Pixel detector R&D for CLIC - VCI2019 - The 15th Vienna Conference on Instrumentation - CERN TWiki
←
→
Page content transcription
If your browser does not render page correctly, please read the page content below
Pixel detector R&D
for CLIC
VCI2019 – The 15th Vienna Conference on Instrumentation
Dominik Dannheim (CERN)
on behalf of the CLICdp collaboration
February 18, 2019 Pixel detector R&D for CLIC 1
Outline • CLIC accelerator and detector, requirements • Sensor and readout technologies for vertex/tracker • Simulation Framework • Detector Integration • Conclusions February 18, 2019 Pixel detector R&D for CLIC 2
CLIC accelerator and detector
Possible staged CLIC implementation
• CLIC (Compact LInear Collider):
linear e+e- collider concept for post HL-LHC phase
• √s from few hundred GeV up to 3 TeV
(two-beam acceleration with ~100 MV/m)
• Precision and discovery physics at the TeV scale
• Detector and physics studies within the
CLICdp collaboration of 30 institutes
CLIC detector model
CLICdp collaboration institutes
CLICdp collaboration
12.8 m
February 19, 2018 Silicon Pixel R&D for CLIC 3
Experimental conditions at CLIC
• CLIC operates with bunch trains, 50 Hz repetition rate Not to scale ! 20 ms
à Low duty cycle
à Trigger-less readout between trains
à Allows for power-pulsed operation of detector, CLIC
to reduce average power consumption bunch structure
156 ns
• Collisions within 156 ns bunch trains Very small bunches:
• High E-fields lead to Beamstrahlung 40 nm (x) x 1 nm (y) x 44 μm (z)
à High rates of beam-induced background particles (at 3 TeV)
à Drives detector design (layout, granularity, timing)
Main backgrounds in detector:
• Incoherent e+e- pairs
• 19k particles / bunch train at 3 TeV
• Constrains beam pipe radius, granularity
• ! ! àhadrons events
• 17k particles / bunch train at 3 TeV
• Constrains granularity, layout, impacts physics
CLICdp-Note-2018-005
February 19, 2018 Silicon Pixel R&D for CLIC 4
CLIC vertex- and tracking detector requirements
Vertex detector: Vertex-detector simulation geometry
• efficient tagging of heavy quarks through precise
determination of displaced vertices:
à good single point resolution: σSP~3 μm
à small pixels ⪅ 25x25 μm2, analog readout
à low material budget: ⪅ 0.2% X0 / layer
à low-power ASICs + air cooling (~50 mW/cm2) 260 mm
0.84 m2
Tracker:
• Good momentum resolution: σ(pT) / pT2 ~ 2 x 10-5 GeV-1
à 7 μm single-point resolution (~25-50 μm pitch in Rφ)
Tracker simulation geometry
à many layers, large outer radius
à ~1-2% X0 per layer
à low-mass supports + services
Both:
• 20 ms gaps between CLIC bunch trains
à trigger-less readout, pulsed powering 137 m2
• few % max. occupancy from beam backgrounds
à sets inner radius and limits cell sizes
à time stamping with ~5 ns accuracy
à depleted sensors (high resistivity / high voltage)
• moderate radiation exposure (~104 below LHC!):
• NIEL: < 1011 neq/cm2/y
• TID: < 1 kGy / year
February 18, 2019 Pixel detector R&D for CLIC 5
CLIC pixel-detector R&D
Sensor + readout technologies
Sensor + readout technology Currently considered for Beam test
Summary and outlook
Bump-bonded Hybrid planar sensors Vertex
Prototypes
Capacitively coupled HV-CMOS of sensors
various integrated technologies
Vertexunder investigation for the CLIC tracker:
Monolithic HV-CMOS sensorsHV-CMOS:
Integrated Tracker
Monolithic HR-CMOS -sensor
MuPix and ATLASpix integrated in CLICdp Timepix3 telescope
Tracker
Monolithic SOI sensors
- Proof of principle of fully integrated elongated pixel design in HV-CMOS
Vertex, Tracker 7 Timepix3
process
Cracow SOI DUT C3PD+CLICpix2
Caribou r/o
board
telescope planes assembly
SOI HR-CMOS:
CLICpix + 50 μm sensor C3PD+CLICpix2 glue ass. ATLASPIX HV-CMOS INVESTIGATOR HR-CMOS Cracow SOI
- Test beam studies of various pixel layouts and substrates
- Good performance of investigated Cracow design for 500 μm thick
prototypes
- Further studies with thinner prototypes to evaluate performance w.r.t.
