Negative index metamaterial at ultraviolet range for subwavelength photolithography
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Nanophotonics 2022; 11(8): 1643–1651 Research Article Qijian Jin, Gaofeng Liang*, Weijie Kong, Ling Liu, Zhongquan Wen, Yi Zhou, Changtao Wang, Gang Chen and Xiangang Luo* Negative index metamaterial at ultraviolet range for subwavelength photolithography https://doi.org/10.1515/nanoph-2022-0013 new insights into the manipulation of light. The improved Received January 11, 2022; accepted February 27, 2022; working distance, well-shaped patterns over large area published online March 15, 2022 present an innovative method for improving subwavelength photolithography. Abstract: A negative index metamaterial (NIM) at ultravi- olet range is constructed with stacked plasmonic wave- Keywords: negative index metamaterial; plasmonic guides. Based on the waveguides performing antisymmetric waveguide; subwavelength photolithography. modes, the negative refractions of both wavevector and energy flow are realized when a TM-polarized light with a wavelength of 365 nm incidents on the plane of the layers. 1 Introduction It is proved that the NIM could be introduced into subwavelength photolithography for extending working Nowadays, photolithography is one of the most important distance. Both theoretical and experimental results indicate ways in fabricating integrated circuit and nano devices that the patterns with a feature size of 160 nm can be [1, 2]. In particular, projection photolithography method reproduced in photoresist with a 100 nm-thick air working can produce arbitrary patterns over large area with a single distance. Moreover, arbitrary two-dimensional patterns with exposure process [3]. However, the resolution of traditional a depth reach 160 nm can be obtained without diffraction photolithography is always blocked by the so-called fringe by employing a nonpolarized light. This design gives diffraction limit due to the wave nature of light [4]. Even though the resolution can be improved remarkably by decreasing the working wavelength, using immersion lithography, or multipatterning process, these technolo- *Corresponding authors: Gaofeng Liang, Key Laboratory of gies would involve much more complexity and cost. Hence, Optoelectronic Technology & Systems (Chongqing University), Ministry of Education, and College of Optoelectronic Engineering, new cost-effective methods are needed to take the tech- Chongqing University, Chongqing 400044, China, nique past the diffraction limit without huge expense. E-mail: lgf@cqu.edu.cn. https://orcid.org/0000-0003-0817-7444; Recently, various techniques have been developed for and Xiangang Luo, State Key Lab of Optical Technologies on Nano- pushing photolithography to higher resolution perfor- fabrication and Micro-engineering, Institute of Optics and Electronics, mance, such as stimulated emission depletion lithography, Chinese Academy of Sciences, Chengdu 610209, China, E-mail: lxg@ioe.ac.cn. https://orcid.org/0000-0002-1401-1670 absorbance-modulation optical lithography, photothermal Qijian Jin, Key Laboratory of Optoelectronic Technology & Systems lithography [5–7]. By contrast, near-field photolithography (Chongqing University), Ministry of Education, and College of is a straightforward way to produce subdiffraction limited Optoelectronic Engineering, Chongqing University, Chongqing patterns by collecting the evanescent waves before they 400044, China; and State Key Lab of Optical Technologies on Nano- decay [8]. In this instance, plasmonic lithography has been fabrication and Micro-engineering, Institute of Optics and Electronics, developed attractively [9, 10]. This method would enhance Chinese Academy of Sciences, Chengdu 610209, China Weijie Kong, Ling Liu and Changtao Wang, State Key Lab of Optical evanescent waves by exciting surface plasmons to Technologies on Nano-fabrication and Micro-engineering, Institute of compensate the decay and then lead to a super-resolution Optics and Electronics, Chinese Academy of Sciences, Chengdu pattern. However, the photoresist (PR) has to be close 610209, China contacted to the plasmonic devices, while, direct-write Zhongquan Wen, Yi Zhou and Gang Chen, Key Laboratory of lithography systems [11–13] do not meet the requirement of Optoelectronic Technology & Systems (Chongqing University), Ministry of Education, and College of Optoelectronic Engineering, obtaining arbitrary patterns with a single exposure. Chongqing University, Chongqing 400044, China. https://orcid.org/ Although some special approaches, such as hyperbolic 0000-0002-8857-7087 (Z. Wen) metamaterials and waveguide cavities are investigated to Open Access. © 2022 Qijian Jin et al., published by De Gruyter. This work is licensed under the Creative Commons Attribution 4.0 International License.
