Understanding crust formation during baking
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Understanding crust formation during baking D.R. Jefferson a, A.A. Lacey a,* , P.A. Sadd b a School of Mathematical and Computer Sciences, Heriot-Watt University, Edinburgh EH14 4AS, UK b RHM Technology Ltd, The Lord Rank Centre, Lincoln Road, High Wycombe, Bucks HP12 3QR, UK Abstract A mathematical model of crust formation in bread baking is outlined, and used to explore the effect of the model parameters on crust thickness and density. Experimentation suggested that the interactions between model parameters were relatively weak, so it was possible to present the model results in terms of the percentage change in crust thickness from a 10% shift in each parameter. The results showed that crust thickness was particularly sensitive to the temperature at which bubbles collapsed and the doughÕs vapour pressure, but relatively insensitive to pre-oven dough conditions and dry crust properties. The overall mass in the crust showed similar dependencies, but with the addition that the thermal conductivity of the inner dough became significant. Keywords: Bread-crust formation; Crust thickness; Crust density 1. Introduction on the modelling of crumb. Consideration of the crust has been more limited. For example, a lumped model The texture of baked bread, and the processes which aimed at representing moisture variation has been dis- determine that texture, are important issues for manufac- cussed in Lostie, Peczalski, and Andrieu (2004), while turers of such products. The work presented in this paper Zanoni, Peri, and Bruno (1995) and Zanoni, Peri, and concerns bread texture, or, more specifically, the forma- Pierucci (1997) consider drying and browning near the tion of a crust during baking. Here, crust is taken to refer surface of a baking loaf. to that part of the bread near its surface, where the den- The present model is based on consideration of the sity is significantly higher than elsewhere. To help inves- changes undergone during baking by the dough, which tigate the factors which are important in determining the is a bubbly liquid when placed in the oven. Two key extent of the crust, a mathematical model of crust forma- events relating to the formation of a crust are the frac- tion has been developed in Jefferson, Lacey, and Sadd turing of the bubbles and the setting of the dough, the (Submitted for publication). In this paper we present former being assumed to occur at a slightly higher tem- the results of numerical simulations from the model. perature than the latter. When part of the dough matrix Other studies, such as de Vries and Rask (1990), surrounding a bubble reaches a certain temperature (at Hasatani et al. (1992), Zanoni, Peri, and Pierucci which it is already set) it fractures and the bubble be- (1992), Zanoni, Peri, and Pierucci (1994), which form comes part of a network of pores reaching the bread sur- just part of an extensive literature, have largely focused face. At this point the pressure inside the bubble decreases to the ambient pressure. If a bubble is still partly liquid when this occurs it will be subject to squashing by the inner part of the dough where the as yet unfractured bubbles have an internal pressure that
is higher than the ambient pressure. The more a bubble • The surface heat transfer coefficient h. This deter- is set when it fractures, the less squashing takes place mines the heat flow at the bread surface through and the lower the final density in that part of the bread, the boundary condition so that the greater the separation of the setting and frac- oT turing isotherms, i.e. the lower the temperature gradient, KðT Þ ¼ hðT a T Þ; r ¼ R. ð1:1Þ the less a bubble will change size. It is the levelling off of or the temperature gradient inside the bread which gives Here r is the spatial (radial) coordinate, R is the loaf rise to a decrease in the density of the bread towards radius, T the temperature, Ta the ambient (oven) tem- its centre. perature and K the thermal conductivity. The current model assumes that the setting and frac- • The loaf radius R. turing occur at precise temperatures, and that when • The oven temperature Ta. fracturing reaches a bubble, the part of the bubble adja- • The collapse temperature Tc. This is the temperature cent to liquid dough collapses instantaneously, as shown half way between the setting temperature Ts and the in Fig. 