Microelectronics. Trustworthy and sustainable. For Germany und Europe - The German Federal Government's Framework Programme for Research and ...
←
→
Page content transcription
If your browser does not render page correctly, please read the page content below
Microelectronics. Trustworthy and sustainable. For Germany und Europe. The German Federal Government’s Framework Programme for Research and Innovation 2021–2024
1 Contents Foreword 2 1 Introduction 4 2 Missions and objectives for research and innovation in microelectronics 8 3 Creating the technological conditions for a sustainable digital sovereignty 10 3.1 Electronic Design Automation (EDA)....................................................................................................................... 10 3.2 Specialised processors for edge computing, artificial intelligence, and high-performance applications....... 11 3.3 Innovative, intelligent, and connected sensor systems ....................................................................................... 13 3.4 High frequency electronics for communication and sensor technology.......................................................... 14 3.5 Intelligent and energy-efficient power electronics.............................................................................................. 15 3.6 Interdisciplinary technologies and topics............................................................................................................... 16 3.7 Selected systems for microelectronics production............................................................................................... 20 3.8 Advanced silicon and beyond.................................................................................................................................... 21 4 Microelectronics underpin cutting-edge applications 23 4.1 Artificial intelligence................................................................................................................................................... 23 4.2 High-performance computing.................................................................................................................................. 24 4.3 Communication technology ..................................................................................................................................... 24 4.4 Smart health.................................................................................................................................................................. 25 4.5 Autonomous driving.................................................................................................................................................... 27 4.6 Industry 4.0................................................................................................................................................................... 28 4.7 Smart energy conversion............................................................................................................................................ 29 5 Cooperations, instruments, structures 32 5.1 Strengthening networks ............................................................................................................................................ 32 5.2 Individualised instruments........................................................................................................................................ 34 5.3 Structures for research and innovation................................................................................................................... 35 5.4 A living programme through strategic foresight and evaluation........................................................................ 37 Imprint 41
2 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
Foreword
Self-driving vehicles, production machines,
medical technology, and telecommunications –
none of these are possible without innovative
electronic systems. We are keen to ensure that
these systems continue to come from Germa-
ny. To this end, our focus is on the strengths of
our research and development – the founda-
tion of our innovative potential. This is why in
the years 2021–2024 the Federal Government
will continue to place particular emphasis on
supporting research and innovation in micro-
electronics.
The issue at stake is the competitiveness of
Germany and Europe in the world. But it is also
a matter of trust. In future, anyone using a self-driving vehicle must be able to rely on
it getting them safely to their destination. And it is not only here that trust is an issue.
Today’s innovations are increasingly digital and based on electronic systems.
For electronics to be trustworthy, we need to understand it. We can only do this if we
have cutting-edge expertise in industry and the scientific community and develop
this continuously. The more we design, develop, manufacture advanced electronics
ourselves and ensure their safety and security, the better we will understand what
third-party electronics can and cannot do. This enables us to work on an equal footing
worldwide and to enforce requirements for electronic systems we use or operate.
Sustainability plays a part in this. We need digitalisation and hence electronics that
work in line with our climate goals instead of further increasing the consumption of
resources.
We are striving for Europe’s technological sovereignty and, at the same time, we are ea-
ger to engage in cooperation. Given the highly networked knowledge and value chains
in electronics, cooperation is both necessary and advantageous. In this context, we give
priority to collaborations in the European Single Market and the European Research
Area based on shared values. We thus support the development of European electron-
ics expertise in research and production so that Europe can continue to be strong as a
community in international competition.
We are committed to turning ideas into innovations that are successful worldwide and
benefit people. Whether as researchers, users or consumers: with this programme for
research and innovation in electronics, we are strengthening our technological sover-
eignty and, in turn, the prosperity of our country.
Anja Karliczek
Member of the German Bundestag
Federal Minister of Education and Research
4 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
1 Introduction
Digitalisation is on the march and electronics are eignty in digital technologies. Other world regions are
increasingly pervading our everyday lives and work- undertaking massive efforts: the USA, for example, is
place environments. Electronics are not only found in promoting the establishment of new chip factories,
mobile phones, tablets, and office computers, they also including through the use of state incentives. China is
regulate our power supply, control the data streams also investing public funds in its own microelectronics
for our mobile internet, and enable secure connected, capabilities in order to catch up with the world leaders
automated mobility. Electronic processors are also the and reduce dependencies. The same is true for Europe:
brain in which artificial intelligence (AI) takes place. In it can only keep up and create a level playing field by
sectors such as healthcare and industrial manufactur- having its own competencies.
ing, electronics ensure that services and products from
Germany meet the highest standards of functionality The growing importance of electronics poses major
and quality. This makes (micro)electronics an impor- challenges. Germany and Europe are involved in-
tant basis for prosperity in the age of digitalisation: by tensively in global value chains and partnerships in
providing services that improve the quality of life and the field of microelectronics and electronic systems
ensure sustainable value creation and jobs in Germany. (Figure 1). European companies are both suppliers and
purchasers of chips and electronic components, and
We need technological sovereignty so that we can as such are both exporters and importers. In order to
continue to do this in the future and be able to manage establish a leading position in these global value chains
digitalisation in keeping with our values and ideas. We and be able to manage digitalisation in keeping with
understand technological sovereignty to be a commit- our values, we need trustworthy electronics. We need
ment and ability to (co)design key technologies, i.e. to to know exactly what these electronics do, understand
define requirements for technologies, products, and how to manufacture them, and be able to check their
services according to our own values and to co-deter- functionality so that we know they are safe and reliable.
mine corresponding standards on the global markets. To achieve this, we need to understand and deploy all
Therefore, the aim of technological sovereignty is the key electronics technologies. And we must remain
explicitly not isolation, but international cooperation able to react flexibly to the challenges in global supply
on an equal footing. It is important to understand that chains by having our own economically viable micro
technological sovereignty in electronics is only possible electronics production in Germany and Europe.
as part of the European Single Market and Research
Area, not on a purely national level. The present The rapid spread of electronics is just as much an
programme has therefore been designed in synergy opportunity as it is a challenge. For one thing, smart
with the European Research Framework Programme digitalised solutions could frequently save resources.
