Product Showcase 2nd Quarter, 2021 Update
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Product Showcase
2nd Quarter, 2021 Update
High Density, High
Power Packaging Experts
Sensitron’s products provide rugged, light-
weight, and cost-effective solutions for power
switching, control, and protection. Our team of
engineers specialize in electrical and
mechanical design, material science expertise,
packaging, and testing.
About Sensitron With over 50 years of
Established in 1969, Sensitron has experience, our team of
dedicated over 50 years as an industry
leading manufacturer of high reliability
engineers have proven
power electronic component solutions for expertise to design and
the Defense, Aerospace, and Space
manufacture product
markets. Headquartered in Hauppauge, NY
with three new state-of-the-art 15,000 sq ft where size, reliability,
Manufacturing Clean Rooms, certified to and efficiency are key to
Class H and K, Sensitron uses the latest
technologies in the design and
your critical mission
manufacturing of our products. success.
©©
2021 Sensitron
2021 Semiconductor.
Sensitron AllAll
Semiconductor. rights reserved.
rights reserved.
Product Overview
Sensitron High Voltage Ultra-Lightweight
Ultra-Lightweight Power
Modules
• Ultra-lightweight lower profile
Modules
• Lowest possible thermal resistance
• CTE Matching = less thermal fatigue
• Ideal for high temperature applications
• Designed for for higher reliability requirements
• Silicon and SiC Three Phase, Full H- bridge, and
custom half bridges in various configurations
and package styles
Potential Applications
• Power conversion & inverters Lightweight, 20 grams
• High reliability switching applications Lightweight, cost-effective
• Aircraft pod mounted electronics High Reliability packaging solutions offers
Applications maximum weight savings
Designed for high coupled with high thermal
reliability applications conductivity and fatigue
including motor drives, resistance.
power conversion,
inverters e-brakes, and
actuator control.
Low Profile, 0.2in
Advanced Baseless
Packaging has an optimized
internal layout, minimizing
stray inductances and
supporting high frequency
switching required in
advanced aerospace and
SPM1018 3ph SiC Bridge defense electrical systems.
900V, 90A
© 2021 Sensitron Semiconductor. All rights reserved. 2
Product Overview
Sensitron High Power Modules 1200V, 150A
• Matched switching device
• Lower profile and high power density
• Lowest possible thermal resistance
• Ideal for rugged critical flight applications
• Silicon and SiC Three Phase, Full H- bridge, and
custom half bridges in various configurations and
package styles
Potential Applications 3PH IGBT, Brake IGBT, Inrush SCR
• E-VTOL
• High reliability switching applications
Sensitron’s patented VoidLessTM soldering process supports
• Power Conversion & Inverters
operation at high current while maintaining adequate current sharing
• Directed energy weapons for paralleled switching devices within recommended SOA curves.
• Battery disconnect
High Power Modules
with Patented VoidLessTM Soldering Standard Die Attach vs
Sensitron’s Patented VoidLessTM Solder Process
Sensitron’s patented VoidLessTM
600V, 1200A Solder technique is used for
standard and large die, ensuring
the best possible connection of
power die to the baseplate. This
technique enhances power
dissipation and safe paralleling for
high power modules, and thermal modeling of power dissipation
maximizes current handling capacity and guarantees the high
SCP-5115I IGBT Half Bridge power capability.
© 2021 Sensitron Semiconductor. All rights reserved. 3
Product Overview
Sensitron GaN Power Bridge Modules GaN Power Bridge Modules
• More efficient than Si MOSFET based Modules
• Low RDSon
Efficient, High Power Density
• Fast ton and toff times (10X more than Si)
2" x 1” x .25"
• Integrated gate drive
• Low inductance enables the use of sub 10ns
switching speeds
• PWM frequencies up to 1Mhz reduces switching
power losses Green – Vout
Purple – PWM
• Smaller input and output filters Red - Current
Full Bridge IPM
Potential Applications
Rated at 200V, 25A, the
• Motor Drive: Max power density for both SPG025N020P2A is in a small
brushed and brushless DC drives package with high switching
• Motor Drive: High DV/DT can be an issue; Double pulse test, 220V @ 30A speeds to 1Mhz. Topside cooling
switching times can be customized SPG025N035P1B Top Switch to PCB with thermal interface
• DC-DC Converters: Can be combined or through solder castellations for
optimal performance.
customized to support any topology
1" x 0.66" x 0.14"
• DC-DC Converters: Integrated gate drive
simplifies implementation Rated at 300V, 20A, SPG025N035P1B
is in a small package with high
switching speeds at 500Khz. Topside
cooling allows for optimal thermal
performance.