requirements for CLIC tracker
SOI test chip
Integrated HR-CMOS
- Test beam and simulation studies of two different
Simulation/Characterisation Detector integration
submissions
- Promising
CaRIBOu Cooling of 50 μm thin
DAQanalogue performance prototype supports
Light-weight Detector
assembly
(25 μm thin epitaxial layer) w.r.t. requirements for CLIC tracker:
Allpix2 sim. - Efficiency > 99 %, spatial resolution down to 3.5 μm, timing
resolution ~ 5 ns (28 μm pitch)
Fully integrated chip for the CLIC tracker: Investigator HR test chip
• Challenging requirements lead to extensive detector R&D program
• - Studied HR CMOS technology used in next phase of R&D to design a fully integrated
~10 institutes active in vertex/tracker R&D
• prototypeALICE,
Collaboration with ATLAS, chip for the CLIC Mu3e,
LHCb, tracker AIDA-2020
p. 17/17
February 18, 2019 Pixel detector R&D for CLIC 6
Sensor and readout R&D
Hybrid planar sensors ELAD planar sensors CCPD sensors
Hybrid detectors:
• Factorise r/o and sensor R&D
• Smallest feature-size ASICs
• Advanced sensor concepts
SOI CMOS sensors • Small pixels, highest performance à for inner layers
Monolithic CMOS sensors:
• Lowest material budget
• Medium feature-size
• Simplified construction
à for large-area tracker
Large Fill-Factor Small Fill-Factor • Recent developments target
CMOS sensors CMOS sensors
also inner layers
February 18, 2019 Pixel detector R&D for CLIC 7
Thin hybrid planar pixel detectors
Hybrid pixel detector
• Planar pixel sensors bump-bonded to r/o ASICs
• Considered for vertex detector
• Comprehensive thin-sensor studies with slim-edge
and active-edge sensors (50-500 μm thickness)
on Timepix/Timepix3 readout ASICs (55 μm pitch)
Timepix with 50 μm active-edge sensor
Timepix3 with 300 μm active-edge sensor
14 mm
50 μm sensor
700 μm Timepix
February 18, 2019 Pixel detector R&D for CLIC 8
Thin hybrid planar pixel detectors
Hybrid pixel detector
• Planar pixel sensors bump-bonded to r/o ASICs
• Considered for vertex detector
• Comprehensive thin-sensor studies with slim-edge
and active-edge sensors (50-500 μm thickness)
on Timepix/Timepix3 readout ASICs (55 μm pitch)
Efficiency vs. det. threshold Cluster sizes vs. thickness Track residuals vs. thickness
CLICdp
• ~100% efficiency down to 50 μm thickness (up to cut edge)
• Low fraction of 2-hit clusters limits achievable resolution CLICdp-Note-2016-001
à Not enough charge sharing in ultra-thin sensors DISS. ETH NO. 24216
February 18, 2019 Pixel detector R&D for CLIC 9
Fine-pitch hybrid detectors
• CLICpix/CLICpix2 r/o ASICs with in-pixel CLICpix with 50 μm planar sensor
time (10 ns binning) and energy (4-5 bit) measurement
• 25x25 μm2 pitch
• Implemented in 65 nm CMOS process
m m
• Single-chip bump-bonding with 50-200 μm thin sensors 1.6
à challenging; process optimization ongoing
Indium bumps on CLICpix ASIC and Micron sensor (SLAC)
CLICpix2+FBK active-edge sensor
Sr-90 hit map
7 unconnected channels
SnAg bumps on CLICpix2 (IZM) Advacam sensor on CLICpix2 (IZM) 2 shorts
February 18, 2019 Pixel detector R&D for CLIC 10CLICpix + planar sensor test-beam results
Cluster
Cluster
´103
size, 50 μm
size 50 µmsensor
sensor Residuals 50 μm sensor
150 CLICdp
Work in For 50 μm sensor thickness:
Progress
100 Mostly single-pixel cluster
mean=1.1 à No charge interpolation
50 à Resolution limited by
pixel pitch