Horizon Europe, which likewise focuses on sover- However, the electronics sector itself is consuming
Introduction 5
increasingly more resources. Information and com-
Industry and service providers
munication technologies (ICT) accounted for 3.7 % of (incl. ICT, transport, automotive, medical
global greenhouse gas emissions in 2019, while energy technology, aerospace)
consumption by ICT increased by 9 % per year between €48,556 bn2
2015 and 2020, which would be equivalent to doubling
every eight years if continued.1 To reduce CO2 emis-
Electronics industry
sions in the current electricity mix, we therefore need × 11 €4,427 bn3
electronics that significantly reduce the energy con-
sumption of microprocessors and of information and
× 121
communication technologies in general. In addition to Semiconductors
× 11
improving the energy efficiency of individual com- €397 bn4
ponents, we must achieve significant energy savings
for distributed and networked ICT systems in order to
meet the agreed climate change goals. This is especially
true for AI systems. They can be much more efficient
with customised, novel AI chips than with AI software Figure 1 Electronics is the key technology in a digitalised society such as Ger-
many. Semiconductors form the basis for value chains with high multipliers.
running on conventional processors. We must also
List of sources: see footnotes234
achieve a high level of resource efficiency by reducing
the use of critical raw materials and implementing
efficient recycling processes. This sustainability-based The two aspects “Trustworthy electronics” and “Sus-
approach to developing ICT solutions, which focuses tainable, climate-friendly electronics” are the pillars
on resource and energy efficiency, not only protects of the Federal Government’s present Framework
the climate but also supports the economy: being an Programme for Research and Innovation “Microelec-
innovation leader in electronics for energy-saving tronics. Trustworthy and sustainable. For Germany and
ICT systems will give companies from Germany a Europe”, running from 2021 until 2024. The primary
competitive edge. At the same time, research and its objective is to strengthen the technological sovereignty
funding will create the conditions for industry to meet of Germany and Europe. National research funding
the requirements of future regulatory steps – another will continue to be coordinated with European trans-
competitive advantage. national funding, because the innovation and value
chains are, and will remain, transnational. The aim is
The electronics sector continues to have a high level of also to further strengthen industry’s willingness to
innovative dynamism and short product life cycles. As invest in microelectronics production in Germany, in
a result, it remains research-intensive: semiconductor particular by funding joint projects between the sci-
manufacturers typically invest around 15 % of their entific community and industry along the value chain
turnover in research and development activities. And from component manufacturer to system provider.
entirely new technologies need new approaches from
fundamental research. This is why electronics funding Pilot production lines, which ensure the rapid transfer
focuses on supporting research and innovation. In of research results into production, play a key role in
addition, high capital costs are the rule in electron- this. The success of this approach is demonstrated by
ics manufacturing. For the transfer from research to the pilot line projects of the European co-financed ini-
production in Germany and Europe, it is therefore tiative ECSEL (Electronic Components and Systems for
essential that research and business development are European Leadership), with a follow-up initiative “Key
well aligned. Digital Technologies” (KDT) beginning in 2021 with-
1 theshiftproject.org/wp-content/uploads/2019/03/Lean-ICT-Report_The-Shift-Project_2019.pdf
2 decision.eu/wp-content/uploads/2020/02/ECS-study-presentation-of-Key-findings.pdf
3 zvei.org/fileadmin/user_upload/Presse_und_Medien/Publikationen/Regelmaessige_Publikationen/Daten_Zahlen_und_Fakten/Die_globale_Elektroindustrie_
Daten_Zahlen_Fakten/Faktenblatt-International-August-2020_NEU.pdf
4 wsts.org/esraCMS/extension/media/f/WST/4298/WSTS_nr-2019_11.pdf – Average dollar exchange rate in 2018 ca €1.00 = $1.18 (de.statista.com)
6 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
in the EU Framework Programme for Research and
Innovation Horizon Europe. In addition, the Impor-
tant Project of Common European Interest (IPCEI) on
Microelectronics (launched in 2017) was able to provide
significantly improved support for the implementation
of microelectronic innovations in production. As a
result, companies have invested in new production ca-
pacities for new microelectronic products. For the first
time in this millennium, a completely new microelec-
tronics factory is being built in Germany. At the other
edge of the innovation network, research institutions
and universities ensure that new ideas keep flowing.
For many issues outlined, such as the development of
AI chips, the greatest potential lies in finding complete-
ly new approaches. Particular attention will therefore
be paid to accelerating innovation in order to translate
creative ideas and novel approaches into concrete
technologies and applications faster. This will be
achieved by providing targeted support for cooperation Ministry for Economic Affairs and Energy, BMWi).
and structures that bring together basic researchers The Research Fab Microelectronics Germany pools the
with potential users at an early stage. Small and me- technological capabilities of 13 leading institutes for
dium-sized enterprises (SMEs) and start-ups can also applied electronics research in a joint technology pool
quickly turn new ideas into new products, which is why with a central contact point for partners and customers
support is targeted particularly at them: regarding the from the scientific community and industry, and the
electronics funding provided by the Federal Ministry Research Laboratories strengthen universities in their
of Education and Research (BMBF), SMEs account for pivotal role in the microelectronics innovation system.
around 35 % of commercial funding, while the SME The positive results of microelectronics funding to
share of R&D expenditure in industry as a whole is well date and the geopolitical situation with regard to this
below 20 %.5 key technology also form the basis for the Federal
Government’s considerations to initiate an IPCEI on
The present programme builds on the Framework microelectronics and communication technologies at
Programme for Research and Innovation 2016–2020 European level.
