SIM Evolution Klaus Vedder - SIGOS
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SIM Evolution
Presented by: Klaus Vedder For: 20th Sigos Conference
10 July 2018
© ETSI 2018
The Subscriber Identity Module in 1988
"A SIM is the physically secured module which contains the IMSI, an authentication algorithm, the
authentication key and other (security related) information and functions. The basic function of
the SIM is to authenticate the subscriber identity in order to prevent misuse of the MS (Mobile
Station) and the network."
From the report of SIMEG#1 in January 1988
GSM System Requirement: provide the same level of security as the fixed network
The question at the time:
Wouldn't it be sufficient to have a
functional specification and let
every operator specify its own
interface (except for the form
Plug-in SIM with carrier factor) ?
Telemig, Brazil, 2005
© ETSI 2018 2
3
The Form Factors in 1988
Option 1: "IC card"
The ID-1 card used by Deutsche Telekom
in their analogue network
Option 2: "Fixed" = Software SIM fully incorporated into the handset
Rejected due to security concerns and less flexibility - would require operator
specific personalisation of the handset
a
Option 3 (Plug-in SIM):
"Removable"
vs
24 pin DIL
© ETSI 2018 with 8 pins connected 3
Some Early SIMs
The SIM card: The key to gain
access to your customer
Used for the first call in June 1991
Signature strip
The contact area well integrated into Plastic not suitable for embossing
the design and use as a credit card
© ETSI 2018 4
Security, Technology and Services
The SIM: Providing the security
Issuer specific authentication algorithm
Issuer specific algorithm for cipher key generation
Security management specified by issuer
Attacks
1998 black box attack against Comp 128-1
Chosen plaintext-ciphertext attack to calculate the secret authentication key
2013 Black Hat Conference Las Vegas: Faulty SW implementations
“… This talk ends this myth of unbreakable SIM cards … and illustrates that the cards - like any
other computing system – are plagued by implementation and configuration bugs.“ Karsten Nohl
The SIM card: Providing universal plastic roaming
The SIM card: Fostering the mass market by “Freeing the Mobile of the subscription“
The SIM: Driving Technology and Applications
Leading to new generations of micro-controllers
Memory requirements for smart cards were driven solely by GSM
High temperature card material to satisfy the new environment
The SIM Application Toolkit
The world's first global platform for secure Value Added Services
© ETSI 2018 5
From the SIM to the UICC
or from “mono”-application to multi-application
1999/2000 Split of all SIM specifications and responsibility
A generic part (UICC) to form the multi-application platform (ETSI)
An application specific part, the SIM application (3GPP)
The UICC consists of (all) application independent functions and features
Separation of lower layers and applications
Fire walls between applications
Up to 20 logical channels to run applications in parallel ID
USB, NFC, security, … part of UICC specification Ticketing
Electr. Purse
Specified by
the USIM SIM
respective Public
Transport
industry
sector Toolkit
Specified by
ETSI
UICC
the multi-application smart card platform
TC SCP
© ETSI 2018 6
7
Some Thoughts on Standardisation
Standardisation can create a mass market
GSM vs Telepoint ("Birdie", "Rabbit“, …)
Standardisation can drive technology
Standardisation is a way to achieve interoperability
There is, however, more needed than just the specification containing the technical
realisation of the requirement specification
Standardisation shall not prevent technical, commercial and market progress
Backwards compatibility is not always a desired feature
Advancing from 2G to 3G and ignoring total backwards compatibility would have
provided a huge improvement on the technical side with a high potential for the
commercial side in the mid to long term
Using a standards body to delay or block a topic may prove counterproductive
and lead to a fragmented market
Standardisation for the sake of standardisation is a waste of
time and money
© ETSI 2018 7
The Machine
What’s to?Machine UICC
in a Title
March 2010: ETSI TC SCP approves a new specification for UICCs inM2M
(TS 102 671 Smart Cards, Machine to Machine UICC, Physical and logical characteristics)
M2M specific constraints
such as data retention, Plug-in SIM card
temperature, memory update cycles, 15mm x 25 mm
vibration resistance, humidity
MFF1 (M2M Form Factor 1)
socketable 8 pin solution
MFF2 : a non-removable, SON8
5mm x 6mm
to-be-soldered package (SON8) SON8
5mm x 6mm
Can the use of M2M Form Factors really be restricted to
Machine-to-Machine applications ?