0
1 2 3 4 5
Cluster size in y
Cluster size 200 μm sensor Residuals 200 μm sensor
For 200 μm sensor thickness:
CLICdp
C 14. 09. 2017 10 Mostly two-pixel cluster
à Charge interpolation
à Resolution close to
target value of 3 μm
à But too thick for material-
budget target 0.2%X0/layer
JINST 12 (2017) C06006
February 18, 2019 Pixel detector R&D for CLIC 11Enhanced Lateral Drift sensors
Hendrik Jans
η- function for 4 units cel
04.10.2017 | Anastasiia Velyka | Clic Vertex 2
• Position resolution in very thin sensors so far limited to > Number
04.10.2017
~pixel pitch / √12 (almost no charge sharing) ELADof collected
sensor layout charge for
Q1Imp Q2Imp
à Enhanced LAteral Drift sensors (ELAD) Patent DE102015116270B4
• Deep implantations to alter the electric field
à lateral spread of charges during drift, cluster size ~2
p n p
à improved resolution for same pitch
• Challenges:
p n p
• Complex production process, adds cost
• Have to avoid low-field regions (recombination) p n p
• TCAD and MC simulations: Implantation process,
Sensor performance for MIPs
à expect significantly improved position resolution vs. standard sensor x
MIP position
• First production in 2019: generic test structures, strips
and test sensors with Timepix footprint (55 μm pitch) Q1 Q2
à Talk by H. Jansen on Thursday in Semicond. session:
Bulk engineering for enhanced lateral drift sensors
TCAD charge density simulation Collected charge vs. MIP position Allpix2 MC simulation of residuals
>
MIP position x
17.11.2017 | Anastasiia Velyka | Clic Vertex
February 18, 2019 Pixel detector R&D for CLIC 122
5x25DmCapacitively
2pi
tch coupled HV-CMOS sensors
nt
s pe r for me d
• Active sensors in 180 nm High-Voltage (HV) CMOS process, Capacitively Coupled Pixel Detector
large fill factor: electronics in charge-collection well
,
C~8Dm• Amplification in sensor, capacitive coupling to r/o ASICs
SPà thin glue layer replaces costly small-pitch bump bonds
• High-resistivity substrates (up to 1kΩcm) to increase depletion
• Considered for vertex detector
of
ca p a c it iv e co u p l i n g
• Active sensors (CCPDv3, C3PD), 25x25 μm pitch 2
• Glue assemblies with CLICpix/CLICpix2
Cross section through C3PD/CLICpix2 glue assembly C3PD/CLICpix2 glue assembly
CL
ICpi
x2
25⇡m
on C3
PD
NIM A 823 (2016) 1-8;
JINST 12 P09012 (2017)
February 18, 2019 Pixel detector R&D for CLIC 13Capacitively coupled HV-CMOS sensors
• Active sensors in 180 nm High-Voltage (HV) CMOS process, Capacitively Coupled Pixel Detector
large fill factor: electronics in charge-collection well
• Amplification in sensor, capacitive coupling to r/o ASICs
à thin glue layer replaces costly small-pitch bump bonds
• High-resistivity substrates (up to 1kΩcm) to increase depletion
• Considered for vertex detector
• Active sensors (CCPDv3, C3PD), 25x25 μm2 pitch
• Glue assemblies with CLICpix/CLICpix2
• ~100% efficiency, σSP~6 μm, σt~7 ns
• Finite-element simulation of capacitive coupling
• Challenges: glue uniformity / alignment, calibration
CCPDv3/CLICpix efficiency CCPDv3/CLICpix residuals C3PD/CLICpix2 time residuals
σSP~6 μm
Threshold ~1200 e- Threshold
~1200 e-
February 18, 2019 Pixel detector R&D for CLIC 14Monolithic HV-CMOS sensors
• Active depleted HV-CMOS sensors with fully integrated readout
• Considered for CLIC tracker ATLASpix HV-CMOS sensor
180 nm HV-CMOS process