“Microelectronics from Germany – Driver of innova-
tion for the digital economy”, the first programme of The priorities for the focus of the current programme
the Federal Government dedicated to electronics re- were identified in the exchange between the Federal
search. To accelerate innovation, the BMBF is pursuing Government and the research community. In dialogue
new approaches in implementation, for example with with industry and the scientific community, the lead
the funding line “Research for new microelectronics initiative “Trustworthy Electronics” was devised, which
(ForMikro)” and the pilot innovation competition is also part of the BMBF’s digital strategy. In addition,
“Energy-efficient AI system”. The previous programme a series of expert meetings identified priority aspects
also launched the investment projects Research Fab of energy efficiency and sustainability. These insights,
Microelectronics Germany, Research Laboratories together with the results of an environment analysis
Microelectronics Germany (funded by the BMBF) and and a review of the previous framework programme,
the IPCEI on Microelectronics (funded by the Federal form the basis of the current programme. The main
5 Die Rolle von KMU für Forschung und Innovation in Deutschland (The Role of SMEs in Research and Innovation in Germany – only in German), a study commis-
sioned by the Commission of Experts for Research and Innovation Studies on the German innovation system No. 10/2016, e-fi.de/fileadmin/Innovationsstudi-
en_2016/StuDIS_10_2016.pdf
Introduction 7 areas of focus are described in the chapters on “tech- nologies” and “fields of application”. Over the next four years, this content will be continuously reviewed and developed in exchange with the research community. In 2023, a decision will be taken on whether to extend the programme for two years or to relaunch it with a new focus. The programme contributes to implementing the High-Tech Strategy 2025, in particular through the contributions of electronics to the missions “Safe, networked and clean mobility”, “Putting artificial intel- ligence into practical application” and “Achieving sub- stantial greenhouse gas neutrality in industry”, the AI strategy, the implementation strategy “Shaping Digital- ization”, and the Federal Government’s Climate Action Programme 2030. The “Sustainable, climate-friendly electronics” aspect includes the initiative “Green ICT – Grüne IKT” of the BMBF action plan “Natural. Digital. Sustainable.” The programme interacts with numerous other current or planned research programmes of the Federal Government and its ministries, in particular regarding communication technologies, IT security, Industry 4.0, medical technology, photonics, and auto- mated and connected driving. This is because digital- isation, and with it microelectronics, is penetrating more and more areas, and because there is an increas- ing merging of technological worlds that were once separate (e. g. hardware and software or electronics and photonics).
8 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
2 Missions and objectives for research and
innovation in microelectronics
The present programme is geared towards: phases of life. Powerful, trustworthy, and sustainable
electronics, which open up new solutions for smart
∙∙ Technological sovereignty of Germany as a part of assistants, the Internet of Things, AI applications or
the European Research Area and the European Single modern, climate-friendly data centres.
Market, without any unilateral dependencies on
other world regions. To accomplish this, the Federal Government is taking
the following steps:
∙∙ Electronics from Germany and Europe attaining a
new quality and being verifiably trustworthy, thereby ∙∙ We support the development and implementation of
becoming the first choice for safety-critical appli- new basic technologies in Germany and Europe.
cations such as autonomous driving, smart medical
technology or the self-controlling factory of Indus- ∙∙ We continue to strengthen cooperation and net-
try 4.0. Players in Germany and Europe being able to working between the scientific community and
understand the trustworthiness of electronics from industry for the transfer of know-how and research
all regions of the world by virtue of their own knowl- findings; also in order to incorporate the latest find-
edge. This will also help to reduce trade conflicts. ings into regulation and standardisation. After all, in
digitalisation, product innovations rely not only on
∙∙ Electronics from Germany and Europe making a sig- software, but increasingly and in many sectors on
nificant contribution to climate protection: through electronics hardware.
electronics that consume less energy themselves –
for example in energy-efficient AI processors. Or ∙∙ We promote the transfer from fundamental to
through electronics that intelligently control other applied research as a catalyst for leap innovations in
devices and thus curb their appetite for electricity – Germany and Europe. The direct research funding of
as is the case when using motion sensors instead of this programme complements closely and collabora-
light switches. This provides an important contribu- tively the funding of the Federal Agency for Disrup-
tion to achieving the German Government’s climate tive Innovation SPRIND.
change goals.
∙∙ We also promote promising new developments in
∙∙ Electronics providing technical solutions to other the area of cyber security. To this end, the Federal
societal challenges, such as the looming demographic Agency for Innovation in Cyber Security (GmbH)
labour shortage or maintaining good health in all commissions and finances risk-taking, ambitiousMissions and objectives for research and innovation in microelectronics 9
research and innovation projects and coordinates the from academia to industry. We are pressing ahead
entire research process from the idea to the proto- with developing capacity and competencies in the
type in order to quickly achieve results that meet the field of microelectronics research. Indicators for this
Federal Government’s needs. are not only the number of PhDs, publications, pa
tents, and products, but also, for example, measures
∙∙ We support young researchers, start-ups, and small for covering value chains, the breadth of technolo
and medium-sized enterprises (SMEs) for an agile gical competencies, the number of new institutional
innovation system. contacts within and between associations or the
number of new collaborations.
