All the processor’s functional pins are on the module plug-in connector.

The highlights:

¢¢   Smallest ARM9 module
¢¢   LGA-variant recommended for high quantity use
¢¢   Low-cost due to highest level of integration
¢¢   Extended temperature range
¢¢   2x IEEE1588 Ethernet (L2 Switch)
¢¢   Low power consumption (typ. 1 W)
¢¢   Long-term availability
¢¢   Power management, Battery charge functionality
¢¢   IEC 61850 stack, IEC62439-3 PRP

     Starterkit STKa28

     The core of the STKa28 is the TQMa28 with an ARM9 CPU.
     The components contained in the starterkit constitute a
     modular system enabling you to develop your own product
     ideas. Development of graphic interfaces can be started im-
     mediately using the prepared combination of closed display
     unit and starterkit that are matched to each other.
     Please note, that for evaluation purposes we provide you
     with the starterkit STKa28 with the module TQMa28 (not
     TQMa28L!). The module mainly differs in the plug system.

                                                                                                                                     21
TQ Technology inside

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22
Power Architecture™ Modules
TQMT1042/T1040 – Higher Performance and Less Power Consumption
with the new 64-Bit Multi-Core Processors

                                                                                                       >> Need more details?
                                                                                             www.tq-group.com/EN/TQMT1042
                                                                                             www.tq-group.com/EN/TQMT1040

The embedded modules TQMT1042, TQMT1040 and related variants embody the next generation of the well-known TQMP1020/2020
QorIQ™ product family based on Power Architecture™. The QorIQ™ T1 processor family inaugurates new applications in industry and
communications. With four e5500 (64-Bit) cores and a clock rate of up to 4x 1400 MHz, the TQ modules using QorIQ™ processors pro-
vide the best ratio between processing speed and power loss. The 28 nm technology significantly reduces the power consumption
compared to a QorIQ™ module of the former generation. This feature, together with the expanded temperature range and intelligent
power management, enables the use in fanless systems. The TQMT1042 and TQMT1040 are best suited for industrial or telecommuni-
cation application that demand high availability, outdoor ambient temperatures and small overall size.

The highlights:

¢¢ Q
    uad core up to 1400 MHz in 28nm SOI for the best
    Performance/Watt ratio
¢¢ High-speed communication via various Gigabit Ethernet
    interfaces, 4x PCle and two USB 2.0 High Speed interfaces
¢¢ Up to two SATA interfaces for data storage
¢¢ Easy function extensions via PCle, eSPI, I²C and IFC
    (local bus)
¢¢ IEEE 1588 time synchronization in hardware
¢¢ Extremely compact module dimensions
¢¢ Display Interface Unit

   Starterkit STKT104X

   The baseboard STKT104X supports all modules of the type
   series TQMT104X and represents an universal platform for
   evaluation and development of customer specific platforms
   for those modules.

                                                                                                                              23
Power Architecture™ Modules
TQMP1020 / P2020 – The move-in of Multicore

                                                                                                       >> Need more details?
                                                                                             www.tq-group.com/EN/TQMP2020
                                                                                             www.tq-group.com/EN/TQMP1020

The embedded modules TQMP2020 and TQMP1020 open up the possibility of new applications in industry and communications.
With two e500 cores and a clock speed ranging up to 2x1200 MHz, the TQ modules with its QorIQ™ processor offer an optimal
balance between data processing speed and power dissipation. Thanks to the 45nm technology employed, power consumption is
markedly lower than in comparable PowerQUICC III modules. This along with the extended temperature range means that it can be
fitted to fanless systems. The TQ minimodules TQMP2020 and TQMP1020 are ideally suited to industrial applications where long-term
availability, outdoor ambient temperatures and small sizes are important factors.

The highlights:

¢¢ E asiest migration of Power QUICC III on QorlQ™ by approved
    e500v2 Core
¢¢ Dual-core processors with up to 1200 MHz in 45nm SOI for
    excellent Performance/Watt ratio
¢¢ High-Speed communication via 3x Gigabit Ethernet, 3x PCle
    and one USB 2.0 interface
¢¢ Simple function extension via PCle, SPI, I²C and flexible
   Local Bus
¢¢ IEEE 1588 synchronization on time in hardware
¢¢ Extremely compact with only 74 x 54 mm

     Starterkit STKP2020

     The baseboard STKP2020 supports all modules of the type
     series TQMP20xx and TQMP10xx and represents an universal
     platform for evaluation and development of customer
     specific platforms for those modules.