© ETSI 2018 8
8
Some Impacts of a Solderable UICC
No more "plastic roaming "
Need to change the operator after deployment
Ownership of an embedded UICC
In some countries the end user will own the "black beetle “
No point in stealing a mobile device with an embedded UICC
Lifetime issues of the chip - as long as the device (?)
Lifecycle management - personalisation and distribution
Future role of the MNOs and service providers (car manufacturers,
energy suppliers, …)
© ETSI 2018 9
Managing an embedded UICC
Today: HW, SW, security data out of one and the same source
The SIM manufacturer develops OS including security optimised algorithms
The SIM manufacturer generates personalisation data (serial numbers, keys, MNO
credentials, …), loads them into the chip in its premises, together with an MNO
specific profile, and sends SIMs and data to the MNO
Tomorrow: Split system
OEMs (device vendors) are provided with chips containing OS and algorithms
Subscription Manager (SIM manufacturer) generates personalisation data (serial
numbers, keys, MNO credentials. …) and sends these data to MNO and OEM
OEM loads data on its premises in a secure way into the UICCs
Two questions:
How to handle the case that the device is not specifically produced for a specific MNO
(in particular in the case of M2M devices)
How to change the subscription of a device in the field
© ETSI 2018 10
10Challenges
Provisioning of subscriptions over-the-air or over-the-wire
after production, outside of factory
New ecosystem with dynamic subscription management
(changing of subscriptions and profiles in the field)
© ETSI 2018 11The Road to embedded UICCs, the Loss of the Fast
Interface and Other Form Factors
"Today's SIM card is the most expensive piece of real estate on a PCB"
(OEM manufacturer in 2012)
The ID-1 Card
(1FF, 1988)
3FF (2003) 4FF (2012)
Non-standardised
packages - size of
the package
Plug-in Card ~ 2016 down to chip-
MFF2
(2FF, 1989) (2010) scale
VCC GND
The 4th form factor does not provide the space for the USB Courtesy
Giesecke & Devrient
RST SWP interface which had taken years to be approved
CLK I/O SWP (Single Wire Protocol) is the standardised interface for
NFC-applications
USB USB
© ETSI 2018 12Secure Elements: From Separate to Integrated
The traditional SIM needs to be re-considered in the context of new mobile
communication challenges, including machine to machine communications.*
eUICC**
The UICC becomes an integrated, though dedicated piece of hardware of the device (e.g.,MFF2)
Provides the possibility of dematerialising the issuance of the SIM
SSP (Smart Secure Platform)
First informal discussions at SCP#71 in Cupertino in October 2015
Idea: Get rid of the UICC transport protocol (T=0), APDUs, …..
Create a new high level interface application - independent of lower levels
* Prof. Mike Walker when presenting the work of Deutsche Telekom, G&D, Telefónica O2 UK and
Vodafone on the management of embedded UICCs at the ETSI Security Conference in January 2011
** An embedded UICC or eUICC is a "UICC which is not easily accessible or replaceable, is not intended to be removed
or replaced in the terminal, and enables the secure changing of subscriptions" (ETSI TS 103 383)
© ETSI 2018 13The Smart Secure Platform
Objective: better integration of the UICC into the Layout of the SSP protocol stack
specific use case while retaining its characteristics
SSP is designed to be a modular platform offering a
core set of features as well as a number of options
that need to be selected at the time of
implementation based on the intended application
(e.g., a system of sensors in an IoT application will
most likely not require full fledged UICCs in every
sensor).