Common MuPix+ATLASpix reticle
• ATLASpix_Simple sensors in 180 nm HV-CMOS process:
• Designed for ATLAS ITK upgrade
• Targeting also CLIC tracker requirements
• 130 x 40 μm2 pitch
• 25 x 400 pixels
• Data-driven column-drain readout
• 12.5 ns time bins
• Beam tests in CLICdp Timepix3 telescope
(1 ns reference timing) 10.1016/j.nima.2018.06.060
February 18, 2019 Pixel detector R&D for CLIC 15ATLASpix_Simple test-beam results
Efficiency
• 99.7% efficiency
• Time resolution: ~7 ns (RMS)
• Spatial resolution: σSP~13 μm
(almost no charge sharing)
à worse than required 7 μm
à Plan for CLIC version with adapted
footprint: ~200 x 25 μm2 pitch
Timing residual
Residual in column direction Residual in row direction
RMS~7 ns
Reconstruction using: https://gitlab.cern.ch/corryvreckan/corryvreckan
February 18, 2019 Pixel detector R&D for CLIC 16Monolithic HR-CMOS sensors
• Integrated CMOS sensors on High-Resistivity (HR) substrate HR-CMOS process
• Small collection electrode separated from electronics
à small capacitance, high signal/noise
à More on this process in plenary talk on Friday by L. Musa:
CMOS Active Pixel Sensors for High Energy Physics
• Considered for CLIC tracker
• Tests with Investigator analog test chip (external r/o)
in 180 nm modified HR-CMOS imaging process
(ALICE development), various test matrices
• For 28x28 μm2:
99.3% efficiency (CLICTD monolithic HR-CMOS sensor
Pixel segmentation
• Promising results obtained with Investigator test chip lead to
design of fully integrated monolithic CLICTD sensor for CLIC tracker:
• New concept of pixel segmentation in small collection diodes,
to maintain fast charge collection while reducing digital logic: CLICTD layout
30 x 300 μm2 pixel size, 30 x 37.5 μm2 diode size
• TCAD geometry and process optimization
5 mm
• Process modification for faster charge collection
• Time (10 ns bins) and charge (5 bit) measurement per pixel
• Hit-pattern readout, power-pulsing features
• Chip submitted for production in 2 process variants (February 2019)
5 mm
CLICdp-Conf-2018-008
Continuous deep n layer
TCAD optimisation:
Effect of sensor implant
design on charge sharing
Continuous n layer Segmented in R/phi + z Segmented in z
Segmented deep n layer
e- density
after 3 ns
February 18, 2019 Pixel detector R&D for CLIC 18Monolithic SOI sensors
• Silicon-On-Insulator (SOI): r/o electronics on thin low-resistivity electronics wafer,
separated from high-resistivity sensor wafer by buried insulation oxide layer
SOI pixel detector
• Considered for vertex and tracker
• Cracow SOI test chip in 200 nm LAPIS SOI process,
mmary and outlook
with various geometries and technology parameters:
>=30x30 μm2 pitch, single SOI and double SOI, rolling shutter r/o
• Test 2 pitch
otypes ofresults
variousforintegrated
300, 500 μm thickness, 30x30
technologies μminvestigation
under for the CLIC tracker:
>99% efficiency, σSP~2-5 μm
rated HV-CMOS:
MuPix and ATLASpix integrated in CLICdp Timepix3 telescope
Proof of principle of fully integrated elongated pixel design in HV-CMOS process
Signal/Noise for 300 μm sensor Resolution for 300 μm sensor Cracow SOI test chip
HR-CMOS:
CLICdp
Test beamCLICdp
studies of various pixel layouts and substrates
Good performance of investigated Cracow design for 500 μm thick
prototypes
Further studies with thinner prototypes to evaluate performance w.r.t.