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TQ Technology inside

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x86 Modules
TQMxE39S – SMARC Module with Intel® Atom™ x5/x7 E3900

                                                                                                             >> Need more details?
                                                                                                   www.tq-group.com/EN/TQMxE39S

The TQ module TQMxE39S is based on the latest generation of Intel® Atom™, Pentium® and Celeron® processors (code named “Apollo
Lake”). It achieves a new level of compute performance, security and media processing performance in an extremely compact form
factor. The module corresponds to the modern SGET Standard SMARC 2.0 (“Smart Mobility ARChitecture”).
The TQMxE39S targets small, low power and low cost applications with preferences in the embedded mobile market.
Three 4K display outputs powered by the integrated Intel® graphics processor enable applications with impressive user experience.
Immersive 3D processing and greatly increased video encode and playback performance improves high resolution multimedia
content.
High speed interfaces like Gigabit Ethernet, PCIe, USB 3.0 and 6Gbps SATA ensure high communication bandwidth. SPI, SDIO and seri-
al interfaces extend the communication path to the carrierboard. Onboard eMMC up to 64 GB and the option for Dual-Channel LVDS
or native eDP enable flexibility and reduce overall BOM cost.

The highlights:

¢¢    Supports Intel® Atom™ x5/x7 E3900 series, Pentium® N4200 and Celeron® N3350 processors
¢¢    Dual / Quad core computing power with up to 2.5 GHz
¢¢    4 / 8 GB LPDDR4
¢¢    High-speed interconnected with Gigabit Ethernet, 6x USB (3.0 / 2.0) and up to 4 PCIe lanes
¢¢    Triple Display support with DP/HDMI (up to 4K UHD) and eDP/LVDS
¢¢    Up to 64 GB eMMC flash, soldered
¢¢   Small size (82 x 50 mm)
¢¢    Extended temperature support

     Starterkit STKxE39S set

     The mainboard MB-S20-1 included in the starterkit is a carrier
     board for SMARC 2.0 modules.
     It is designed for mobile applications supporting features like
     Smart Battery, mobile connectivity and extended security
     options.

                                                                                                                                27
x86 Modules
TQMxE38M – COM Express® Mini Module with Intel® Atom™ E3800

                                                                                                            >> Need more details?
                                                                                                 www.tq-group.com/EN/TQMxE38M

The TQ module TQMxE38M enables the implementation of powerful but also economical x86 based systems based on the inter-
national established PICMG® standard COM Express® Mini (COM.0 R2.1). At the Type 10 compliant pinout the user has access to all
fundamental interfaces of the CPU. For that all capabilities of the Intel® Atom™ processor could be used. The direct access to the
interfaces like digital display interface (DDI) / embedded DisplayPort (eDP) and the USB device interface gives the user the unlimited
freedom to use the features of the CPU in the most suitable way for his application.
The compact and robust design as well as the option of conformal coating extends the use cases to applications within rugged
industry, railway and aviation environments. Based on the very low power consumption and the extended temperature support it is
also possible to realize outdoor applications in an easy and reliable way.

The highlights:

¢¢      For ultra compact x86 designs
¢¢      Up to 8 GB DDR3L with ECC support
¢¢     Flexibility with direct eDP / second DDI interface
¢¢      TQMx86 board controller with flexible customization options (flexiCFG)
¢¢      Security with TPM 1.2 / 2.0 (opt.)
¢¢      “Green ECO-Off” (minimum of standby power)
¢¢    Watchdog and thermal management
¢¢    Extended temperature support
¢¢     Highest reliability, 24/7 certified
¢¢   Very robust design, conformal coating capability

     Starterkit STKxE38M set

     The COM Express® mainboard MB-COME10-1 included in the
     starterkit is a carrier board for COM Express® Mini modules
     with Type 10 pinout. It can be used as an evaluation platform
     and as well as a production ready embedded PC solution.
     The many extension options and storage media that can be
     added offer a high level of flexibility which allows quick and
     easy testing. The design is pre-validated for mass production,
     therefore customers can adopt parts of the schematics to
     realize their own designs.

28
x86 Modules
TQMxE39M – COM Express® Mini Module with Intel® Atom™ x5/x7 E3900

                                                                                                              >> Need more details?
                                                                                                   www.tq-group.com/EN/TQMxE39M

The TQ module TQMxE39M is based on the latest generation of Intel® Atom™, Pentium® and Celeron® processors (code named
“Apollo Lake”). It achieves a new level of compute performance, security and media processing performance in a very compact
form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and more.
The module corresponds to the international established PICMG® standard COM Express® Mini (COM.0 R2.1) with type 10 pinout.
8 USB ports – including 2x USB 3.0 – and up to 4 PCIe lanes natively supported by the processor enable high bandwidth communi-
cation with peripherals and additional interfaces on the carrierboard. With the latest Intel® graphics processor integrated the module
delivers 4K high resolution graphics output, immersive 3D processing and also greatly increased video encode and playback per-
formance. Time coordinated computing capabilities enable time synchronized processes within IoT networks and industrial control
applications. Onboard eMMC up to 64 GB and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost.
The integrated TQMx86 board controller enables high flexibility through “flexiCFG” and supports thermal management, watchdog
and “Green ECO-Off” with a minimum of standby power. Combined with options like conformal coating and optimized cooling solu-
tions the TQMxE39M fits also perfectly into ruggedized applications.