Half Bridge IPM
3.6" 2" 1"
Si SiC GaN
GaN Technology allows for a significant package size reduction
© 2021 Sensitron Semiconductor. All rights reserved. 4
Product Overview
Sensitron High Voltage Power Capabilities 300VDC
•
•
CTE Matching = less thermal fatigue
High power density
500VDC
• Lowest possible thermal resistance
• Multiple Substrate options
• Ideal for higher reliability, high temperature GaN Based Half
applications Bridge Power Module
• Various package configurations and package styles Designed for high reliability,
(Direct Bond Cu, AlN or AlSiC) HVDC Contactor Controller high voltage applications,
Designed for high reliability this 300Vdc, 20A GaN Half
Potential Applications applications, this 500Vdc, Bridge Power Module
50A high voltage DC features an integrated gate
• High voltage electrical systems in: drive and optimized high
• Military aircraft contactor controller, when
joined with an external relay switching performance due
• E-VTOL platforms or contactor, creates a to minimized package
• Ground vehicles hybrid switch designed to inductance.
VIN
limits inrush currents to 40A
while also limiting voltage VDD
transients to 500V. Q1
VBST
EN
HIN
LIN Gate Drive
Q2 VOUT
High Voltage Capabilities DGND
PGND
New Product Showcase
Continued development using the latest wide band gap
600VDC Ultra-lightweight
Power Bridge Module
power switching devices (SiC and GaN) Designed in a lightweight,
low profile package, this
SiC and GaN Full SiC and GaN Half Custom design with 600Vdc, 75A IGBT module
your unique has high thermal
Bridge Module Bridge Module conductivity and fatigue
requirements resistance.
© 2021 Sensitron Semiconductor. All rights reserved. 5
Product Overview
Sensitron Dual Axis Motor Controller
• User supplied proprietary software
• Multiple comm ports RS485 (tactical + comm busses)
• High power density, very light weight
• Power Chip on Board (PCOB) technology
• Integrated heatsink/thermal sponge for transient
thermal performance
Applications
• Precision Military and Aerospace Control for:
• Actuator Servo Control
• Aileron and Fin Control
• Stabilization Control
• Flight Surface Actuator Control
• Thrust Vector Control
Dual Channel Motor Control
Dual Channel Digital BLDC Control
600V,75A
© 2021 Sensitron Semiconductor. All rights reserved. 6
Product Overview
Sensitron Lightning Strike Protection
• Tailored to 28V DC DO-160 Environments
Lightning Strike Protection
• Broad range of mounting provisions Rugged, Lightweight, High Power Density
• Varying levels of energy suppression capability
tailored to each application
• Proven solution for tough environments
• Available in thru-hole and SMT package types
• Products are immediately available through
Sensitron’s distributors
Applications High Power LSP Protection (Levels 4 & 5)
DO-160 Lightning Strike Protection for:
Ideal for 28V LSP applications, these high-
• Commercial Aviation power density modules are compliant to DO-160
• E-VTOL Section 22, Level 4 & Level 5 (Waveform 5A and
• UAV/UAS 5B). The LSP series is 100% production tested to
• Space, Marine, and Tactical Aircraft peak current 1600A (Level 5) and 750A (Level 4).
High Power TVS Module
The LSP28C-20K-37 is designed
to meet RTCA/DO-160G, Section
16, Category B, and protects the
aircraft power bus from lightning
strikes on windshield heater wires.
Rated at 20kA surge, and 100%
tested for clamping performance
to 1600A, 50/500 µs.
© 2021 Sensitron Semiconductor. All rights reserved. 7
Product Overview
Sensitron High Power Modules
• High power transient voltage protection devices
• Tailored to Mil-Std-1275 transient environments
• Allows the use of less hardened LRU’s or COTS
components in severe environments
• Protection of LRU’s & critical loads in mobile
applications
• Protects loads from load dumping and during jump
SCP-5282
starting Series
• Products are immediately available through Basic Vehicle System with TVS Protection
Sensitron’s distributors
TVS clamps for a 24V or 28V bus that can clamp below 40V, allowing
the use of less expensive COTS power supplies and equipment.
Potential Applications
• Military ground vehicles
• E-VTOL
• Mobile 24-28V DC Electrical Grids
Over Voltage Protection
Proven solutions for tough requirements!
Devices MIL-STD-1275 Transorb, SCP-5282 Series
MIL-STD-1275 SuperClamp™ , SCP-5282-9
Our latest design for the SuperClamp™
The SCP-5282-x series of Transorb TVS meets both MIL-STD-1275D/E and
(TVS) devices are 100% production ISO-16750-2 for injected surges and
tested to meet MIL-STD-1275D/E spikes.. The high-power module features
requirements while offering 28V precise clamping control, and clamps,
power system transient independent of temperature, to under 33V
protection, including load dump. at 100A or under 32V at 50A. The
Clamping remains below 50Vdc for SuperClamp TVS is 100% production
both 100V surges and 250V spikes. tested to single pulse of 100A for 100ms
© 2021 Sensitron Semiconductor. All rights reserved. 8
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