1644 Q. Jin et al.: Negative index metamaterial for photolithography adjust the evanescent waves in more degrees of freedom μ < 0, which then leads to a negative refractive index, n < 0. [14–18], the overly short working distance (WD) and quite The characteristics of plane waves in this medium can be shallow pattern depth still obstruct the practical applica- described by the wavevector k and the time average Poynting tion of this exciting lithography scheme. vector S, which, respectively, give the directions of phase Interestingly, the negative index metamaterials (NIMs) velocity Vp and energy flow, while, the direction of S could be has been studied many years due to its inherent perfect further represented by the direction of group velocity Vg in the lens properties [19]. The light obeys Snell’s laws of refrac- absence of loss. In this case, the medium, originally named tion at the surface as light inside the NIMs, and forms a ‘left-handed’ material, supports propagating solutions whose negative angle with the surface normal. Then an image of Vp and Vg are antiparallel. It means the signs of k and S are light source would be shaped by refocusing light on the opposite (k • S < 0) [28]. Unlike traditional materials, the NIMs other side of the NIMs, which is predicted to obtain sub- are often composited of noble metals (M) and dielectrics wavelength focusing with resolution well below the (D) planar films in the visible and ultraviolet ranges [29–31]. diffraction limit. More importantly, the WD could be As shown in Figure 1A, the NIM structure is a stacked multi- extended theoretically by increasing the thickness of the layer, and each unit cell has an MD layer sequence. The ar- NIM [20]. Although there is no material with both negative rows depict the directions of k and S, performing negative permittivity and permeability in nature, the negative refraction and backwards phase propagation. However, such refractive index could be realized in microwave or even NIM is generally regarded as a purely two-dimensional infrared regions by constructing artificial metamaterials isotropic, in other words, the negative refractive only could be [20, 21]. However, it is difficult to achieve an acceptable observed in-plane [24–27]. negative refractive index at ultraviolet frequency because To be used in photolithography, the negative refrac- of substantial resonance losses and fabrication difficulties tion need be extended to another dimension normal to the [22, 23]. Interestingly, plasmonic waveguide-based meta- plane of the NIM multilayers. Here, the proposed NIM materials can achieve a negative refractive index at high structure is consist of alternating Ag and TiO2 layers, which frequencies [24, 25]. It is reported that the negative refrac- are employed to form plasmonic waveguides stacked in the tion at the dimension of perpendicular to the plane of the z direction, and each unit cell has an MDMD layer sequence layers could be achieved by employing strongly coupled (40, 19, 45, and 19 nm, respectively). The individual film plasmonic waveguides with symmetric modes [26, 27]. thicknesses are optimized to achieve left-handed response However, the excessive loss from the thick metal makes it and admissible transmittance in the ultraviolet band not suitable for subwavelength photolithography. (Supplementary Materials S1). It is worth noting that the Herein, we propose a subwavelength photolithog- transmittance could be enhanced by employing a material raphy design by introducing a special NIM, which is con- with low absorbtion, e.g. HfO2 (n ≈ 2.2) [32]. However, the structed with stacked plasmonic waveguides but perform NIM multilayer should be designed comprehensively. A antisymmetric modes. Besides being achieved in-plane, dielectric with high refractive index and a metal with low the negative refraction of both wavevector and energy flow loss would present an NIM with attractive performance. would be also achieved when an ultraviolet transverse Figure 1B gives the dispersion curves of the propagating magnetic (TM)-polarized light incidents on the plane of the modes in the designed plasmonic waveguides, which is layers. The experimental results, along with numerical computed with transfer matrix method by using ϵm = 1 − calculations, show that the air WD could be greatly ω2p /ω2 and εd = 8.52. The left-handed response acquires improved in the exposure process, and the subwavelength patterns could be produced in PR with well-shaped a negative Vg (i.e., dω/dk < 0), which is accomplished by morphologies. Furthermore, arbitrary two-dimensional the plasmonic waveguide in a frequency range between patterns over large area could be obtained by a single the volume plasma frequency of the metal ωp and the sur- exposure with a nonpolarized light. This NIM-based design face plasmon frequency of the metal-dielectric inter- presents a more practical method for improving sub- face (i.e., ωsp < ω < ωp). Hence, the k and S are wavelength photolithography. counterpropagating without considering the absorption, meaning the NIM can perform negative refraction in-plane. In addition, the waveguide supports antisymmetric mode √̅̅̅̅̅̅̅̅̅̅ 2 Principle and design because of the dielectric thickness hd < ( πc/ωp ) (1 + ϵd )/ϵd [24], which is present by the magnetic field Hy in the inset. Generally, NIMs are a kind of medium possess simultaneously More importantly, this NIM also exhibit negative refraction negative permittivity, ε < 0, and negative permeability, when a TM-polarized light illuminates on the plane of the