The highlights:

¢¢    Supports Intel® Atom™ x5/x7 E3900 series, Pentium® N4200 and Celeron® N3350 processors
¢¢    Dual / Quad core computing power with up to 2.5 GHz
¢¢    2 / 4 / 8 GB DDR3L (dual channel, non-ECC), soldered
¢¢    High-speed interconnected with Gigabit Ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
¢¢    Dual Display support with DP/HDMI (up to 4K UHD) and eDP/LVDS
¢¢    Up to 64 GB eMMC flash, soldered
¢¢   Extended temperature support

     Starterkit STKxE39M set

     The COM Express® mainboard MB-COME10-1 included in the
     starterkit is a carrier board for COM Express® Mini modules
     with Type 10 pinout. It can be used as an evaluation platform
     and as well as a production ready embedded PC solution.
     The many extension options and storage media that can be
     added offer a high level of flexibility which allows quick and
     easy testing. The design is pre-validated for mass production,
     therefore customers can adopt parts of the schematics to
     realize their own designs.

                                                                                                                                    29
x86 Modules
TQMxE38C – COM Express® Compact Module (Type 6)
with Intel® Atom™ E3800

                                                                                                        >> Need more details?
                                                                                              www.tq-group.com/EN/TQMxE38C

The TQ module TQMxE38C enables the implementation of powerful but also economical x86 based systems based on the interna-
tional established PICMG® standard COM Express® Compact (COM.0 R2.1). At the Type 6 compliant pinout the user has access to all
fundamental interfaces of the CPU. For that all features of the Intel® Atom™ processor can be used. Additional USB ports and LVDS
are available.
The compact and robust design as well as the option of conformal coating extends the use cases to applications within rugged
industry, railway and aviation environments. Based on the very low power consumption and the extended temperature support it is
also possible to realize outdoor applications in an easy and reliable way.

The highlights:

¢¢   Powerful entry level for scalable x86 platforms
¢¢   Up to 8 GB DDR3L with ECC support
¢¢   Onboard eMMC
¢¢   TQMx86 board controller with flexible customization options (flexiCFG)
¢¢   Security with TPM 1.2 / 2.0 (opt.)
¢¢   “Green ECO-Off” (minimum of standby power)
¢¢   Watchdog and thermal management
¢¢   Extended temperature support
¢¢   Highest reliability, 24/7 certified
¢¢   Very robust design, conformal coating available

     Starterkit STKxE38C set

     The COM Express® mainboard MB-COME6-1 included in
     the starterkit is a carrier board for COM Express® Compact
     modules with Type 6 pinout. It can be used as an evaluation
     platform and as well as a production ready embedded PC
     solution. The many extension options and storage media
     that can be added offer a high level of flexibility which allows
     quick and easy testing. The design is pre-validated for mass
     production, therefore customers can adopt parts of the
     schematics to realize their own designs.

30
x86 Modules
TQMxE39C1 – COM Express® Compact Module
with Intel® Atom™ x5/x7 E3900 and soldered DDR3L with ECC option

                                                                                                              >> Need more details?
                                                                                                   www.tq-group.com/EN/TQMxE39C1

The TQ module TQMxE39C1 is based on the latest generation of Intel® Atom™, Pentium® and Celeron® processors (code named
“Apollo Lake”). It achieves a new level of compute performance, security and media processing performance in a very compact form
factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and more. The module
corresponds to the international established PICMGR standard COM Express® Compact (COM.0 R2.1) with type 6 pinout.
8 USB ports – including 2x USB 3.0 – and up to 4 PCIe lanes natively supported by the processor enable high bandwidth communi-
cation with peripherals and additional interfaces on the carrierboard. With the latest Intel® graphics processor integrated the module
delivers 4K high resolution graphics output, immersive 3D processing and also greatly increased video encode and playback per-
formance. Time coordinated computing capabilities enable time synchronized processes within IoT networks and industrial control
applications. Onboard eMMC up to 64 GB and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost.
The integrated TQMx86 board controller enables high flexibility through “flexiCFG” and supports thermal management, watchdog
and “Green ECO-Off” with a minimum of standby power. Combined with options like conformal coating and optimized cooling solu-
tions the TQMxE39C1 fits also perfectly into ruggedized applications.

The highlights:

¢¢    Supports Intel® Atom™ x5/x7 E3900 series, Pentium® N4200 and Celeron® N3350 processors
¢¢    Dual / Quad core computing power with up to 2.5 GHz
¢¢    4 / 8 GB DDR3L (dual channel, ECC), soldered
¢¢    High-speed interconnected with Gigabit Ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
¢¢    Triple Display support with DP/HDMI (up to 4K UHD) and eDP/LVDS
¢¢    Up to 64 GB eMMC flash, soldered
¢¢   Extended temperature support

     Starterkit STKxE39C1 set

     The COM Express® mainboard MB-COME6-1 included in the
     starterkit is a carrier board for COM Express® Mini modules
     with Type 6 pinout. It can be used as an evaluation platform
     and as well as a production ready embedded PC solution.
     The many extension options and storage media that can be
     added offer a high level of flexibility which allows quick and
     easy testing. The design is pre-validated for mass production,
     therefore customers can adopt parts of the schematics to
     realize their own designs.

                                                                                                                                    31
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