requirements for CLIC tracker
SOI test chip
rated HR-CMOS
NIMA 901 (2018) 173–179
Test beam and simulation studies of two different submissions
February 18, 2019 Pixel detector R&D for CLIC 19CLIPS monolithic SOI sensor
CLIPS layout
• CLIPS: New AGH SOI chip targeted to Linear Collider vertex detectors:
• 3 test matrices with 64x64 pixels, 20x20 μm2 pitch
• Targets spatial resolutionAllpix2 simulation framework
Spatial residuals in test beam
• Complex sensors (ELAD, HR/HV-CMOS) require detailed simulations
• TCAD: device modeling, self-consistent charge propagation, slow CLICdp
• Geant4: MC simulation of charge deposition and full detector setup,
stochastic effects (Landau fluct.), no detailed device modeling, fast
Allpix2 simulation framework for tracking detectors
• Simulates full chain from incident radiation to digitized hits 50 μm Timepix3 sensor
• Combination of tools: in CLICdp telescope
• Full Geant4 simulation of charge deposition
• Fast charge propagation using drift-diffusion model
• Import electric fields from TCAD
• Validated with test-beam data (planar, HV-CMOS, HR-CMOS sensors)
Cluster size in HR-CMOS sensor
MIP in underdepleted HV-CMOS pixel sensor
Beam telescope with tilted DUT
CLICdp
NIMA 901 (2018) 164 https://cern.ch/allpix-squared
February 18, 2019 Pixel detector R&D for CLIC 21Detector integration
Through-Silicon Via Power-pulsing mockup
Vertex-detector services
Outer barrel tracker support structure
Vertex thermal stave dummy
Assembly scenario
tracker discs
CFRP support prototypes
Air-flow cooling mockup and simulation
26 mm
Calculations, simulations, prototyping à confirm feasibility of detector-integration concepts
February 18, 2019 Pixel detector R&D for CLIC 22Conclusions
• Stringent requirements for CLIC vertex and tracking detectors
have inspired broad and integrated technology R&D program
• Various innovative sensor + readout technologies under study
• Resolution target for vertex layers remains challenging
• Monolithic pixel detectors under development for large-area tracker and vertex
• Advanced simulation and analysis tools for detector performance optimization
• Detector integration studies confirm feasibility of proposed detector concepts
Thanks to everyone who provided material for this talk!