∙∙ We promote an effective dialogue between the
relevant stakeholders in order to identify and address ∙∙ In addition, for technological sovereignty: we
new research and innovation issues in timely fashion. are strengthening semiconductor production in
Germany and Europe. We are establishing a com-
∙∙ We link up our research policy at the national and plete innovation ecosystem for accelerated, plat-
European levels, because both the scientific com- form-based design of specialised processors based
munity and industry have a transnational outlook; on the RISC-V architecture for a wide range of
closed, value chains exist within Europe or even applications. Indicators for this are, for example, the
beyond, but rarely within the borders of one nation. development over time of sectoral key figures on
National measures are therefore strategically aligned innovation and production as well as the degree of
with European initiatives such as the Digital Single coverage of value chains or the completeness of the
Market, the European Green Deal and, in particu- innovation ecosystem supplied by German and Euro-
lar, the Research Framework Programme Horizon pean stakeholders.
Europe as well as the investment programme Digital
Europe. ∙∙ Moreover, for sustainable, climate-friendly electron-
ics: we provide exemplary solutions demonstrating
If we want to continue shaping the digital transforma- Germany’s commitment to a pioneering role in
tion ourselves in future, we must strengthen Germany’s the development of sustainable technologies. This
position as a location for the electronics industry. This includes the further development of methods and
means not only continuing to improve our strengths, models to quantify the resulting energy and CO2
but also significantly promoting other important tech- savings. Indicators are, for example, the number of
nology areas and thus acquiring and developing new corresponding product innovations and the concrete
competencies. This programme will make a substantial savings potential.
contribution towards this. The BMBF alone is providing
around 400 million euros for research and develop- In order to be able to respond to the respective state
ment projects over the four-year programme period. of the art and research in each of the technology and
The BMWi is considering providing further substantial application fields described below, specific operational
funding for the above-mentioned IPCEI on microelec- objectives will be identified for each funding measure
tronics and communication technologies. in accordance with the respective status quo ante and
research needs.
The BMBF’s microelectronics research funding is based
on the following operational objectives:
∙∙ At the level of the entire programme: we are
strengthening value chains as innovation incubators.
We ensure the networking of research and inno-
vation stakeholders in Germany, especially small
and medium-sized enterprises, and the transfer
from knowledge-oriented to application-oriented
research, which also takes place when people move10 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
3 Creating the technological conditions for a
sustainable digital sovereignty
Microelectronics is a prime example of advanced links in the value chain. Consequently, EDA as an inter-
technology. Mastering the basic technologies outlined disciplinary competence constitutes a key element for
below, being able to advance them or even create new Germany’s and Europe’s technological sovereignty.
ones is a prerequisite for deploying electronics in a
self-determined and beneficial manner. To facilitate the use of new technologies and to be able
to meet the requirements of new applications, it is nec-
essary to continuously develop and advance EDA tools.
3.1 Electronic Design Automation Future design technologies will help to speed up inno-
(EDA) vation processes, reduce the time and effort required,
and shorten the time-to-market. Despite increasing
Every microelectronic system starts with its design. complexity, many parameters can be optimised by
simulations carried out during the design stage. This
To get from the initial idea to the finished product, eliminates the need for the conventional lengthy test
every electronic circuit or system first has to pass and evaluation process that involves the building and
through a complex design process that considers all in- subsequent testing of several hardware prototypes.
ternal interactions. The design process is automated as
much as possible (EDA, electronic design automation) Current developments are characterised by an increas-
in order to manage this complexity. This process plays ing complexity that requires automating designs not
a key role when it comes to the performance, reliability, only for every single chip but also at the system level:
and trustworthiness of any future system. Development the number of circuits increases, systems become more
times and efforts are significantly reduced by detecting heterogeneous, and different technologies are com-
errors as early as the design stage and by performing bined. The higher integration density and the accom-
virtual optimisations instead of real hardware tests. panying physical interactions lead to new effects that
must be mapped out in models – in particular in terms
Many companies use the EDA tools of major suppliers of electromagnetic compatibility (EMC). In addition, in-
when designing their microelectronic components. novative applications focus more and more on energy
However, these are often not tailored to the needs efficiency, reliability, and functional safety, resulting in
of Germany’s multifaceted user industry regarding ever more complex modelling.
analogue electronics, for example. What is needed is
the in-house design competence that not only enables
innovation, but also the competent management of allCreating the technological conditions for a sustainable digital sovereignty 11
Future fields of action include, for example: in terms of speed and energy efficiency. Compre-
hensive models through to virtual prototypes enable
∙∙ Development platforms and ecosystems: electronic simultaneous development of hardware and software
systems for specific applications have to be optimised across value chains. An adapted hardware architec-
to the usage – be it in terms of energy efficiency, costs ture can result in considerable increases in efficiency,
or specific operating properties. However, low-vol- particularly in the case of highly specialised systems
ume developments are time-consuming and there- (e. g. neural networks and neuromorphic architec-
fore often not profitable. Especially small companies tures).
also often lack the expertise required. Although, new
approaches and technological developments (e. g. ∙∙ AI for EDA: artificial intelligence can help to master
based on RISC-V) are currently being pursued, the the complexity of the design, optimise test proce-
tool support is still insufficient. Versatile develop- dures, and thus accelerate the entire design process.
ment platforms are needed that enable the efficient Faster designs drive innovations and are critical for
creation of custom hardware by means of modular economic success.