Q. Jin et al.: Negative index metamaterial for photolithography 1645 Figure 1: Design of a NIM for photolithography. (A) Schematic of plasmonic waveguide- based NIM multilayer. The dashed lines indicate the incident plane of a TM-polarized light parallels to the layers. Red and green– blue arrows depict the directions of S and k, respectively. (B) Dispersion relations for modes in an MDM waveguide with hd = 19 nm and εd = 8.52, where kp = ωp/c. The corre- sponding structure and magnetic field dis- tribution Hy along the z axis are shown in the inset. (C) Schematic of the NIM-based lithography design. (D) Three-dimensional plots of EFCs for the plane wave with a wavelength of 365 nm in NIM slab and in free space. Si and St show the incident and transmitted time-averaged Poynting vectors, respectively; ki and kt give the incident and transmitted wavevectors, respectively. multilayers. It could be observed that the phase front in TM would have a kt (pointing towards the interface) and a St condition is refracted in a negative angle and propagated with (pointing away from the interface) on the same side of the a backward direction (Supplementary movies 1 and 2). normal as the incident light, which is inferred from Meanwhile, the direction of S inside the multilayer is anti- the continuity of phase and conservation of energy [27]. parallel to the Vp, which is a signature of NIM. These fresh The vivid description of phase fronts in this lithography evidences state clearly that the proposed NIM with antisym- system (normal incidence case) can be seen in Supple- metric mode in waveguides could be used in subwavelength mentary movie 3. It should be noted that kt and St are not lithography. exactly collinear, which is mainly because the EFCs of the The diagram of the designed photolithography system NIM is not a perfect sphere. is shown in Figure 1C. A plane wave radiated from a mer- Basically, the NIM multilayer could be considered as cury lamp (i-line) normally incidents on the Cr mask from an equivalent negative refractive slab. To give a visualized the top side. The slots of the mask are flatted by coating parametric analysis and confirm the validity of negative poly(methyl methacrylate) (PMMA), which also works as index for the proposed NIM, we perform a parameter an index-matching layer [10, 15, 33]. The NIM multilayer retrieval procedure using the commercial software FDTD includes two MDMD layered unit cells and an additional Ag solutions 2019. The NIM multilayer in air environment is coupling layer. The waves transmitted through the multi- normally illuminated by a broadband plane wave source layer and 100 nm-thick air WD are regathered into the PR, with the wavelength ranging from 300 nm to 400 nm. After which is supported by another substrate. the steady state field distributions is obtained, the complex To illustrate the features of the NIM more clearly, the reflection r and transmission t coefficients are calculated by three-dimensional equi-frequency contours (EFCs) are taking the ratios r = Er/E0 and t = Et/E0, where E0 is the calculated by using εm = −2.26 + 0.46i and εd = 8.52 + 0.31i complex electric field amplitude of the incident light, Er (Figure 1D). The EFCs map the angular dependence of the and Et are the reflected and transmitted complex electric wavevector in the NIM and indicate the direction of the S field amplitudes, respectively. Then, r and t could be (which is normal to the EFCs and points in the direction of related to the effective relative impedance Zeff and index its displacement as a function of frequency). It can be seen neff by using standard inverted reflection and transmission that the EFCs of the NIM resemble a sphere with a radius of parameter equations [34]. The effective relative permittivity approximately k0. The wavevector magnitude decreases for εeff and permeability μeff are calculated through the re- increasing frequency, indicating that the Vg is oriented lations ε = n/Z and μ = nZ. Figure 2 shows the resulting inwards. The red arrow confirms that the S is directed in- curves corresponding to the effective relative Zeff, neff, εeff, wards (i.e., k • S < 0). For a plane wave incident from mask and μeff of the NIM multilayer. It can be seen that the real onto the surface of NIM, the transmitted backwards wave part of the extracted neff is negative over the entire spectral