1. This collapse mechanism, with a change of fracturing temperature Tf described above; Tf and density fixed by temperature gradient, is coupled with Ts can be fixed in terms of Tc by specifying the differ- a nonlinear heat equation, with an experimentally de- ence between them (dT, see below). At any time fined thermal conductivity and an evaporation bound- during baking bubble collapse is taking place approx- ary at 100 C, and allows for convection due to the imately on the isotherm corresponding to Tc. expansion of the inner (unset) part of the dough. Also • The difference between the setting and fracturing tem- in Jefferson et al., Submitted for publication, the local peratures, dT = Tf Ts. behaviour near the onsets of collapse and evaporation • The temperature of vaporisation of water, Tv (this was analysed, and a numerical method for solving the can be altered by changing the composition of the radially symmetric problem was developed. dough, e.g. the addition of sugar or salt will increase The present paper now uses the model and numerical Tv). method to try to identify how qualities of the crust, • The mean bubble diameter (bubble diameters are namely its ‘‘size’’, ‘‘thickness’’ and ‘‘mass’’, the precise assumed to be distributed log-normally). meaning of which will be made clear below, depend on • Two parameters j1 and j2 determining the thermal various physical properties, which can either be con- conductivity, expressed as trolled, such as the water content of the dough, or might kðT Þ ¼ j1 ej2 T ð1:2Þ be determined by the qualities of the flour used. As our work is aimed at crust and we wish to keep calculations in wet, uncollapsed dough (this form is suggested by as simple as possible, the simulations discussed here are experimental data (Sadd, 2003)). for a spherical loaf or roll. • Two parameters e j 1 and e j 2 determining the thermal The following model parameters are varied: conductivity written in the same form e j 1 eej 2 T kðT Þ ¼ e ð1:3Þ • The initial porosity of the dough, i.e. the (uniform) porosity of the dough when it is placed in the oven. for wet, collapsed dough. Fig. 1. Diagram of the idealised bubble collapse mechanism.
A sequence of runs was performed to determine 2. Numerical results the effect of varying each parameter by 10% above and below a standard value, and to determine the In this section we present the results of numerical change in each parameter required to produce a 10% experiments designed to determine the way the model change in the crust properties. These results are listed parameters affect crust properties and investigate the in Tables 1–3. Some runs involving simultaneous varia- sensitivity of crust properties to changes in the various tion of two parameters were carried out, but no signifi- parameters of the model. Typical temperature and cant coupling was identified. The main results and density profiles arising from the numerical calculations implications of the changes found are discussed in can be found in Jefferson et al., Submitted for Section 3. publication. Table 1 Parameter changes required to produce a 10% increase in crust thickness Parameter Units Original value New value Percentage change Initial porosity /0 0.8 0.54 32% Convection coefficient h W m1 K1 35 27 23% Loaf radius R cm 5 6.6 32% Oven temperature Ta C 220 190 14% Collapse temperature Tc C 80 76 5% Vaporisation temperature Tv C 100 103 3% Mean bubble diameter m mm 1 1.37 37% Bubble mean/standard deviation 0.5 0.59 18% Fracturing – setting temperature dT C 8 5.8 27% Inner conductivity parameter j1 W m1 K1 0.04 0.029 28% Inner conductivity parameter j2 K1 0.0256 0.0214 16% Outer conductivity parameter ej1 W m1 K1 0.04 0.047 17% Outer conductivity parameter ej2 K1 0.0256 0.0273 7% Table 2 Parameter changes required to produce a 10% increase in the proportion of the mass in the crust Parameter Units Original value New value Percentage change Initial porosity /0 0.8 0.77 4% Convection coefficient h W m1 K1 35 59 65% Loaf radius R cm 5 4.3 14% Oven temperature Ta C 220 310 41% Collapse temperature Tc C 80 77 4% Vaporisation temperature Tv C 100 103 3% Mean bubble diameter m mm 1 1.12 12% Bubble mean/standard deviation 0.5 0.55 11% Fracturing – setting temperature dT C 8 7.1 11% Inner conductivity parameter j1 W m1 K1 0.04 0.035 11% Inner conductivity parameter j2 K1 0.0256 0.0241 6% Outer conductivity parameter ej1 W m1 K1 0.04 0.047 17% Outer conductivity parameter ej2 K1 0.0256 0.0273 7% Table 3 Parameter changes required to produce a 10% increase in final surface density Parameter Units Original value New value Percentage change Initial porosity /0 0.8 0.85 6% Convection coefficient h W m1 K1 35 27 23% Oven temperature Ta C 220 190 14% Collapse temperature Tc C 80 76 5% Mean bubble diameter m mm 1 1.13 13% Bubble mean/standard deviation 0.5 0.58 16% Fracturing setting temperature dT C 8 7.1 12% Inner conductivity parameter j1 W m1 K1 0.04 0.035 12% Inner conductivity parameter j2 K1 0.0256 0.0240 6%