IP (intellectual property – here in relation to chip de-
sign) and adapted tools. This demands the availability ∙∙ Design for test: in complex, highly integrated chips
of scalable and modular-based hardware IP, software and systems, many parameters are no longer ac-
and development tools (design, verification, model- cessible from the outside. This must be taken into
ling, compiler, debugger). In this context, open source consideration to a greater extent to ensure adequate
approaches such as RISC-V are particularly interest- testability during the design process.
ing for the German and European semiconductor
industry and research community. ∙∙ Analogue design: highly integrated chips or systems
often contain a high percentage of analogue elec-
∙∙ Hardware/software co-design: specific functionali- tronics such as interfaces to sensor systems, commu-
ties can be implemented through both hardware and nication units, and power supply. When designing
software. Exploring the most efficient distribution a microchip, up to 90 per cent of the time is spent
and interconnection is of fundamental importance on the analogue section, although it normally only
here in order to be able to optimise development contains 10 per cent of the components. Numerous
costs, maintainability, updatability and performance physical effects and interactions occur during the de-
sign of analogue circuits, making it extremely intri-
cate and requiring comprehensive expert knowledge
and experience. Consequently, the objective should
RISC-V
i be to formalise knowledge and design automation by
means of suitable tools.
RISC-V is an open instruction set architecture, i.e. an
abstract description of the implementation of a data 3.2 Specialised processors for edge
processor in terms of executable machine instruc- computing, artificial intelligence,
tions that provide the basis for the quick develop- and high-performance applica-
ment of new processors. “Open” means: the archi-
tions
tecture is not patented or protected by copyright,
but is available under an open source licence and can
be used freely. This enables small and medium-sized High-performance specialised processors drive innova-
enterprises in particular to design, manufacture and tions.
market bespoke and high-performance microproces-
sors without high licensing costs. It gives Germany High-performance universal processors for servers,
and Europe the opportunity to develop their own PCs, and smartphones are currently neither designed
processors and make them available to industry. nor built in Germany; by contrast, specialised proces-
sors are one of the strengths of the German electronics12 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
industry. They play a major role when it comes to inno- to AI processors. These modular systems are created
vation. Thanks to properties such as energy efficiency, using ecosystems that offer the relevant hardware
real-time capability, robustness, and reliability, they and software. They provide a trustworthy basis for
are better equipped to meet the distinct requirements SMEs and start-ups to quickly implement their own
of applications that are particularly relevant for the developments. Freely available architectures like
German industry. They also enable a higher degree of RISC-V are a good starting point for German industry
application-specific performance and security and thus to efficiently tap into new areas of use and fields of
make a decisive contribution to meeting cyber security applications.
requirements.
∙∙ Processors with optical and electro-optical compo-
However, new fields of application and rising perfor- nents: the combination of electronic and photonic
mance requirements in established applications are in- components offers great potential for energy effi-
creasingly pushing solutions for specialised processors ciency and speed in suitable applications, for example
available in Germany to their limits. This is the case, in optical data processing.
for example, in edge computing, the shift of compu-
tation-intensive applications from the cloud closer to ∙∙ Further trends: in the context of new specialised
the end devices. Artificial intelligence applications also processors, emerging architectures and storage
place particularly high demands on processor perfor- technologies, such as non-volatile embedded mem-
mance since the processed data volumes and opera- ories, memristors for neuromorphic chips or what is
tions are much larger. known as approximate computing are cutting-edge
approaches to saving energy. Analogue computing
For future specialised processors electronics and algo- also holds a promising potential for certain applica-
rithms will be coordinated to enable applications to be tions. Much needs to be done, however, regarding the
accelerated significantly. Furthermore, the combina- transfer of the fundamental research (cf. Chapter 3.8).
tion between sensor systems, artificial intelligence and
electronics will substantially increase energy efficien-
cy. This will open up the opportunity for Germany
to make the leap into new performance classes and
fields of application – with processors made in Europe
providing a trustworthy basis for digitalisation. To this
end, the European Processor Initiative (EPI)6 can make
knowledge available to the industry, e. g. for automated
and connected driving applications. Edge Computing
i
Currently, there are many new technological develop Edge computing or edge cloud solutions refers to
ments that open up possibilities for Germany and electronic systems that collect and pre-process data
Europe. Fields of action include: at the edge of the network, e.g. at the end device and
not in a cloud environment. Since it is not neces-
∙∙ Ecosystems based on a modular approach: spe- sary to transmit large volumes of raw data sets to
cialised processors are required for a wide range of the cloud, data streams can be processed in a more
applications, but usually only in small quantities. resource-efficient manner. Further processing steps
Developing new processors for every application is then take place in the cloud. This market could grow
not economically viable. Flexible and modular com- so fast that edge AI chips generate higher turnover
ponents are needed that can be integrated easily into than AI processors for cloud computing as early as
one system. Scalable modular systems like these fos- 2025.
ter solutions from energy-efficient microcontrollers
6 european-processor-initiative.euCreating the technological conditions for a sustainable digital sovereignty 13
3.3 Innovative, intelligent, and and climate protection. They enable resource-efficient
connected sensor systems process control regarding energy, water and raw mate-
rial consumption, and ensure efficient control of flows
Sensors are the sensory organs of machines, equipment, such as materials, energy, mobility, logistics or infra-
and intelligent systems. structure. Sensor systems can monitor water quality,
measure the CO2 level near CO2 sequestration sites, and
Trust is good, sensor technology is better: trustworthy detect pollutants as well as defects that cause environ-
electronic systems require sensors that supply trust- mental hazards.
worthy data.