1646 Q. Jin et al.: Negative index metamaterial for photolithography region. Specially, the real part of the neff is about −1.35 at through the air WD. Because the realistic dispersion, loss the wavelength of 365 nm. Meanwhile, it shows a double- would result in the NIM never meet the idealized conditions negative index composed of simultaneously negative real [39], the diffracted waves are refocused at different posi- parts of the permittivity and permeability. Therefore, the tions. Finally, a pattern is formed in the following PR layer proposed NIM not only performs negative refraction (εPR = 2.59) [33] with a depth over 200 nm. The cross section [35, 36], but also exhibits a true negative refractive index taken from the middle position of PR layer shows the full characterized by negative refraction and backwards phase width at half maximum (FWHM) of the straight line is propagation. These parameters are extremely consistent ∼170 nm (Figure 3B). with the definition of NIM [37]. If the NIM multilayer is Then, the masks changed into an isolated aperture consider as an isotropic medium with neff = −1.35, the with a diameter of 180 nm. Notably, to obtain standard direction of light could be observed intuitively with ray- two-dimensional patterns and imitate a nonpolarized tracing method (Supplementary material S2). On the other light used in following experiments, the mask is illumi- hand, when a plane wave in free space with an incident nated by superposing two incoherent linearly polarized angle θi passing through the boundary between air and lights with vertical polarization. The normalized intensity NIM, the neff also could be estimated qualitatively by using distribution in PR shows a round dot with an FWHM of Snell’s law, i.e., neff = sinθi/sinθr, where θr is the refraction ∼220 nm (Figure 3C). The size expansion is mainly due to angle of S inside the NIM. In our case, the calculated neff of the adverse effect of TE-polarized components in hybrid the NIM is about −1.31 (Supplementary material S3), in lighting (Supplementary materials S4), which also can be agreement with the value derived from the parameter seen in the annular slit mask case shown in Figure 3D. It retrieval procedure. presents that the annular slit with an outer diameter of To verify the foregoing analysis, several typical mask 700 nm and an inner diameter of 500 nm is regularly patterns are employed to demonstrate the capability of the imaged into the PR with an FWHM of ∼220 nm. Remark- proposed photolithography system. Firstly, a straight slit ably, the optical fields in PR have no any sidelobe or with a width of 160 nm is prepared on the mask layer diffraction fringe, meaning the patterns could be pro- (εCr = −8.62 + 9.23i) [38]. The normalized intensity distri- duced with high fidelity, which is highly desirable in bution in x–z plane is given in Figure 3A. Obviously, when lithography. Admittedly, two-dimensional patterns also the mask is irradiated by a TM-polarized light with a could be generated by illuminating with circularly wavelength of 365 nm, the diffraction waves could be polarized light [14, 40]. However, the nonpolarized lights excited and propagated efficiently in the NIM with negative radiated from a mercury lamp has apparent advantages in refraction angles, which then are refocused after passing respect to convenience and robustness. Figure 2: Effective parameters for the designed NIM in the wavelength range of 300–400 nm. (A–D) Corresponding real (′) and imaginary (″) parts of the retrieved effective relative impedance Zeff, index neff, permittivity εeff, and permeability μeff.
Q. Jin et al.: Negative index metamaterial for photolithography 1647 Figure 3: Simulated results of the NIM-based lithography. (A) Cross section of normalized intensity distribution in logarithm scale inside the NIM-based lithography design. (B–D) Normalized intensity distributions in x–y plane extracted from the middle position of PR. The corresponding mask patterns are straight slit, isolated aperture, and annular slit, respectively. The insets show the related intensity distributions along the dashed lines. 3 Fabrication and lithography column are related to the straight slit condition. Figure 5A is a scanning electron microscopy (SEM) image of the results mask. As expected, after transmitted through the NIM multilayer and air WD, the waves generate an identical The key fabrication and exposure processes of the pattern in PR but the width is ∼180 nm (Figure 5D), which NIM-based lithography is shown in Figure 4. Crucially, the is close to the simulated result in Figure 3A. The difference mask is flatted by the PMMA, which give a planar surface could be ascribed to the broadband emission from for depositing the NIM multilayers. The 100 nm-thick air the mercury lamp (Supplementary Materials S5). The WD is realized by fabricating a sunken step on the PR morphology of the pattern is measured by atomic force substrate around the patterning areas. More importantly, microscopy (AFM) and shown in Figure 5G. Clearly, the the nonpolarized light radiated from a high pressure mer- depth of the pattern exceeds 120 nm, which surpasses cury lamp is used directly for exposure. All the patterns are almost all reported results based on plasmonic lithography produced with a single exposure process. The relevant [14, 40, 41]. More importantly, the neat patterning area details are described in the Experimental Section. shows no diffraction fringe around the slit. Same perfor- Figure 5 shows the experimental results of the afore- mances can also be seen in another two mask cases (cor- mentioned three different masks. The pictures in left responding pictures in Figure 5B, E, H and Figure 5C, F, I), Figure 4: Schematic diagrams for the processes of sample fabrication and lithography.