We characterise the crust profile using three quanti- Percentage change in crust thickness ties. The first is the crust thickness, defined as the dis- tance from the surface at which the final density is 30 0 40 equal to the original dough density (see Fig. 2). The sec- Collapse temperature ond quantity is the proportion of the loaf mass in the Oven temperature crust between this point and the bread surface. The third Initial porosity quantity is the final density at the bread surface, which Inner conductivity (b) in this model can be calculated directly from the model Fracturing temp. setting temp. parameters (without numerical simulations). Surface heat transfer coefficient Figs. 3–5 show the percentage change in crust thick- Inner conductivity (a) ness, mass proportion and final surface density resulting Latent heat of vaporisation from a 10% increase in each parameter from its value Mass fraction of water Density of gas free dough given in Table 4 (with the other parameters set at the Initial temperature values given there). These central values are suggested Conductivity of dry crust by data from Rask (1989) and Sadd (2003). That chang- Specific heat of water ing the (bubble-free) dough matrix density has no effect Specific heat of dry dough on the crust profile is a consequence of the fact that Loaf radius changing this parameter is equivalent to rescaling time. Mean bubble diameter Tables 1–3 show the parameter changes necessary to Bubble standard deviation produce a 10% change in the crust thickness, mass pro- Outer conductivity (a) portion and surface density respectively. In the parame- Outer conductivity (b) ter ranges considered here, the model does not give rise Vaporisation temperature to any complicated interactions between parameters. Fig. 3. Bar chart showing the percentage change in crust thickness Examples of the effect of varying two parameters to- resulting from a 10% increase in the numerical parameter values given gether are shown in, Figs. 6 and 7. in Table 4. Here inner conductivity (a), inner conductivity (b), outer In producing these results, each parameter was varied conductivity (a) and outer conductivity (b) refer to the parameters j1, independently. In practice, various parameters will be j 2, e j 1 and e j 2 respectively (see (1.2) and (1.3)). linked together. For example, we have seen that raising the vaporisation temperature gives rise to a thicker crust (due to the fact that vaporisation hinders the supply of heat from the oven). However, raising the vaporisation Percentage change in proportion of mass in crust temperature will have the effect of decreasing heat trans- 20 0 30 fer due to moisture migration at a given temperature, resulting in a lower effective thermal conductivity. This Collapse temperature would tend to counteract the Ôlevelling outÕ of tempera- Inner conductivity (b) Fracturing temp. setting temp. Loaf radius Inner conductivity (a) 2.5 Initial temperature Density as a proportion of original density Latent heat of vaporisation Mass fraction of water 2 Density of gas free dough Conductivity of dry crust Specific heat of water 1.5 Specific heat of dry dough Oven temperature Surface heat transfer coefficient 1 Initial porosity Outer conductivity (a) Mean bubble diameter 0.5 Crust thickness Bubble standard deviation Outer conductivity (b) Vaporisation temperature 0 0 2 4 6 8 10 Distance from surface (mm) Fig. 4. Bar chart showing the percentage change in the proportion of mass in the crust resulting from a 10% increase in the numerical Fig. 2. Crust thickness is defined as the distance from the bread parameter values given in Table 4. Here inner conductivity (a), inner surface at which the density is equal to the original density before conductivity (b), outer conductivity (a) and outer conductivity (b) refer baking. to the parameters j1, j2, ej 1 and e j 2 respectively (see (1.2) and (1.3)).