Sensors are already widely used, and their importance Modern mid-range cars are fitted with around 100
is set to increase as digitalisation and connectivity sensors. They record physical quantities such as tem-
advance. MEMS sensors, microelectromechanical peratures, speed, angles, pressure etc., and convert
systems, not only share the same base material, namely these non-electrical quantities into electrical signals.
silicon, and the associated processing techniques with They serve as sensory organs of the electronic control
electronics, but are also growing increasingly closer units.7
together with the corresponding electronic systems.
As a result, sensors are less and less “extra devices”, but
increasingly part of the electronics. In almost every in- Regardless of the application, sensors must always
dustry, the functional safety and efficient operation of meet the highest standards in terms of reliability and
complex and intelligent systems is based on the collec- effectively resist interference. High detection quality
tion, processing, and transmission of measured values. with low noise levels is desirable for analysis, especially
Be it in automated and connected driving, industrial with AI methods.
production or robotics, they constitute the interface to
the real world and ensure safe and secure cooperation In view of the demand for specialised solutions and
between human and machine. given its wide field of application, sensor technology is
attractive for SMEs. As with special processors, modular
Sensors are also used when it comes to monitoring and systems and development platforms can act as drivers
controlling of processes with regard to sustainability for innovation.
Fields of action result, for example, from new sensor
principles and system approaches:
∙∙ New sensor principles: sensor systems that are
based on new measuring principles such as quan-
tum effects, or build on new materials or integration
technologies can tap into new applications. Improv-
ing the intelligence and decentralisation of sensor
systems by means of AI methods is another impor-
tant field of research that opens up new possibilities
(cf. Chapter 3.2)
∙∙ Organic electronics: while sensors based on organic
electronics hold great potential, they still have to
master huge technological challenges.
7 Sensoren im Auto (Sensors in cars – only in German) springerprofessional.de/bordnetze/energiemanagement-im-elektrofahrzeug/das-moderne-automo-
bil-fordert-die-sensorbranche/1615297614 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
∙∙ Lab-on-a-chip: lab-on-a-chip solutions are of great 3.4 High frequency electronics for
importance for point-of-care-diagnostics in med- communication and sensor tech-
icine, environmental monitoring, and in the food
industry since they can significantly reduce the time-
nology
to-result compared to traditional lab analyses. High frequency electronics is at the heart of modern
communication technologies.
∙∙ Chemical sensors and biosensors: in numerous
industries (chemical, semiconductor, food), medi- High frequency electronics is a cornerstone of digi-
cine, and environmental analysis, chemical sensors talisation and used, for example, for building 5G/6G
help to improve process control and reliability. To infrastructure, for vehicle distance radars or service
date, chemical sensors and biosensors are only found robots. As a safety-critical component, high frequency
in special applications. Supported by research and electronics must meet the highest standards in terms of
development, the aim is to develop low-cost-high- reliability. This is also true when using high frequency
volume applications and new application areas, e. g. electronics in sensor systems – the eyes and ears of
for the pharmaceutical industry and medicine (cf. the connected world. As a centre of innovation and in
Chapter 4.4). order to ensure its technological sovereignty, Germany
has great interest in securing the availability of high
Further trends can be determined from areas of use frequency electronics by further developing this tech-
such as: nology itself.
∙∙ Intelligent sensor systems: energy-efficient, local Developments tend towards ever-higher frequencies.
data processing and evaluation as well as sensor data In sensor technology, they help improve resolution.
fusion are key elements of intelligent sensor systems In communication technology, high frequency elec-
for Industry 4.0 and other industries (cf. Chapter 3.2). tronics enable the simultaneous transmission of large
data volumes, but also limit the range at the same time.
∙∙ Self-diagnosis and self-calibration: sensors must Consequently, more transmitting stations are required.
always meet the specific requirements of individual In order to avoid higher power consumption, the
applications. Self-diagnosis and self-calibration in- transmitting stations must become significantly more
crease trustworthiness without any additional effort. efficient. This can be achieved by improving the energy
efficiency of high frequency technology, but also by
∙∙ Energy-autonomous sensors and system solutions combining electronic and optical data transmission
enable new applications and contribute to cost effi- across long distances.
ciency.
In general, the transition towards ever-higher frequen-
cies calls for continuous research in high frequency
technology and also in faster electronics. There is also
scope for research on optoelectronic interfaces (silicon
Energy-autonomous sensors
i photonics); being able to manufacture highly integrated
circuits with a feature size of less than 10 nm is relevant
in this context since no European company currently
masters this skill.
By converting thermal, mechanical or optical energy
into electricity, it is possible to “harvest” energy
Fields of action in high frequency electronics include:
available from the immediate environment and use it
to operate the electronic system and the integrated
∙∙ Radar systems: highly integrated and high-frequen-
sensor technology as well as any communication
cy radar systems can significantly improve system
unit. In this way, previously inaccessible locations
properties and cost efficiency. One of the major
can be fitted with sensors without using cables or
challenges will be the system integration of future
high-maintenance batteries.
radar systems.Creating the technological conditions for a sustainable digital sovereignty 15
EMC
i increase substantially with digitalisation on the rise and
Germany’s transition towards renewable energy, also
known as the Energiewende, and more and more appli-
Electromagnetic compatibility (EMC) in terms of cations and devices being powered by electricity.
high-frequency electronics refers to the ability to de-
sign a technical device or single circuit so that other Germany plays a pivotal role in power electronics.