February 18, 2019 Pixel detector R&D for CLIC 23Resources
Compact Linear Collider Portal
http://clic.cern/
CLIC input to the European Strategy for Particle Physics
Update 2018-2020
https://clic.cern/european-strategy
CLICdp publications on CERN Document Server
http://cds.cern.ch/collection/CLIC Detector and Physics Study
February 18, 2019 Pixel detector R&D for CLIC 24Additional Material February 18, 2019 Pixel detector R&D for CLIC 25
CLIC schedule
2013 – 2019 2020 – 2025 2026 – 2034
Development Phase Preparation Phase Construction Phase
Development of a project plan for a Finalisation of implementation Construction of the first CLIC
staged CLIC implementation in line parameters, preparation for accelerator stage compatible with
with LHC results; technical industrial procurement, pre-series implementation of further stages;
developments with industry, and system optimisation studies, construction of the experiment;
performance studies for accelerator technical proposal of the hardware commissioning
parts and systems, detector experiment, site authorisation
technology demonstrators
2020 2026 2035
Update of the European Ready for construction First collisions
Strategy for Particle Physics
7 years 27 years
380 GeV 1.5 TeV 3 TeV
Decision Decision
· Construction · Construction · Construction
making making
· Installation · Installation · Installation
Commissioning
Commissioning
Commissioning
Reconfiguration
Reconfiguration
380 GeV Physics 1.5 TeV Physics 3 TeV Physics
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34
February 18, 2019 Pixel detector R&D for CLIC 26Active-edge sensors
• Deep Reactive Ion Etching (DRIE) process (Advacam):
• Implantation on the sensor sidewalls:
extension of the backside electrode to the edge
• Efficiency extends to the physical edge
à allows for seamless tiling of sensors
Cluster signal at the edge of 50 μm sensor Edge efficiency 50 μm sensor
à Active-edge sensors fully efficient up to the cut edge
February 18, 2019 Pixel detector R&D for CLIC 27DAQ
• Lab and beam tests require flexible scalable DAQ
hardware and software CLICdp Timepix3 telescope in
SPS H6 beam line
Results:
• High-rate beam telescope with Timepix3 detector planes
(~1 MHz track rate, ≲2 μm resolution, ~1 ns time resolution)
• CaRIBOu universal readout system developed with ATLAS:
• System-on-Chip (SoC) architecture
• Peary DAQ software in Linux system inside FPGA core
• Integration of CLICpix2, C3PD, ATLASpix
CaRIBOu hardware architecture
CaRIBOu with CLICpix2 r/o ASIC
CLICpix2 in CaRIBOu framework
February 18, 2019 Pixel detector R&D for CLIC 28Powering
• Powering concept has major impact on material budget and heat load
• Small duty cycle of CLIC machine (Cooling
• Vertex detector and tracker require cooling systems with sufficient cooling
power and minimal impact on physics performance (material budget,
vibrations, constraints for detector layout)
• Simulations and prototype measurements for vertex air cooling concept
with spiral-shaped disc layers
à ~50 mW/cm2 feasible
• Water cooling concept for tracker 1:1 scale air cooling thermal test setup
(copied from ALICE ITS upgrade,
no dedicated CLIC studies)
à ~150 mW/cm2 feasible
60 cm
Mass Flow: 20.1 g/s
Average velocity:
Finite-element simulation
@ inlet: 11.0 m/s of air velocity
@ z=0: 5.2 m/s
@ outlet: 6.3 m/s
CLICdp-Note-2016-002
February 18, 2019 Pixel detector R&D for CLIC 30Mechanical integration
Material budget allows for only ~0.1%X0 from cables+supports in vertex region,Thin-sensors with Timepix(3) r/o
Micron/IZM assembly: 100 μm slim-edge
Planar sensor assemblies with 55 μm pitch sensor on 100 μm Timepix ASIC
• Goal: test feasibility of ultra-thin sensors
with minimized inactive regions
• Producers: Micron and Advacam/VTT
• Readout: Timepix / Timepix3
• 50-500 μm sensor,100-700 μm ASIC thickness
• slim-edge and active-edge layouts 14 mm