Percentage change in surface density Lines of equal crust thickness (thicknesses shown in mm) 75 2.5 30 0 30 74 3 Initial porosity 3.5 Collapse temperature (°C) Collapse temperature 73 4 Inner conductivity (b) 4.5 Inner conductivity (a) 72 Fracturing temp. setting temp. 5 Bubble standard deviation 71 5.5 Mean bubble diameter 6 Surface heat transfer coefficient 70 Oven temperature 6.5 69 Fig. 5. Bar chart showing the percentage change in final surface density resulting from a 10% increase in the numerical parameter 68 values given in Table 4. Here inner conductivity (a) and inner conductivity (b) refer to the parameters j1 and j2 respectively (see (1.2) 90 95 100 105 110 and (1.3)). Vaporisation temperature (°C) Fig. 6. Contour plot showing the effect on crust thickness of varying both vaporisation and collapse temperature. Other parameters have the values given in Table 4. Note that the contours are fairly straight. Table 4 The ÔcentralÕ model parameter values used Initial porosity /0 = 0.8 Density of gas-free dough qm = 1250 kg m3 Lines of equal crust thickness (thicknesses shown in mm) Dry specific heat c ¼ 1680 J kg1 K1 82 Dry thermal conductivity k ¼ 0.055 W m1 K1 Convection coefficient h = 35 W m1 K1 80 Bread radius R = 0.05 m 4.5 Collapse temperature (°C) Oven temperature Ta = 200C 78 Collapse temperature Tc = 80C Vaporisation temperature Tv = 100C 76 Initial temperature T0 = 40C 5 Mean bubble diameter m = 0.001 m Bubble mean/standard deviation br = 1/2 74 Fracturing temperature – setting dT = 8C temperature 72 Latent heat of vaporisation L = 2.272 M J kg1 K1 Initial mass fraction of water mw = 0.45 70 5.5 Specific heat water cw = 4187 J kg1 K1 Conductivity parameters j 1 ¼ 0.04 W m1 K1 j1 ¼ e 68 (see (1.2) and (1.3)) j 2 ¼ 0.0256 K1 j2 ¼ e 7.2 7.4 7.6 7.8 8 8.2 8.4 8.6 8.8 Difference between fracturing and setting temperatures (°C) Fig. 7. Contour plot showing the effect on crust thickness of varying ture in the inner part of the dough, and make the crust both the difference between the setting and fracturing temperatures thinner than it would otherwise be (the results show that and the collapse temperature (the meaning of these temperatures is a higher inner thermal conductivity gives rise to a thick- explained in Section 1). Other parameters have the values given in er crust). To better account for these interactions, more Table 4. Note again that the contours are fairly straight. detailed modelling of moisture migration and its rela- tionship with heat transfer is required. volume – it is a function of the bubble diameter distribu- A feature of this model is that the collapsed density at tion, see Jefferson et al., Submitted for publication – and the bread surface is given immediately by the model parameters and no numerics are necessary to obtain it. dT ðj1 ej2 T c Þ f0 ¼ . The expression for this density is hðT a T c Þ qm ð1 /0 Þ For the derivation of these expressions see Jefferson ^0 ¼ q et al., Submitted for publication. The way that the final 1 /0 m0 surface density varies as these parameters are varied is where qm is the density of gas-free dough, /0 is the shown in Fig. 8. porosity at the start of baking, m0 = m(f0) with m the That the collapsed density at the surface can be calcu- volume of bubble collapse per unit uncollapsed bubble lated directly from the model parameters without the
4 5 4.5 3.5 Final surface density/original density Final surface density/original density 4 3 3.5 2.5 3 2.5 2 2 1.5 1.5 1 1 50 100 150 200 250 300 350 400 0 20 40 60 80 100 120 140 160 Oven temperature (°C) Collapse temperature (°C) 4 5.5 5 3.5 Final surface density/original density Final surface density/original density 4.5 3 4 3.5 2.5 3 2 2.5 2 1.5 1.5 1 1 0 10 20 30 40 50 60 70 0 2 4 6 8 10 12 14 16 Convection coefficient h (W m k ) Difference between fracturing and setting temperatures (°C) 3 4 2.8 3.5 Final surface density/original density Final surface density/original density 2.6 2.4 3 2.2 2 2.5 1.8 2 1.6 1.4 1.5 1.2 1 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.5 1 1.5 2 Initial porosity Mean bubble diameter (mm) Fig. 8. Graphs showing how final surface density changes when model parameters are varied (each parameter being varied independently with the others being fixed at the values given