circuits in the same device and other devices are not However, as markets for power electronics expand and
affected by unwanted electrical or electromagnetic grow, they also attract new international players, and it
effects. Unwanted interference between electronic is expected that cost pressure will increase due to high-
systems is not only a technological and legal issue, er unit volumes. For Germany to maintain its compet-
but also a question of safety and security. itiveness in power electronics, it is primarily the costs
above all that have to be lowered. At the same time, the
requirements regarding weight, size, reliability, and
∙∙ Antennas: higher integration densities and frequen- efficiency are more likely to increase than diminish in
cies require new and complex antenna designs and future.
concepts including the relevant antenna control as
well as hardware implementation of new modulation In addition, modern power electronics are expected
methods. to become smarter and be able to control industrial
electric drives on an as-needed basis instead of run-
∙∙ EMC (electromagnetic compatibility): the trend to- ning them unnecessarily at full load. This helps to save
wards higher frequencies exacerbates the challenges energy in more and more applications and constitutes a
in EMC and calls for research in this field. vital step towards improved climate protection.
∙∙ Combination of high frequency electronics and op-
tics for communication: early and energy-efficient As more and more applications are electrically power
conversion between electronic and optical (photon- ed, demand for electricity could potentially double by
ics) signals is a major field of research and a corner- the year 2050. 8
stone of sustainability. Design tools are also needed
to facilitate the integration of optoelectronics.
Advancing power electronics opens up the following
∙∙ New substrates and materials for high-frequency fields of action:
electronics are needed to exploit the theoretical po-
tential of higher frequencies in practice. ∙∙ Cost reduction: new concepts for packaging tech-
nology and for system integration are promising
research and development approaches that are
3.5 Intelligent and energy-efficient geared at higher unit volume production. Platforms
power electronics and material efficiency are also gaining importance
in power electronics since they help leverage scaling
Power electronics is and remains a key interdisciplinary effects and reduce costs. This, in turn, enables a wider
technology of electronics. use of the systems.
To ensure electrical energy is available where it is need- ∙∙ Efficiency: wide-bandgap semiconductors also hold
ed, it has to be distributed, converted and controlled. great potential. They can be operated at high switch-
This is where power electronics comes into play. It ing frequencies and thus achieve higher efficiency
will continue to grow in importance since the share of levels. In addition to the already well researched
electrical energy in primary energy consumption will materials silicon carbide and gallium nitride, new
8 www.acatech.de/publikation/sektorkopplung-optionen-fuer-die-naechste-phase-der-energiewende16 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
semiconductor materials such as aluminium nitride 3.6 Interdisciplinary technologies
and gallium oxide are attributed high efficiency po- and topics
tential in power electronics.
Due to the interdisciplinary character of some aspects,
∙∙ Sustainability: the more durable and robust the de- they are of fundamental importance for several fields
sign of power electronics, the greater its sustainabil- of technology. In research funding, they are usually
ity. By avoiding critical raw materials and employing considered together with the respective application, but
the circular economy concept, it is also possible to deserve to be treated separately.
generate significant sustainability effects.
3.6.1 System integration technologies
∙∙ Intelligent power electronics systems: research Innovative integration makes systems more efficient,
topics for smart power electronics include new reliable, and cost-effective.
topologies for systems with higher efficiencies also
when operated at zero load or partial load, integrat- An important trend in electronics is the integration
ed sensors for self-monitoring, active control and of an increasing number of functions and compo-
integrated communication technology for linking up nents into one system: instead of combining them on
with other system levels or systems. a circuit board, they are incorporated into a compact
module, into a package or directly into a single chip.
∙∙ Ultra-low power electronics: more and more IoT mi- The reasons for this are manifold: due to restrictions on
cro devices use ultra-low power electronics. In terms size or weight, the application may require space-sav-
of unit volumes alone, they therefore play an increas- ing system integration. In addition, system integration
ingly important role in energy efficiency. Zero power can improve reliability, because every subsequent
standby solutions and improving efficiency towards assembly step presents a potential source of error. This
energy self-sufficiency are two fields of research. technology trend is referred to as More-than-Moore
to differentiate it from Moore’s Law (cf. Chapter 3.8),
∙∙ Electromagnetic compatibility and system integra- which is an empirical observation on the increase in
tion technologies: in power electronics, electromag- integration density. The integration of optical and
netic compatibility in relation to the system design mechanical functions into electronic systems is one
must be considered at all levels. With increasing of the key strengths of the German and European
system complexity, integration density, and switch- semiconductor industry: terms such as microsystems
ing frequency, the challenges continue to increase technology, microelectromechanical systems (MEMS),
here, too. and micro-opto-electro-mechanical systems (MOEMS)
are commonly used in this context. Current examples
include multidimensional accelerometer sensors, Li-
i
DAR for autonomous driving and micro-spectrometer
– all as on-chip systems.
Wide-bandgap semiconductors
Higher volumes in combination with a suitable system
Wide-bandgap semiconductors (WBG) are semicon- integration design can help to reduce production costs.
ductors that are more efficient than their silicon-based This could even reach a stage where the integrated
counterparts due to their wider bandgap. They are electronic system is manufactured directly on the
used in applications with special requirements such wafer – from the single function or component to its
as low-noise or high-frequency amplifiers. In addition connection and packaging. Smartphones are a typical
to low switching losses, WBG semiconductor-based example of an extremely high integration density and
devices can be operated at higher voltages, tempera- complexity (albeit manufactured outside Europe). Their
tures, and frequencies, and offer more reliability. The high production volumes economically justify the tech-
wider bandgap enables their use in optical emitters in nological development costs and efforts involved. To
the short-wavelength range (visible light), e.g. in blue enable packing more functions into the device without
or ultraviolet light emitting diodes (LEDs). increasing its size, the electronics must reach higherCreating the technological conditions for a sustainable digital sovereignty 17
alternatives to wire bonds and solder contacts. Thin
packages that use no separate circuit board (“sub-
strate-less”) offer low thermal resistance and good
high-frequency properties due to short and planar
electrical connections. Fan-out-wafer-level-pack-
aging (FOWLP) has a high miniaturisation poten-
tial both in terms of package volume and package
thickness. Fan-out-panel-level-packaging (FOPLP)
is another promising approach. Additional topics
requiring research include, thermal and stress man-
agement, robustness, and recyclability.