• Test-beam campaigns at DESY and CERN PS/SPS
• ultimate goal: 50 μm sensors on 50 μm ASICs
50 μm silicon wafer
Advacam active-edge sensor Advacam assembly w. 50 μm active-
edge sensor 14 mm
floating
guard ring
active
edge 100 μm
50 μm sensor
55 μm
700 μm Timepix
February 18, 2019 Pixel detector R&D for CLIC 32CLICpix2 r/o ASIC
• New CLICpix2 in same 65 nm process as CLICpix: CLICpix2
• Increased matrix size to 128 ⨉ 128 pixels
• Longer counters for charge (5-bit) and timing (8-bit)
measurements
• Improved noise isolation and removal of cross-talk
4 mm
issue observed in first CLICpix
• More sophisticated I/O with parallel column readout
and 8/10 bit encoding
• Integrated test pulse DACs and band gap
• Test results with chips from Multi-Project-Wafer-Run
• Same chip on RD53 wafer, received in Dec 2017
(change from 5+1 to 7+1 metal layers) CLICpix2 analog F/E specifications
Parameter Value
à access to full wafers for bump-bonding Power dissipation ≤ 12 µW
process development Area ≤ 12.5x25 µm 2
Input charge, Qin nominal 4 ke-, max. 40 ke-
Minimum threshold, Qth,min ≤ 600 e-
Equivalent input-referred noise, Qn,in ≤ 70 e-
ToT dynamic range ≥ 40 ke-
ToA accuracy ≤ 10 ns
Total ionizing dose (for 10 yr) 1 Mrad
Input charge types e-, h+
Testability in-pixel test pulse (i.e. Qtest) injection
February 18, 2019 Pixel detector R&D for CLIC 33C3PD+CLICpix2 time resolution
• Track time resolution of CLICdp Timepix3 telescopeINVESTIGATOR resolution and efficiency
Impact of charge sharing on spatial resolution and efficiency for standard
& modified process (pitch of 28 μm, bias voltage of -6 V):
X cluster size vs. threshold: X resolution vs. threshold: Efficiency vs. threshold:
X spatial resolution [µm]
Efficency
X cluster size
2 8 Resolution = RMS± 20 µm
Modified Telescope resolution not unfolded
1
1.8 Standard 7
6 0.95
1.6 CLICdp CLICdp CLICdp
preliminary 5 preliminary preliminary
1.4 0.9
Modified Modified
1.2 4
Standard 0.85 Standard
1 3
0 100 200 300 400 500 0 100 200 300 400 500 0 200 400 600
- - -
Threshold [e ] Threshold [e ] Threshold [e ]
• More charge sharing for • Better spatial resolution
• Earlier drop of
efficiency (at lower
standard process for standard process
thresholds) for standard
down to ~ 3.5 μm
• Expected from non depleted process
regions (diffusion)
Efficiency & spatial resolution for both process variants within
requirements for CLIC tracker.
February 18, 2019 Pixel detector R&D for CLIC 35INVESTIGATOR timing
Timing resolution for standard & modified process (pitch
of 28 μm, bias voltage of - 6 V):
Standard process: Modified process:
# [norm.]
# [norm.]
0.3 σ Gauss ~ 6 ns 0.25 σ Gauss ~ 5 ns
0.2
0.2
0.15
0.1
0.1
CLICdp CLICdp
Work in 0.05 Work in
progress progress
0 ×10-6 ×10-6
-0.1 -0.05 0 0.05 0.1 -0.1 -0.05 0 0.05 0.1
Hit time - track time [s] Hit time - track time [s]
Comparable timing resolution for both processes
(Readout sampling frequency of 65 MHz limits achievable precision)
February 18, 2019 Pixel detector R&D for CLIC 36CLICTD monolithic HR-CMOS tracker chip
Good performance of studied 180 nm HR-CMOS technology with respect to requirements of CLIC tracker
à Technology used for ongoing design of a fully integrated chip for the CLIC tracker
CLIC Tracker Detector (CLICTD) – monolithic HR-CMOS sensor with 30 μm x 300 μm pixels
Segmented macro-pixel structures to maintain advantages of small collection diode (prompt and fully efficient
charge collection) while reducing digital logic:
Discriminator output of
8 collection diodes
combined in logical OR
Output of logical OR passed to digital circuitry:
• Simultaneous 8-bit ToA and 5-bit ToT measurements
• Expect σSP~7 μm in short direction (charge sharing)
• Hit bit pattern à maintain good resolution also in long direction
• 100 MHz clock to achieve 10 ns time binning
February 18, 2019 Pixel detector R&D for CLIC 37You can also read