An open platform for multiple applications
Clear separation of layers
Choice of protocols (SPI, I2C, …)
Faster and flexible
Choice of hardware
New filesystem
Support of existing features
Figure taken from ETSI TS 103 465 v 1.3.0
Contactless, Toolkit, …
© ETSI 2018 14The New SSP Specifications
The SSP “classes”
iSSP: the UICC (and thus the SIM) becomes an integrated part of the chipset (SoC)
eSSP: SSP version of the eUICC;
rSSP: SSP version of the (removable) UICC
Priority on integrated SSP; eSSP and rSSP to follow
Requirements split into generic requirements for all classes and class
specific requirements (currently only for iSSP)
TS 103 465 Smart Secure Platform; Requirements
Status: under change control
The technical realisations
TS 103 666-1 Smart Secure Platform; General characteristics
TS 103 666-2 Smart Secure Platform; Integrated SSP (iSSP) characteristics
Status: both are approaching completion
© ETSI 2018 15The iSSP Concept
Integration of the functionality of the UICC into a System on Chip (SoC) solution. The
iSSP is an independent secure processor within the SoC
Advantage lies in the reduction of the number of chips, deeper integration and thus
reduced amount of space
Several bundles may co-exist in the SoC; one being executed within the Tamper
Resistant Element (TRE) and the rest stored securely outside the TRE, ready to be
swapped in and executed as required
Bundle 1 Bundle 2 Bundle 3 Bundle 4 Bundle 5
Telecoms Payment Identity DRM IoT
Technology
Primary Platform Interface & use ase
independent
Primary Platform *
(underlying HW, low level OS, …)
*For details and a diagram depicting an SoC solution see GlobalPlatform
Technology VPP –Concepts and Interfaces Version 1.0 (March 2018)
© ETSI 2018 16Multiple Industry Sector SSP
3GPP Functions
Device Connections Connects to the enabled
forbidden ? and active Telecom
Under discussion Bundle(s)**
** “(s)“ or no “(s)“ ,
that’s the question
Payment Bundle Management Entity* Telecom Bundle Management Entity*
*Not yet specified;
rules up to the
Bundle 1 Bundle 2 Bundle 3 Bundle 4 Bundle 5 Bundle 6 specific industry
SSP sector
Family Identifier:Family Identifier: Family Identifier: Family Identifier: Family Identifier: Family Identifier:
“Payment” “Payment” “XYC” “Telecom Bundle”“Telecom Bundle” “Telecom Bundle”
Primary Platform Interface
Primary Platform
© ETSI 2018 17Conclusion
The standardised SIM packages
x
will (largely) disappear
SoC
and
a new logical interface will replace today’s rather old interface
for use by all industry sectors.
© ETSI 2018 18Where is this Trip Really Leading Us ?
The meeting which started the concept of the UICC at the total eclipse of the sun in 1999
© ETSI 2018 19Thank You
nearly
Dr. Klaus Vedder
Chairman ETSI TC SCP
Zeata Security Ltd.
ETSI TC Smart Card Platform
Home of the UICC
The most widely deployed Secure
Element in the world
Next ETSI TC SCP Plenary Meeting
Paris, France
20-21 September 2018
see: www.etsi.org
© ETSI 2018 20ETSI TC SCP
Home of the UICC – the most widely deployed Secure Element with more
than 5 billion pieces going into the market every year
30 years of dedication and real-life experience
Scope
Creation of a series of specifications for a Secure Element platform on which bodies from inside and outside
the telecom-world can base their system specific applications to achieve compatibility between all
applications resident on the Secure Element
Development and maintenance of interface, procedures and protocol specifications between the Secure
Element and entities (remote or local) used in the management of that Secure Element. This includes
interfaces, procedures and protocol specifications used between such entities for the secure provisioning and
operation of services making use of that Secure Element
Output
Over fifty specifications and reports on Secure Elements encompassing for every topic the whole range
from requirements via the technical solution to the related test specification; topics range from administrative
commands to APIs, browsers, Internet connectivity, Machine-to-Machine,
new interfaces for high speed and NFC as well as remote management
All specifications can be downloaded free of charge from the ETSI website
The specifications are application agnostic.
© ETSI 2018 21You can also read