in Table 4). In the last graph the mean bubble diameter is varied while the ratio between the mean and the standard deviation is fixed. need for numerical simulations is a consequence of the face reaches the collapse temperature Tc will be higher, fact that the temperature gradient at the bread surface resulting in a higher crust density at the surface. is determined by the boundary condition (1.1) with T = Tc. As explained in Section 1, a higher temperature gradient gives rise to a higher collapsed density. For 3. Discussion example, it is apparent from (1.1) that if the surface heat transfer coefficient h or the oven temperature Ta are in- The results presented here give a strong indication of creased, the surface temperature gradient when the sur- the relative importance of the various parameters of the
bread baking process in determining crust properties. the relationship between heat transfer and moisture For example, they suggest that the collapse temperature migration is needed. (the temperature characteristic of the setting and frac- turing of the dough) has a greater effect on the extent and density of the crust (a lower collapse temperature References leading to a thicker, denser crust) than the initial tem- perature of the dough or the oven temperature. de Vries, U., & Rask, C. (1990). Heat and mass transfer during baking. Some of the parameters which are treated as indepen- In P. Zeuthen, J. C. Cheftel, C. Ericksson, T. R. Gormley, & P. Linko (Eds.), Processing and quality of foods 1. Amsterdam, dent in the current model will, in reality, be linked to- Netherlands: Elsevier. gether. One of the model parameters which has the Hasatani, M., Arai, H., Harui, H., Itaya, Y., Fushida, N., & Hori, N. greatest effect on crust properties is the temperature of (1992). Effect of drying on heat transfer of bread during baking in vaporisation of water. The reason for this is that the on- oven. Drying Technology, 10(3), 623–639. Jefferson, D. R., Lacey, A. A., & Sadd, P. A. (Submitted for set of vaporisation at the bread surface slows down heat publication). Crust density in bread baking: Mathematical model- transfer to the inner part of the dough, causing the tem- ling and numerical solutions. Advances in Mathematical Sciences perature there to level off more quickly (this, as ex- and Applications. plained in Section 1, will cause a more rapid drop in Lostie, M., Peczalski, R., & Andrieu, J. (2004). Lumped model for the final density as the centre of the bread is ap- sponge cake baking during the Ôcrust and crumbÕ period. Journal of proached). A higher vaporisation temperature means Food Engineering, 65(2), 281–286. Rask, C. (1989). Thermal properties of dough and bakery products: a that this effect occurs later in the process of crust forma- review of published data. Journal of Food Engineering, 9(3), tion, giving rise to a thicker crust. In reality, a higher 167–193. vaporisation temperature will have other effects, linked Sadd, P. A. (2003). Private communication. to other parameters in the model. For example, it will Zanoni, B., Peri, C., & Bruno, D. (1995). Modelling of browning hinder heat transfer due to moisture movement in the kinetics of bread crust during baking. Lebensmittel-Wissenschaft und -Technologie, 28(6), 604–609. wet part of the dough, decreasing the effective thermal Zanoni, B., Peri, C., & Pierucci, S. (1992). A study of the bread-baking conductivity (which in this model is determined by the process, I: A phenomenological model. Journal of Food Engineer- parameters j1, j2 etc.). A decrease in the conductivity ing, 19(4), 389–398. will slow down the levelling out of temperature in the Zanoni, B., Peri, C., & Pierucci, S. (1994). Study of the bread-baking bread, thus counteracting the effect of changing the process, II: Mathematical modelling. Journal of Food Engineering, 23(3), 321–336. vaporisation temperature in the model alone. To deter- Zanoni, B., Peri, C., & Pierucci, S. (1997). A computer model of bread mine more precisely the effect of varying the vaporisa- baking control and optimization. In Proceedings of the seventh tion temperature of water, more careful modelling of international congress on engineering and food, Brighton, UK.
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