1648 Q. Jin et al.: Negative index metamaterial for photolithography Figure 5: Experimental results of typical mask patterns in lithography with/without NIM multilayer. (A–C) SEM images of the masks with a straight slit, isolated aperture, and annular slit, respectively. (D–F) Corresponding SEM images of the patterns formed in PR. (G–I) Corresponding AFM images of the PR patterns. The insets present the depth profiles along the dashed lines. (J–L) Corresponding SEM images of the PR patterns in control experiments. where both the isolated aperture and annular slit are suc- enhanced significantly, resulting in less exposure time. cessfully imaged into PR with well-shaped morphologies. However, the light beams would diverge greatly as the The widths of the two patterns in PR are ∼230 nm, and the propagating distance increases. The patterns in PR are depths reach 160 nm. Actually, if the adverse effect of expanded accordingly (Supplementary Materials S6). As TE-polarized components is eliminated by illuminating observed in Figure 5J–L, the widths of the straight slit, with a radially polarized beam, and using a light source isolated aperture, and annular slit are 345, 308, and with narrow wavelength band, the FWHM of a circular or 267 nm, respectively, which are much larger than the annular pattern could be dramatically shrunk [42]. NIM-based results. The rough edges and tiny ring in the The control experiments are also carried out. Without central of the annular slit proves that unwanted in- the NIM multilayer, the light intensity in PR could be terferences are happened during the imaging process.
Q. Jin et al.: Negative index metamaterial for photolithography 1649 Figure 6: Experimental results of a mask with patterns over large area. (A) SEM image of a mask constructed with aperiodic rectangles. (B) Normalized intensity distributions extracted from the position of 100 nm- depth PR. (C, D) SEM and AFM images of the pattern formed in PR. (E) Corresponding depth profile along the dashed line in (D). (F) SEM images of the PR patterns in control experiment. The proposed subwavelength lithography system can 4 Conclusions also fabricate arbitrary patterns over large area with a single exposure process. As illustrative examples, typical In conclusion, an NIM is designed based on alternating optical metasurface structures [43–45] are used to Ag/TiO2 multilayer with antisymmetric waveguide mode. It demonstrate an economical and effective method in is proved that the negative refraction of both wavevector fabrication. Figure 6A shows an SEM image of rectangles and energy flow can be realized when a TM-polarized light array mask. The widths of all rectangles are 400 nm, while incident on the plane of the layers. Furthermore, the NIM the lengths vary from 400 nm to 800 nm. Benefited from could be introduced into subwavelength photolithography negative refraction of the NIM, the waves diffracted from to extend the WD and produce well-shaped arbitrary pat- the mask could be regathered and produce well-shaped terns over large area. In the case of 100 nm-thick air WD, patterns in PR (Figure 6B–E). The patterns with neat mor- subwavelength patterns with a depth reach 160 nm could phologies indicates the disordered diffraction and intersect be obtained by illuminating with a mercury lamp. This interference maybe not happened or affect the imaging strategy gives new insights into nanofabrication. The process (more results in subwavelength sizes can be seen principle is also meaningful for studying optical imaging, in Supplementary materials S7). Whereas the morphol- reversed Doppler effect, compact on-chip devices, etc. ogies of the patterns in the control experiments present obvious distortions (Figure 6F). Same performances can be seen in the conditions of annular slits arrays and V-shaped antennas (Supplementary material S8 and S9). Regret- 5 Experimental section tably, the phenomena of corner rounding can be seen in the First of all, a fused silica substrate is boiled in H2SO4:H2O2 (3:1) solu- results of NIM-based lithography, which reveals it still tion and ultrasonic cleaned in acetone and deionized water succes- suffers from the optical proximity effect. However, this sively. The Cr film with a thickness of 60 nm is deposited on the problem could be resolved distinctly by combining the substrate by Magnetron Sputtering (DE500, TE technology) with a technology of optical proximity correct [46]. power of 400 W in radio frequency mode. The deposition rate is
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