∙∙ Manufacturing processes: focus areas include assem-
bly and packaging automation (back-end-of-line),
integration of additive manufacturing processes
and higher levels of integration. This can be achieved such as 3D printing of components and conductors,
with a wide range of technologies (see below). stereolithography for 3D packaging and embedding,
the development of customised manufacturing
Numerous challenges arise from the increasing com- equipment and suitable measuring and testing tech-
plexity of system integration and this places enor- nologies as well as the use of resource-saving process
mous demands on the conceptual and technological steps.
architecture. For instance, the number of materials
used in the system increases and this must be taken ∙∙ Packaging technology and manufacturing processes
into account for the technological processes. Different for trustworthy electronics: new system integration
functions can lead to diverging technological require- methods can make a decisive contribution to lev-
ments. In this context, it is necessary to take a look eraging the trustworthiness of electronics. Modular
at the general conditions such as the need for optical designs and distributed functionality approaches, e. g.
windows or a hermetic design, thermal and electro- by wafer-to-wafer-bonding, chiplet designs and split
magnetic dependencies or the operating conditions manufacturing play a key role in this context.
for the finished system. In packaging technology, i.e.
the back-end-of-line, system integration increasingly ∙∙ Design and simulation: when developing hardware
requires automated processes and advanced systems and software simultaneously, the system architecture
technology. Measuring and testing technology is also and functionality are jointly considered during the
much more complex for a system than for components
with individual functions. To make matters worse, the
trend towards outsourcing production steps, especially
in assembly and packaging, makes the finished product
more vulnerable. By contrast, new approaches such as Hardware and software co-design
i
split manufacturing can make a targeted contribution
to improving the trustworthiness of electronic systems. Hardware and software co-design can considerably
accelerate the development of microprocessor-con-
This leads to numerous fields of action for research and trolled devices because it involves the simultaneous
development: development of electronic components, board, and
application software. System development remains
∙∙ Packaging technologies for new complex systems: flexible for a longer time, which is another advan-
this includes the design of multichip packages and tage since the allocation of functions to hardware
SiPs (system-in-package), 3D packaging, stacking and software can still be adjusted as requirements
techniques (flip-chip), interposer technologies change.
(e. g. vias), embedding, but also the development of18 MICROELECTRONICS. TRUSTWORTHY AND SUSTAINABLE. FOR GERMANY UND EUROPE.
design process. Due to the increasing complexity, re-
quirements of downstream manufacturing processes
are also taken into account at this stage, e. g. design
for testability, design for reliability or design for trust.
Further research topics are thermal, mechanical or
electromagnetic interactions in complex systems.
3.6.2 Test, verification and validation
Testing builds confidence.
The requirements for the durability of many electronic
components and systems are continuously increas-
ing. The demand for reliable and robust electronics is
rising especially with regard to critical applications. By
introducing autonomous driving technology in driving
services, for example, car electronics will no longer run
for just a few hours a day but will be operated constant-
ly with few breaks.
At the same time, the architecture of electronic systems communication interfaces. Emerging technological
is becoming more and more complex, combining mul- developments require the constant adjustment of test
tiple technologies in a confined space. This gives rise to coverage specification and test design in combination
new potential sources of error that can result in defects. with simulation models.
However, system failures are not always the result of
the unexpected behaviour of complex technologies. ∙∙ Test methods and equipment: they must keep up
Counterfeit and pirated products from component with technological progress. Research and develop-
suppliers are another risk, causing billions worth of ment of new microelectronics technologies must
damage to the economy every year while also posing a always go hand in hand with research and develop-
considerable safety and security risk for users. ment in testing and validation. In addition to iden-
tifying unintentional errors, test methods also focus
As a result, the role of testing and test method effective- on detecting intentional manipulations.
ness becomes increasingly important for trustworthy
systems. This applies to the entire chain – from design ∙∙ Global network of various component test benches:
and production to verification and validation. However, the aim is to validate systems and provide standard-
research and development effort in the field of testing, ised component data for simulation models. A secure
verification, and validation is considerable. data connection provides the basis for companies
and researchers to analyse component interactions
All in all, this leads to different fields of action such as: without disclosing confidential information on their
own components. New methods such as modular se-
∙∙ Design for test: electronic systems must be designed curity approval also benefit from this. Whereby single
to facilitate efficient testing at all stages of product components are individually approved and then re-
development – from simulation and prototyping to leased for operation of all system combinations. This
the finished product. This saves time and expense significantly reduces the test bench utilisation time.
as testing and verification meanwhile account for
a major part of electronics development work due ∙∙ Measuring methods and equipment: component
to the complexity of the systems, stringent require- functionality and efficiency can be verified by means
ments, and high integration density. Testing is very of suitable measurements and measuring technology
complex and never comprehensive, especially in helps to identify counterfeits. To this end, it is nec-
systems that also contain analogue elements such as essary to develop suitable measuring methods andYou can also read
